JPH044745U - - Google Patents
Info
- Publication number
- JPH044745U JPH044745U JP4539290U JP4539290U JPH044745U JP H044745 U JPH044745 U JP H044745U JP 4539290 U JP4539290 U JP 4539290U JP 4539290 U JP4539290 U JP 4539290U JP H044745 U JPH044745 U JP H044745U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- lead frame
- conveyance path
- semiconductor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Description
第１図乃至第７図は本考案に係るマウンタの実
施例を説明するためのもので、第１図はリードフ
レーム搬送路上のリードフレーム、ノズル及びコ
レツトを示す断面図、第２図は第１図の平面図、
第３図乃至第５図は第１図のノズル及びコレツト
の動作状態を示す各断面図、第３図は半導体ペレ
ツトの載置位置をずらした状態を示す部分拡大平
面図、第７図はリードフレーム搬送路のペレツト
マウント位置でのキヤピラリを示す断面図である
。第８図は半導体装置の製造工程の一部を示すブ
ロツク図、第９図及び第１０図は従来のマウンタ
でのリードフレーム搬送路上のリードフレーム、
ノズル及びコレツトの動作状態を示す各断面図、
第１１図はボンダでのリードフレーム搬送路上の
リードフレーム及びキヤピラリを示す断面図であ
る。
１１……リードフレーム搬送路、１２……ペレ
ツト供給手段、１３……接着材供給手段、１４…
…ペレツト搭載部、１６……リードフレーム、１
７……貫通孔、１８……半導体ペレツト、１９…
…コレツト、２１……接着材、２２……ノズル、
Ｐ０……ペレツトマウント位置。
1 to 7 are for explaining an embodiment of the mounter according to the present invention. Top view of the figure,
Figures 3 to 5 are cross-sectional views showing the operating states of the nozzle and collect in Figure 1, Figure 3 is a partially enlarged plan view showing the state in which the semiconductor pellet is placed in a shifted position, and Figure 7 is a lead. FIG. 3 is a cross-sectional view showing the capillary at the pellet mounting position of the frame conveyance path. FIG. 8 is a block diagram showing a part of the manufacturing process of a semiconductor device, and FIGS. 9 and 10 show lead frames on a lead frame conveyance path in a conventional mounter.
Each cross-sectional view showing the operating state of the nozzle and collector,
FIG. 11 is a sectional view showing a lead frame and a capillary on a lead frame transport path in a bonder. DESCRIPTION OF SYMBOLS 11... Lead frame conveyance path, 12... Pellet supply means, 13... Adhesive material supply means, 14...
...Pellet loading section, 16...Lead frame, 1
7...Through hole, 18...Semiconductor pellet, 19...
...Collection, 21...Adhesive, 22...Nozzle,
P0 ...Pellet mount position.
Claims (1)
ームを移送するリードフレーム搬送路のペレツト
マウント位置の上方で上下動自在に配設されたコ
レツトにより半導体ペレツトを吸着保持してリー
ドフレームのペレツト搭載部に位置決め載置する
ペレツト供給手段と、 リードフレーム搬送路のペレツトマウント位置
の下方で上下動自在に配設され上記リードフレー
ムの貫通孔に挿通されて突出退入するノズルによ
り半導体ペレツトの裏面に接着材を塗着する接着
材供給手段とを具備したことを特徴とするマウン
タ。[Scope of Claim for Utility Model Registration] Semiconductor pellets are sucked and held by a collet that is movable up and down above the pellet mount position of the lead frame conveyance path that transports the lead frame that is drilled in a through hole in the pellet loading section. and a pellet supply means for positioning and placing the pellets on the pellet mounting portion of the lead frame; and a pellet feeding means arranged to be movable up and down below the pellet mount position of the lead frame conveyance path, and inserted into the through hole of the lead frame to protrude and retract. 1. An adhesive supplying means for applying an adhesive to the back surface of a semiconductor pellet using a nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4539290U JPH044745U (en) | 1990-04-26 | 1990-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4539290U JPH044745U (en) | 1990-04-26 | 1990-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044745U true JPH044745U (en) | 1992-01-16 |
Family
ID=31559528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4539290U Pending JPH044745U (en) | 1990-04-26 | 1990-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044745U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60139590U (en) * | 1984-02-28 | 1985-09-14 | 大阪グリツプ化工株式会社 | handle grip |
-
1990
- 1990-04-26 JP JP4539290U patent/JPH044745U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60139590U (en) * | 1984-02-28 | 1985-09-14 | 大阪グリツプ化工株式会社 | handle grip |
| JPH0310141Y2 (en) * | 1984-02-28 | 1991-03-13 |
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