JPS60118243U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS60118243U JPS60118243U JP412184U JP412184U JPS60118243U JP S60118243 U JPS60118243 U JP S60118243U JP 412184 U JP412184 U JP 412184U JP 412184 U JP412184 U JP 412184U JP S60118243 U JPS60118243 U JP S60118243U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- suspension lead
- frame
- semiconductor equipment
- tab suspension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来技術によるプラスチック封止ＩＣの斜視
図、第２図は、従来技術によるフレーム構造の平面図、
第３図イは、本考案の一実施例によるフレーム構造の平
面図、第３図口９ロ′は本考案によるタブ吊りリード部
の平面図及び側面図、第４図は、本考案によるフレーム
構造の平面図である。
１・・・チップ、３２・・・タブ、３・・・タブ吊りリ
ード、４・・・リードフレーム、５・・・金線、６・・
・レジン、７・・・一体化フレーム、８・・・単独タブ
、９・・・タブ吊りリード。FIG. 1 is a perspective view of a plastic-sealed IC according to the prior art, and FIG. 2 is a plan view of a frame structure according to the prior art.
FIG. 3A is a plan view of a frame structure according to an embodiment of the present invention, FIG. FIG. 3 is a plan view of the structure. 1... Chip, 32... Tab, 3... Tab hanging lead, 4... Lead frame, 5... Gold wire, 6...
・Resin, 7...Integrated frame, 8...Individual tab, 9...Tab suspension lead.
Claims (1)
りリード部に封止レンジと同一な温度係数を持つプラス
チックフィルムを使用し、タブは、予めタブ吊りリード
部に接着し、その後、タブ吊りリード部を一体化フレー
ムに接着して成るフレームを使用することを特徴とする
半導体装置。In the frame structure of a plastic-sealed IC, a plastic film with the same temperature coefficient as the sealing range is used for the tab suspension lead, and the tab is adhered to the tab suspension lead in advance, and then the tab suspension lead is integrated. A semiconductor device characterized by using a frame that is bonded to a chemical frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP412184U JPS60118243U (en) | 1984-01-18 | 1984-01-18 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP412184U JPS60118243U (en) | 1984-01-18 | 1984-01-18 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60118243U true JPS60118243U (en) | 1985-08-09 |
Family
ID=30479385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP412184U Pending JPS60118243U (en) | 1984-01-18 | 1984-01-18 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60118243U (en) |
-
1984
- 1984-01-18 JP JP412184U patent/JPS60118243U/en active Pending
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