JPS592155U - Resin-encapsulated integrated circuit - Google Patents

Resin-encapsulated integrated circuit

Info

Publication number
JPS592155U
JPS592155U JP1982097581U JP9758182U JPS592155U JP S592155 U JPS592155 U JP S592155U JP 1982097581 U JP1982097581 U JP 1982097581U JP 9758182 U JP9758182 U JP 9758182U JP S592155 U JPS592155 U JP S592155U
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
encapsulated integrated
circuit
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982097581U
Other languages
Japanese (ja)
Other versions
JPS635250Y2 (en
Inventor
幸仁 池田
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982097581U priority Critical patent/JPS592155U/en
Publication of JPS592155U publication Critical patent/JPS592155U/en
Application granted granted Critical
Publication of JPS635250Y2 publication Critical patent/JPS635250Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の小形樹脂封止集積回路（ミニフラットパ
ッケージタイプ）の断面図、第２図は本考案の実施例断
面図、である。 なお図において、１・・・集積回路チップ、２・・・樹
脂、３・・・外部リード、４・・・ボンディングワイヤ
、である。FIG. 1 is a sectional view of a conventional small resin-sealed integrated circuit (mini flat package type), and FIG. 2 is a sectional view of an embodiment of the present invention. In the figure, 1... integrated circuit chip, 2... resin, 3... external lead, 4... bonding wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂封止形の高密度実装用小形集積回路において、パッ
ケージ裏の周辺部を中心部にくらべ厚く・　　　し、チ
ップよりホンディングワイヤにより接続された外部リー
ドをパッケージ内にて垂直に曲げ、パッケージ裏の周辺
部の下方側面よりリードが取り出せる様に樹脂でモール
ドしたことを特徴とする樹脂封止集積回路。In resin-sealed small integrated circuits for high-density packaging, the periphery of the back of the package is made thicker than the center, and the external leads connected from the chip by bonding wires are bent vertically within the package. A resin-sealed integrated circuit characterized in that the circuit is molded with resin so that the leads can be taken out from the lower side of the periphery of the circuit.
JP1982097581U 1982-06-29 1982-06-29 Resin-encapsulated integrated circuit Granted JPS592155U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982097581U JPS592155U (en) 1982-06-29 1982-06-29 Resin-encapsulated integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982097581U JPS592155U (en) 1982-06-29 1982-06-29 Resin-encapsulated integrated circuit

Publications (2)

Publication Number Publication Date
JPS592155U true JPS592155U (en) 1984-01-09
JPS635250Y2 JPS635250Y2 (en) 1988-02-12

Family

ID=30232052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982097581U Granted JPS592155U (en) 1982-06-29 1982-06-29 Resin-encapsulated integrated circuit

Country Status (1)

Country Link
JP (1) JPS592155U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012009610A (en) * 2010-06-24 2012-01-12 Mitsubishi Electric Corp Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659A (en) * 1977-07-05 1979-02-03 Matsushita Electric Ind Co Ltd Astable multivibrator
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659A (en) * 1977-07-05 1979-02-03 Matsushita Electric Ind Co Ltd Astable multivibrator
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012009610A (en) * 2010-06-24 2012-01-12 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPS635250Y2 (en) 1988-02-12

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