JPS5732587U - - Google Patents
Info
- Publication number
- JPS5732587U JPS5732587U JP10836580U JP10836580U JPS5732587U JP S5732587 U JPS5732587 U JP S5732587U JP 10836580 U JP10836580 U JP 10836580U JP 10836580 U JP10836580 U JP 10836580U JP S5732587 U JPS5732587 U JP S5732587U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Devices For Conveying Motion By Means Of Endless Flexible Members (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10836580U JPS5732587U (en) | 1980-08-01 | 1980-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10836580U JPS5732587U (en) | 1980-08-01 | 1980-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5732587U true JPS5732587U (en) | 1982-02-20 |
Family
ID=29469619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10836580U Pending JPS5732587U (en) | 1980-08-01 | 1980-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5732587U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5943591A (en) * | 1982-09-03 | 1984-03-10 | 松下電器産業株式会社 | Method of mounting metal base circuit board |
| JPS59128735U (en) * | 1983-02-17 | 1984-08-30 | 新日本無線株式会社 | Semiconductor chip bonding equipment |
-
1980
- 1980-08-01 JP JP10836580U patent/JPS5732587U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5943591A (en) * | 1982-09-03 | 1984-03-10 | 松下電器産業株式会社 | Method of mounting metal base circuit board |
| JPH0368625B2 (en) * | 1982-09-03 | 1991-10-29 | Matsushita Electric Ind Co Ltd | |
| JPS59128735U (en) * | 1983-02-17 | 1984-08-30 | 新日本無線株式会社 | Semiconductor chip bonding equipment |
| JPH027466Y2 (en) * | 1983-02-17 | 1990-02-22 |