JPS6048240U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS6048240U JPS6048240U JP13916883U JP13916883U JPS6048240U JP S6048240 U JPS6048240 U JP S6048240U JP 13916883 U JP13916883 U JP 13916883U JP 13916883 U JP13916883 U JP 13916883U JP S6048240 U JPS6048240 U JP S6048240U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wire bonding
- semiconductor device
- encapsulated semiconductor
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図は本考案の一実施例のレジンモールド素子中の半導体
チップ構造の平面図である。
１・・・・・・半導体チップ、２ａ、２ｂ・・・・・・
ワイヤポンディング部、３ａ、３ｂ、３ｃ・・・・・・
ＡＩライン、４・・・・・・パッシベーション膜（斜線
部）、５・・・・・・Ａ１ライン対向部のパッシベーシ
ョン除去部。The figure is a plan view of a semiconductor chip structure in a resin molded element according to an embodiment of the present invention. 1...Semiconductor chip, 2a, 2b...
Wire bonding part, 3a, 3b, 3c...
AI line, 4... Passivation film (shaded area), 5... Passivation removed portion of the area opposite to A1 line.
Claims (1)
隣接するワイヤポンディング部よりＡ１ラインを出し合
い、これを対向させて位置させたＡＩパターンを有し、
その上に上記ワイヤポンディング部および上記Ａ１ライ
ン対向部の一部または全部を除いてパッシベーション膜
を被覆し、その後ワイヤホンデインク、樹脂封止工程を
経て完成することを特徴とする樹脂封止半導体素子。In a semiconductor chip that performs wiring using AI, it has an AI pattern in which A1 lines are brought out from adjacent wire bonding parts and are positioned facing each other,
A resin-sealed semiconductor characterized in that a passivation film is coated thereon except for part or all of the wire bonding part and the A1 line opposing part, and then a wire bonding and resin sealing process is performed to complete the resin-sealed semiconductor. element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13916883U JPS6048240U (en) | 1983-09-09 | 1983-09-09 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13916883U JPS6048240U (en) | 1983-09-09 | 1983-09-09 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6048240U true JPS6048240U (en) | 1985-04-04 |
Family
ID=30312017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13916883U Pending JPS6048240U (en) | 1983-09-09 | 1983-09-09 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6048240U (en) |
-
1983
- 1983-09-09 JP JP13916883U patent/JPS6048240U/en active Pending
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