JPS63100831U - - Google Patents

Info

Publication number
JPS63100831U
JPS63100831U JP19565286U JP19565286U JPS63100831U JP S63100831 U JPS63100831 U JP S63100831U JP 19565286 U JP19565286 U JP 19565286U JP 19565286 U JP19565286 U JP 19565286U JP S63100831 U JPS63100831 U JP S63100831U
Authority
JP
Japan
Prior art keywords
lead frame
frame holder
holder
mounter
contact part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19565286U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19565286U priority Critical patent/JPS63100831U/ja
Publication of JPS63100831U publication Critical patent/JPS63100831U/ja
Pending legal-status Critical Current

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  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のリードフレーム押え部の断面
図、第２図は従来のリードフレーム押え部の断面
図である。 １……リードフレーム、２……ヒーターブロツ
ク、３……ソルダー、４……アイランド、５……
位置決めピン、６……リードフレーム押え（ＳＵ
Ｓ）、７……リードフレーム押えの接触部、８…
…ペレツト、９……コレツト。 FIG. 1 is a sectional view of a lead frame holding part of the present invention, and FIG. 2 is a sectional view of a conventional lead frame holding part. 1...Lead frame, 2...Heater block, 3...Solder, 4...Island, 5...
Positioning pin, 6...Lead frame holder (SU
S), 7...Contact part of lead frame holder, 8...
...Pellet, 9...Collect.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ソルダーをリードフレーム上に供給して半導体
ペレツトをマウントするマウンター装置において
、位置決めされたリードフレームを圧下するリー
ドフレーム押えの接触部を熱伝導性の低い断熱材
にて構成したことを特徴とするマウンター装置用
リードフレーム押え。 A mounter for mounting a semiconductor pellet by supplying solder onto a lead frame, characterized in that the contact part of a lead frame holder that presses down a positioned lead frame is made of a heat insulating material with low thermal conductivity. Lead frame holder for equipment.
JP19565286U 1986-12-19 1986-12-19 Pending JPS63100831U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19565286U JPS63100831U (en) 1986-12-19 1986-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19565286U JPS63100831U (en) 1986-12-19 1986-12-19

Publications (1)

Publication Number Publication Date
JPS63100831U true JPS63100831U (en) 1988-06-30

Family

ID=31153732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19565286U Pending JPS63100831U (en) 1986-12-19 1986-12-19

Country Status (1)

Country Link
JP (1) JPS63100831U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124976A (en) * 1973-04-02 1974-11-29
JPS60262431A (en) * 1984-06-11 1985-12-25 Toshiba Corp Assembling system of semiconductor device
JPS6119051A (en) * 1984-07-06 1986-01-27 近藤シルバニア株式会社 Medical reflecting mirror halogen bulb

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124976A (en) * 1973-04-02 1974-11-29
JPS60262431A (en) * 1984-06-11 1985-12-25 Toshiba Corp Assembling system of semiconductor device
JPS6119051A (en) * 1984-07-06 1986-01-27 近藤シルバニア株式会社 Medical reflecting mirror halogen bulb

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