JPS6183038U - - Google Patents

Info

Publication number
JPS6183038U
JPS6183038U JP16727384U JP16727384U JPS6183038U JP S6183038 U JPS6183038 U JP S6183038U JP 16727384 U JP16727384 U JP 16727384U JP 16727384 U JP16727384 U JP 16727384U JP S6183038 U JPS6183038 U JP S6183038U
Authority
JP
Japan
Prior art keywords
substrate
moving
pellet
mounting area
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16727384U
Other languages
Japanese (ja)
Other versions
JPH0217481Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984167273U priority Critical patent/JPH0217481Y2/ja
Publication of JPS6183038U publication Critical patent/JPS6183038U/ja
Application granted granted Critical
Publication of JPH0217481Y2 publication Critical patent/JPH0217481Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例にかかる半導体ペレツ
トのダイボンデイング装置の概略構成図、第２図
はペレツトマウント手段を示す斜視図、第３図は
ペレツト除去手段の要部を示す拡大側面図である
。 図中、符号３は半導体ペレツト、４はコレツト
、６はローデイング台、７は基板、８はフレーム
、９はカメラ、１０は吸引ノズル。 FIG. 1 is a schematic configuration diagram of a die bonding apparatus for semiconductor pellets according to an embodiment of the present invention, FIG. 2 is a perspective view showing pellet mounting means, and FIG. 3 is an enlarged side view showing essential parts of pellet removing means. It is. In the figure, numeral 3 is a semiconductor pellet, 4 is a collector, 6 is a loading table, 7 is a substrate, 8 is a frame, 9 is a camera, and 10 is a suction nozzle.

Claims (1)

【実用新案登録請求の範囲】 半導体ペレツト３をコレツト４で吸着支持して
ローデイング台６に装備されたフレーム８の基板
７上に供給するペレツトマウント手段と、 基板７上にマウントされた半導体ペレツト３の
装填状態をカメラ９で監視する手段と、 ローデイング台６をマウント部位とこれから外
れた部位との間で移動させる手段と、 マウント部位外方に移動された基板７上方にお
いて吸引ノズル１０を上下動させるペレツト除去
手段と、 を具備してなる半導体ペレツトのダイボンデイン
グ装置。[Claims for Utility Model Registration] Pellet mounting means for sucking and supporting semiconductor pellets 3 with a collet 4 and supplying them onto a substrate 7 of a frame 8 installed on a loading table 6; and a semiconductor pellet mounted on the substrate 7. means for monitoring the loading state of the substrate 3 with a camera 9; means for moving the loading table 6 between the mounting area and the area removed from the mounting area; and means for moving the suction nozzle 10 up and down above the substrate 7 which has been moved outside the mounting area. A die bonding device for semiconductor pellets, comprising: a pellet removing means for moving the pellets;
JP1984167273U 1984-11-02 1984-11-02 Expired JPH0217481Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984167273U JPH0217481Y2 (en) 1984-11-02 1984-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984167273U JPH0217481Y2 (en) 1984-11-02 1984-11-02

Publications (2)

Publication Number Publication Date
JPS6183038U true JPS6183038U (en) 1986-06-02
JPH0217481Y2 JPH0217481Y2 (en) 1990-05-16

Family

ID=30725074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984167273U Expired JPH0217481Y2 (en) 1984-11-02 1984-11-02

Country Status (1)

Country Link
JP (1) JPH0217481Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5715429A (en) * 1980-07-02 1982-01-26 Hitachi Ltd Apparatus for mounting pellet
JPS57173339U (en) * 1981-04-28 1982-11-01

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5715429A (en) * 1980-07-02 1982-01-26 Hitachi Ltd Apparatus for mounting pellet
JPS57173339U (en) * 1981-04-28 1982-11-01

Also Published As

Publication number Publication date
JPH0217481Y2 (en) 1990-05-16

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