JPS6016556U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6016556U
JPS6016556U JP1983195087U JP19508783U JPS6016556U JP S6016556 U JPS6016556 U JP S6016556U JP 1983195087 U JP1983195087 U JP 1983195087U JP 19508783 U JP19508783 U JP 19508783U JP S6016556 U JPS6016556 U JP S6016556U
Authority
JP
Japan
Prior art keywords
electrode
transistor element
outside
semiconductor equipment
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983195087U
Other languages
Japanese (ja)
Inventor
平井　敬一
肥後　慶樹
穴沢　信造
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1983195087U priority Critical patent/JPS6016556U/en
Publication of JPS6016556U publication Critical patent/JPS6016556U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の配線法によるトランジスタ装置の上から
見た図であり、第２図は本考案の一実施例を示すトラン
ジスタ装置の上から見た図である。 １．１９．２０・・・・・・コレクタリード電極、２゜
２１・・・・・・ベー゛スリード電極、３．２２．２４
゜１５・・・・・・エミッタリード電極、５．２７．２
８−・・・・・トランジスタ素子、６．　７．　３３．
　３４．　４１゜４２・・・・・・ボンディング線、４
・・・・・・容器、２９〜３２・・・・・・電極。FIG. 1 is a top view of a transistor device using a conventional wiring method, and FIG. 2 is a top view of a transistor device showing an embodiment of the present invention. 1.19.20... Collector lead electrode, 2゜21... Base lead electrode, 3.22.24
゜15...Emitter lead electrode, 5.27.2
8-...Transistor element, 6. 7. 33.
34. 41゜42...Bonding wire, 4
... Container, 29-32 ... Electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 入力電極と出力電極と共通電極とをそれぞれ備えた第１
および第２のトランジスタ素子と、該第１のトランジス
タ素子を載置して該第１のトランジスタ素子の出力電極
を外部に導出する第１の電極と、前記第２のトランジス
タ素子を載置して該第２のトランジスタ素子の出力電極
を外部に導出する第２の電極と、前記第１のトランジス
タ素子の入力電極を外部に導出する第３の電極と、前記
第２のトランジスタ素子の入力電極を外部に導出する第
４の電極と、前記第１および第２のトランジスタ素子の
共通電極を外部に導出する第５の電極とを単一の容器に
備え、前記第１、第２、第３、第４および第５の電極は
前記単一容器内部でほぼ同一平面を形成していることを
特徴とする半導体　　　　、装置。A first electrode comprising an input electrode, an output electrode, and a common electrode, respectively.
and a second transistor element, a first electrode on which the first transistor element is placed and an output electrode of the first transistor element is led to the outside, and a second transistor element on which the second transistor element is placed. a second electrode that leads the output electrode of the second transistor element to the outside; a third electrode that leads the input electrode of the first transistor element to the outside; and an input electrode of the second transistor element. A fourth electrode led out to the outside and a fifth electrode led out to the outside a common electrode of the first and second transistor elements are provided in a single container, and the first, second, third, A semiconductor device, wherein the fourth and fifth electrodes form substantially the same plane within the single container.
JP1983195087U 1983-12-19 1983-12-19 semiconductor equipment Pending JPS6016556U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983195087U JPS6016556U (en) 1983-12-19 1983-12-19 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983195087U JPS6016556U (en) 1983-12-19 1983-12-19 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6016556U true JPS6016556U (en) 1985-02-04

Family

ID=30419118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983195087U Pending JPS6016556U (en) 1983-12-19 1983-12-19 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6016556U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310686A (en) * 1987-06-12 1988-12-19 シャープ株式会社 Washing machine
JPH01103596U (en) * 1987-12-23 1989-07-13

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310686A (en) * 1987-06-12 1988-12-19 シャープ株式会社 Washing machine
JPH0477636B2 (en) * 1987-06-12 1992-12-08 Sharp Kk
JPH01103596U (en) * 1987-12-23 1989-07-13

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