JPS6327044U - - Google Patents

Info

Publication number
JPS6327044U
JPS6327044U JP12120986U JP12120986U JPS6327044U JP S6327044 U JPS6327044 U JP S6327044U JP 12120986 U JP12120986 U JP 12120986U JP 12120986 U JP12120986 U JP 12120986U JP S6327044 U JPS6327044 U JP S6327044U
Authority
JP
Japan
Prior art keywords
lead frame
lead
mount
block
heat block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12120986U
Other languages
Japanese (ja)
Other versions
JPH0244520Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986121209U priority Critical patent/JPH0244520Y2/ja
Publication of JPS6327044U publication Critical patent/JPS6327044U/ja
Application granted granted Critical
Publication of JPH0244520Y2 publication Critical patent/JPH0244520Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案装置の略示正面図である。第２
図Ａは従来装置の略示平面図、第２図Ｂは従来装
置におけるリードフレームの不良固着状態の説明
図である。 １０……ヒートブロツク、１０ａ……リード部
支持ブロツク、１０ｂ……マウント部支持ブロツ
ク、１１ａ……リード部、１１ｂ……ペレツトマ
ウント部、１４ａ，１４ｂ……押え板、１５ａ，
１５ｂ……上下動装置。 FIG. 1 is a schematic front view of the device of the present invention. Second
FIG. 2A is a schematic plan view of a conventional device, and FIG. 2B is an explanatory diagram of a defective fixed state of a lead frame in the conventional device. 10...Heat block, 10a...Lead part support block, 10b...Mount part support block, 11a...Lead part, 11b...Pellet mount part, 14a, 14b...Press plate, 15a,
15b...Vertical movement device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 押え板にてヒートブロツク上に押圧されたリー
ドフレームとリードフレーム上に固定された半導
体ペレツトとをワイヤにて接続するものに於いて
、前記ヒートブロツクをリードフレームのリード
部を支持するリード支持ブロツクとペレツトマウ
ント部を支持するマウント部支持ブロツクとに分
割し、これらの支持ブロツクの少なくとも一方を
上下動可能に構成したことを特徴とするワイヤボ
ンダ。 In a device in which a lead frame pressed onto a heat block by a holding plate and a semiconductor pellet fixed on the lead frame are connected by wire, the heat block is connected to a lead support block that supports the lead portion of the lead frame. and a mount support block for supporting a pellet mount, and at least one of these support blocks is configured to be movable up and down.
JP1986121209U 1986-08-07 1986-08-07 Expired JPH0244520Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986121209U JPH0244520Y2 (en) 1986-08-07 1986-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986121209U JPH0244520Y2 (en) 1986-08-07 1986-08-07

Publications (2)

Publication Number Publication Date
JPS6327044U true JPS6327044U (en) 1988-02-22
JPH0244520Y2 JPH0244520Y2 (en) 1990-11-27

Family

ID=31010263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986121209U Expired JPH0244520Y2 (en) 1986-08-07 1986-08-07

Country Status (1)

Country Link
JP (1) JPH0244520Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012654A (en) * 1996-06-27 1998-01-16 Nec Yamaguchi Ltd Bonding apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291039A (en) * 1986-06-10 1987-12-17 Shinkawa Ltd Bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291039A (en) * 1986-06-10 1987-12-17 Shinkawa Ltd Bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012654A (en) * 1996-06-27 1998-01-16 Nec Yamaguchi Ltd Bonding apparatus

Also Published As

Publication number Publication date
JPH0244520Y2 (en) 1990-11-27

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