JPS56164545A - Pellet bonding inspection and device therefor - Google Patents
Pellet bonding inspection and device thereforInfo
- Publication number
- JPS56164545A JPS56164545A JP6644680A JP6644680A JPS56164545A JP S56164545 A JPS56164545 A JP S56164545A JP 6644680 A JP6644680 A JP 6644680A JP 6644680 A JP6644680 A JP 6644680A JP S56164545 A JPS56164545 A JP S56164545A
- Authority
- JP
- Japan
- Prior art keywords
- marks
- molten metal
- sample
- light reflection
- detected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Abstract
PURPOSE:To judge and indicate the quality of bonding and to permit the automatization of inspection by detecting the marks of molten metal or protruded silver paste shown around a pellet by light reflection. CONSTITUTION:If a result is good, a sample 1 bonding a chip 3 on the tab 2 of a lead frame shows the marks of molten metal (or protruded silver paste section) 9 in all surroundigs. The sample 1 is placed on a semple base 4 and the amount of light reflection is measured and detected in each axis direction by a detector 6 movable in the X-axis and Y-axis direction. For example, if the marks 9 of molten metal exist, the amount of light reflection becomes small comparing with a metal plating surface 5 or a chip surface. The detected result is fed to a computer 7 and compared with previously memorized data and the sample detected the marks of molten metal 5 at least at three surroundings is indicated a a good one. In this way, inspection is simplified and automatization becomes possible.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6644680A JPS56164545A (en) | 1980-05-21 | 1980-05-21 | Pellet bonding inspection and device therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6644680A JPS56164545A (en) | 1980-05-21 | 1980-05-21 | Pellet bonding inspection and device therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56164545A true JPS56164545A (en) | 1981-12-17 |
Family
ID=13316001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6644680A Pending JPS56164545A (en) | 1980-05-21 | 1980-05-21 | Pellet bonding inspection and device therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56164545A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59128735U (en) * | 1983-02-17 | 1984-08-30 | 新日本無線株式会社 | Semiconductor chip bonding equipment |
JPS6018926A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Ltd | Pellet bonding apparatus |
JPS60227431A (en) * | 1984-04-26 | 1985-11-12 | Fujitsu Ltd | Inspecting device of die bonding state |
JPS6183038U (en) * | 1984-11-02 | 1986-06-02 | ||
EP0430095A2 (en) * | 1989-11-24 | 1991-06-05 | Kabushiki Kaisha Toshiba | Inner lead bonding inspecting method and inspection apparatus therefor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5368847A (en) * | 1976-12-01 | 1978-06-19 | Hitachi Ltd | Automatic appearance inspecting device |
JPS54109770A (en) * | 1978-02-16 | 1979-08-28 | Nec Corp | Mounting method of semiconductor device |
JPS5516201A (en) * | 1978-06-19 | 1980-02-04 | Nippon Keisoku Kogyo Kk | Detector for singular point of object |
-
1980
- 1980-05-21 JP JP6644680A patent/JPS56164545A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5368847A (en) * | 1976-12-01 | 1978-06-19 | Hitachi Ltd | Automatic appearance inspecting device |
JPS54109770A (en) * | 1978-02-16 | 1979-08-28 | Nec Corp | Mounting method of semiconductor device |
JPS5516201A (en) * | 1978-06-19 | 1980-02-04 | Nippon Keisoku Kogyo Kk | Detector for singular point of object |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59128735U (en) * | 1983-02-17 | 1984-08-30 | 新日本無線株式会社 | Semiconductor chip bonding equipment |
JPH027466Y2 (en) * | 1983-02-17 | 1990-02-22 | ||
JPS6018926A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Ltd | Pellet bonding apparatus |
JPH0566015B2 (en) * | 1983-07-13 | 1993-09-20 | Hitachi Ltd | |
JPS60227431A (en) * | 1984-04-26 | 1985-11-12 | Fujitsu Ltd | Inspecting device of die bonding state |
JPS6183038U (en) * | 1984-11-02 | 1986-06-02 | ||
JPH0217481Y2 (en) * | 1984-11-02 | 1990-05-16 | ||
EP0430095A2 (en) * | 1989-11-24 | 1991-06-05 | Kabushiki Kaisha Toshiba | Inner lead bonding inspecting method and inspection apparatus therefor |
US5331397A (en) * | 1989-11-24 | 1994-07-19 | Kabushiki Kaisha Toshiba | Inner lead bonding inspecting method and inspection apparatus therefor |
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