KR970003733A - Multichip Bonding Device - Google Patents

Multichip Bonding Device Download PDF

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Publication number
KR970003733A
KR970003733A KR1019950018514A KR19950018514A KR970003733A KR 970003733 A KR970003733 A KR 970003733A KR 1019950018514 A KR1019950018514 A KR 1019950018514A KR 19950018514 A KR19950018514 A KR 19950018514A KR 970003733 A KR970003733 A KR 970003733A
Authority
KR
South Korea
Prior art keywords
chips
chip
transferring
chip bonding
bonding apparatus
Prior art date
Application number
KR1019950018514A
Other languages
Korean (ko)
Inventor
김강산
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019950018514A priority Critical patent/KR970003733A/en
Publication of KR970003733A publication Critical patent/KR970003733A/en

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Abstract

본 발명은 멀티칩 본딩장치에 있어서, 특히 크기가 서로 상이한 복수개의 칩을 동일한 리드프레임 본드패드에 접착 가능토록 하기 위한 것으로, 서로 상이한 복수개의 칩을 배열한 IC 트레이를 좌우로 이송하는 이송테이블과, 각각의 칩에 대응하는 픽업유닛을 구비하고 적당한 회전을 통하여 이송테이블상의 일치점에서 칩을 가각 흡착하여 본딩지점으로 이송하는 본더헤드 어셈블리장치를 구비함을 특징으로 하는 멀티칩 본딩장치에 관한 것이다.In the multi-chip bonding apparatus, in particular, a plurality of chips of different sizes can be bonded to the same lead frame bond pad, and a transfer table for transferring the IC trays having a plurality of different chips arranged to the left and right; And a bond head assembly device having a pickup unit corresponding to each chip and each chip adsorbing chips at a matching point on the transfer table and transferring them to a bonding point through proper rotation.

Description

멀티칩 본딩장치Multichip Bonding Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명을 설명하기 위한 IC 트레이 및 리드프레임 본드패드 평면도, 제2도는 본 발명의 픽업부의 구성도.1 is a plan view of an IC tray and lead frame bond pad for explaining the present invention, and FIG. 2 is a block diagram of a pickup unit of the present invention.

Claims (2)

크기가 서로 상이한 복수개의 칩을 동일한 리드프레임 본드패드로 이송하여 접착하는 멀티칩 본딩장치에 있어서, 크기가 서로 상이한 복수개의 칩을 배열한 IC 트레이를 X축 및 Y축으로 이송하는 이송테이블과, 각각의 칩에 대응하는 픽업유닛을 구비하고 적당한 회전을 통하여 이송테이블상의 일치점에서 칩을 각각 흡착하여 본딩지점으로 이송하는 본더헤드 어셈블리장치를 포함하여 구성함을 특징으로 하는 멀티칩 본딩장치.A multi-chip bonding apparatus for transferring a plurality of chips of different sizes to the same lead frame bond pad, the multi-chip bonding apparatus comprising: a transfer table for transferring an IC tray in which a plurality of chips of different sizes are arranged on an X axis and a Y axis; And a bond head assembly device having a pickup unit corresponding to each chip and adapted to pick up chips at respective coincidence points on the transfer table and transfer the chips to the bonding point. 제1항에 있어서, 상기 본더 헤드 어셈블리장치는 설정된 좌표값에 따라 본드패드의 칩 접착부위로 픽업유닛에는 흡착된 칩을 안내하는 X-Y 테이블을 포함하여 구성함을 특징으로 하는 멀티칩 본딩장치.The multi-chip bonding apparatus according to claim 1, wherein the bonder head assembly includes an X-Y table for guiding the adsorbed chip to the chip bonding portion of the bond pad according to a set coordinate value. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950018514A 1995-06-30 1995-06-30 Multichip Bonding Device KR970003733A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950018514A KR970003733A (en) 1995-06-30 1995-06-30 Multichip Bonding Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950018514A KR970003733A (en) 1995-06-30 1995-06-30 Multichip Bonding Device

Publications (1)

Publication Number Publication Date
KR970003733A true KR970003733A (en) 1997-01-28

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ID=66526531

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950018514A KR970003733A (en) 1995-06-30 1995-06-30 Multichip Bonding Device

Country Status (1)

Country Link
KR (1) KR970003733A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100723589B1 (en) * 1999-05-28 2007-06-04 후지쯔 가부시끼가이샤 Head assembly, disk unit, and bonding method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100723589B1 (en) * 1999-05-28 2007-06-04 후지쯔 가부시끼가이샤 Head assembly, disk unit, and bonding method and apparatus

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