JPS56164545A - Pellet bonding inspection and device therefor - Google Patents

Pellet bonding inspection and device therefor

Info

Publication number
JPS56164545A
JPS56164545A JP6644680A JP6644680A JPS56164545A JP S56164545 A JPS56164545 A JP S56164545A JP 6644680 A JP6644680 A JP 6644680A JP 6644680 A JP6644680 A JP 6644680A JP S56164545 A JPS56164545 A JP S56164545A
Authority
JP
Japan
Prior art keywords
marks
molten metal
sample
light reflection
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6644680A
Other languages
Japanese (ja)
Inventor
Atsushi Onodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6644680A priority Critical patent/JPS56164545A/en
Publication of JPS56164545A publication Critical patent/JPS56164545A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To judge and indicate the quality of bonding and to permit the automatization of inspection by detecting the marks of molten metal or protruded silver paste shown around a pellet by light reflection. CONSTITUTION:If a result is good, a sample 1 bonding a chip 3 on the tab 2 of a lead frame shows the marks of molten metal (or protruded silver paste section) 9 in all surroundigs. The sample 1 is placed on a semple base 4 and the amount of light reflection is measured and detected in each axis direction by a detector 6 movable in the X-axis and Y-axis direction. For example, if the marks 9 of molten metal exist, the amount of light reflection becomes small comparing with a metal plating surface 5 or a chip surface. The detected result is fed to a computer 7 and compared with previously memorized data and the sample detected the marks of molten metal 5 at least at three surroundings is indicated a a good one. In this way, inspection is simplified and automatization becomes possible.
JP6644680A 1980-05-21 1980-05-21 Pellet bonding inspection and device therefor Pending JPS56164545A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6644680A JPS56164545A (en) 1980-05-21 1980-05-21 Pellet bonding inspection and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6644680A JPS56164545A (en) 1980-05-21 1980-05-21 Pellet bonding inspection and device therefor

Publications (1)

Publication Number Publication Date
JPS56164545A true JPS56164545A (en) 1981-12-17

Family

ID=13316001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6644680A Pending JPS56164545A (en) 1980-05-21 1980-05-21 Pellet bonding inspection and device therefor

Country Status (1)

Country Link
JP (1) JPS56164545A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59128735U (en) * 1983-02-17 1984-08-30 新日本無線株式会社 Semiconductor chip bonding equipment
JPS6018926A (en) * 1983-07-13 1985-01-31 Hitachi Ltd Pellet bonding apparatus
JPS60227431A (en) * 1984-04-26 1985-11-12 Fujitsu Ltd Inspecting device of die bonding state
JPS6183038U (en) * 1984-11-02 1986-06-02
EP0430095A2 (en) * 1989-11-24 1991-06-05 Kabushiki Kaisha Toshiba Inner lead bonding inspecting method and inspection apparatus therefor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368847A (en) * 1976-12-01 1978-06-19 Hitachi Ltd Automatic appearance inspecting device
JPS54109770A (en) * 1978-02-16 1979-08-28 Nec Corp Mounting method of semiconductor device
JPS5516201A (en) * 1978-06-19 1980-02-04 Nippon Keisoku Kogyo Kk Detector for singular point of object

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368847A (en) * 1976-12-01 1978-06-19 Hitachi Ltd Automatic appearance inspecting device
JPS54109770A (en) * 1978-02-16 1979-08-28 Nec Corp Mounting method of semiconductor device
JPS5516201A (en) * 1978-06-19 1980-02-04 Nippon Keisoku Kogyo Kk Detector for singular point of object

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59128735U (en) * 1983-02-17 1984-08-30 新日本無線株式会社 Semiconductor chip bonding equipment
JPH027466Y2 (en) * 1983-02-17 1990-02-22
JPS6018926A (en) * 1983-07-13 1985-01-31 Hitachi Ltd Pellet bonding apparatus
JPH0566015B2 (en) * 1983-07-13 1993-09-20 Hitachi Ltd
JPS60227431A (en) * 1984-04-26 1985-11-12 Fujitsu Ltd Inspecting device of die bonding state
JPS6183038U (en) * 1984-11-02 1986-06-02
JPH0217481Y2 (en) * 1984-11-02 1990-05-16
EP0430095A2 (en) * 1989-11-24 1991-06-05 Kabushiki Kaisha Toshiba Inner lead bonding inspecting method and inspection apparatus therefor
US5331397A (en) * 1989-11-24 1994-07-19 Kabushiki Kaisha Toshiba Inner lead bonding inspecting method and inspection apparatus therefor

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