JPS62107450U - - Google Patents

Info

Publication number
JPS62107450U
JPS62107450U JP19918785U JP19918785U JPS62107450U JP S62107450 U JPS62107450 U JP S62107450U JP 19918785 U JP19918785 U JP 19918785U JP 19918785 U JP19918785 U JP 19918785U JP S62107450 U JPS62107450 U JP S62107450U
Authority
JP
Japan
Prior art keywords
carrier unit
bonding
package
pedestal
raised
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19918785U
Other languages
Japanese (ja)
Other versions
JPH0230839Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985199187U priority Critical patent/JPH0230839Y2/ja
Publication of JPS62107450U publication Critical patent/JPS62107450U/ja
Application granted granted Critical
Publication of JPH0230839Y2 publication Critical patent/JPH0230839Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す要部の断面図
、第２図は本考案の他の実施例を示す要部の断面
図、第３図はボンデイング装置の従来例を示す断
面図である。 １……ＸＹテーブル、２……パツケージトレー
、３……パツケージ、４……ローダ、５……走行
路、６……キヤリアユニツト、７……パターン認
識カメラ、８……ボンデイングステーシヨン、９
……受台、１０……ボンデイングヘツド、１１…
…アンローダ、１２……ＸＹテーブル、１３……
パツケージトレー、１６……貫通口、１７……位
置修正爪、１８……プレヒータ、１９……受台。 Fig. 1 is a sectional view of the main parts showing one embodiment of the present invention, Fig. 2 is a sectional view of the main parts showing another embodiment of the invention, and Fig. 3 is a sectional view showing a conventional example of the bonding device. It is. 1... XY table, 2... Package tray, 3... Package, 4... Loader, 5... Running path, 6... Carrier unit, 7... Pattern recognition camera, 8... Bonding station, 9
...cradle, 10...bonding head, 11...
...Unloader, 12...XY table, 13...
Package tray, 16...through hole, 17...position correction claw, 18...preheater, 19...cradle.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージを載置してボンデイングステーシヨ
ンへ搬送するキヤリアユニツトを配備したボンデ
イング装置において、前記キヤリアユニツトの底
部に前記ボンデイングステーシヨンで昇降する受
台が貫通する貫通口を設け、前記受台が上昇して
前記キヤリアユニツトから前記パツケージを分離
して支持することができるように構成したことを
特徴とするボンデイング装置。 In a bonding apparatus equipped with a carrier unit for placing a package and transporting it to a bonding station, a through hole is provided at the bottom of the carrier unit through which a pedestal that is raised and lowered by the bonding station passes through, and the pedestal is raised and A bonding device characterized in that the package is configured to be able to be supported separately from a carrier unit.
JP1985199187U 1985-12-26 1985-12-26 Expired JPH0230839Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985199187U JPH0230839Y2 (en) 1985-12-26 1985-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985199187U JPH0230839Y2 (en) 1985-12-26 1985-12-26

Publications (2)

Publication Number Publication Date
JPS62107450U true JPS62107450U (en) 1987-07-09
JPH0230839Y2 JPH0230839Y2 (en) 1990-08-20

Family

ID=31160573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985199187U Expired JPH0230839Y2 (en) 1985-12-26 1985-12-26

Country Status (1)

Country Link
JP (1) JPH0230839Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus
JPS57186033U (en) * 1981-05-20 1982-11-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus
JPS57186033U (en) * 1981-05-20 1982-11-26

Also Published As

Publication number Publication date
JPH0230839Y2 (en) 1990-08-20

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