JPH02142534U - - Google Patents
Info
- Publication number
- JPH02142534U JPH02142534U JP1033589U JP1033589U JPH02142534U JP H02142534 U JPH02142534 U JP H02142534U JP 1033589 U JP1033589 U JP 1033589U JP 1033589 U JP1033589 U JP 1033589U JP H02142534 U JPH02142534 U JP H02142534U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- wafer
- heater rail
- rail
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図はこの考案に係るヒータレール、冷却ブ
ロツクとウエーハ保持リングの側面図（一部断面
図）であり、第２図Ａ，Ｂは冷却ブロツクの平面
図と一部を断面で示した正面図である。第３図は
従来のヒータレール、ウエーハ保持リングの側面
図（一部断面図）である。
１……ヒータレール、２……ウエーハ保持リン
グ、３……ペレツト、４……吸着用コレツト、５
……リードフレーム、６……カバー、７，１１，
１４……断熱板、８……脚、９……ベース板、１
０……リングホルダ、１２……粘着テープ、１３
……冷却ブロツク、１５，１６……給気パイプ、
１７……排気パイプ。
Fig. 1 is a side view (partially sectional view) of the heater rail, cooling block, and wafer holding ring according to this invention, and Figs. 2A and B are a front view showing a plan view and a partially sectional view of the cooling block. It is a diagram. FIG. 3 is a side view (partially sectional view) of a conventional heater rail and wafer holding ring. 1... Heater rail, 2... Wafer holding ring, 3... Pellet, 4... Adsorption collector, 5
...Lead frame, 6...Cover, 7, 11,
14...Insulation board, 8...Legs, 9...Base board, 1
0...Ring holder, 12...Adhesive tape, 13
...Cooling block, 15,16...Air supply pipe,
17...Exhaust pipe.
Claims (1)
ーハより、各々のペレツトをピツクアツプして、
ヒータレール上に載置したリードフレーム上に、
接着部材を介して乗せ加熱固着させるダイボンダ
について、 上記ヒータレールは、その下方に冷却ブロツク
を配置するとともに、ペレツトウエーハを保持し
ているウエーハ保持リングの上部に近接配置させ
たことを特徴とするダイボンダ用ヒータレール。[Scope of claim for utility model registration] Picking up each pellet from a pellet wafer that has been divided into individual pellets,
On the lead frame placed on the heater rail,
For a die bonder in which a pellet wafer is mounted and fixed by heating through an adhesive member, the heater rail is characterized in that a cooling block is arranged below the heater rail, and the pellet wafer is arranged close to the upper part of a wafer holding ring holding a pellet wafer. heater rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989010335U JPH0729635Y2 (en) | 1989-01-30 | 1989-01-30 | Die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989010335U JPH0729635Y2 (en) | 1989-01-30 | 1989-01-30 | Die bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02142534U true JPH02142534U (en) | 1990-12-04 |
| JPH0729635Y2 JPH0729635Y2 (en) | 1995-07-05 |
Family
ID=31513908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989010335U Expired - Lifetime JPH0729635Y2 (en) | 1989-01-30 | 1989-01-30 | Die bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729635Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512746A (en) * | 1978-07-12 | 1980-01-29 | Matsushita Electronics Corp | Semiconductor base plate joining device |
| JPS60211853A (en) * | 1984-04-05 | 1985-10-24 | Nec Kansai Ltd | Mounting device for semiconductor pellet |
-
1989
- 1989-01-30 JP JP1989010335U patent/JPH0729635Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512746A (en) * | 1978-07-12 | 1980-01-29 | Matsushita Electronics Corp | Semiconductor base plate joining device |
| JPS60211853A (en) * | 1984-04-05 | 1985-10-24 | Nec Kansai Ltd | Mounting device for semiconductor pellet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729635Y2 (en) | 1995-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |