JPS6013737U - - Google Patents

Info

Publication number
JPS6013737U
JPS6013737U JP10612283U JP10612283U JPS6013737U JP S6013737 U JPS6013737 U JP S6013737U JP 10612283 U JP10612283 U JP 10612283U JP 10612283 U JP10612283 U JP 10612283U JP S6013737 U JPS6013737 U JP S6013737U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10612283U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10612283U priority Critical patent/JPS6013737U/ja
Publication of JPS6013737U publication Critical patent/JPS6013737U/ja
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
JP10612283U 1983-07-08 1983-07-08 Pending JPS6013737U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10612283U JPS6013737U (en) 1983-07-08 1983-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10612283U JPS6013737U (en) 1983-07-08 1983-07-08

Publications (1)

Publication Number Publication Date
JPS6013737U true JPS6013737U (en) 1985-01-30

Family

ID=30248471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10612283U Pending JPS6013737U (en) 1983-07-08 1983-07-08

Country Status (1)

Country Link
JP (1) JPS6013737U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011527113A (en) * 2008-06-30 2011-10-20 クゥアルコム・インコーポレイテッドQualcomm Incorporated Bridged interconnection of through-silicon vias
JP2014078760A (en) * 2014-02-03 2014-05-01 Fujitsu Ltd Multichip module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011527113A (en) * 2008-06-30 2011-10-20 クゥアルコム・インコーポレイテッドQualcomm Incorporated Bridged interconnection of through-silicon vias
JP2013175772A (en) * 2008-06-30 2013-09-05 Qualcomm Inc Through silicon via bridge interconnect
JP2014078760A (en) * 2014-02-03 2014-05-01 Fujitsu Ltd Multichip module

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