JPS592155U - Resin-encapsulated integrated circuit - Google Patents
Resin-encapsulated integrated circuitInfo
- Publication number
- JPS592155U JPS592155U JP1982097581U JP9758182U JPS592155U JP S592155 U JPS592155 U JP S592155U JP 1982097581 U JP1982097581 U JP 1982097581U JP 9758182 U JP9758182 U JP 9758182U JP S592155 U JPS592155 U JP S592155U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- integrated circuit
- encapsulated integrated
- circuit
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の小形樹脂封止集積回路(ミニフラットパ
ッケージタイプ)の断面図、第2図は本考案の実施例断
面図、である。
なお図において、1・・・集積回路チップ、2・・・樹
脂、3・・・外部リード、4・・・ボンディングワイヤ
、である。FIG. 1 is a sectional view of a conventional small resin-sealed integrated circuit (mini flat package type), and FIG. 2 is a sectional view of an embodiment of the present invention. In the figure, 1... integrated circuit chip, 2... resin, 3... external lead, 4... bonding wire.
Claims (1)
ケージ裏の周辺部を中心部にくらべ厚く・ し、チ
ップよりホンディングワイヤにより接続された外部リー
ドをパッケージ内にて垂直に曲げ、パッケージ裏の周辺
部の下方側面よりリードが取り出せる様に樹脂でモール
ドしたことを特徴とする樹脂封止集積回路。In resin-sealed small integrated circuits for high-density packaging, the periphery of the back of the package is made thicker than the center, and the external leads connected from the chip by bonding wires are bent vertically within the package. A resin-sealed integrated circuit characterized in that the circuit is molded with resin so that the leads can be taken out from the lower side of the periphery of the circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982097581U JPS592155U (en) | 1982-06-29 | 1982-06-29 | Resin-encapsulated integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982097581U JPS592155U (en) | 1982-06-29 | 1982-06-29 | Resin-encapsulated integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS592155U true JPS592155U (en) | 1984-01-09 |
JPS635250Y2 JPS635250Y2 (en) | 1988-02-12 |
Family
ID=30232052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982097581U Granted JPS592155U (en) | 1982-06-29 | 1982-06-29 | Resin-encapsulated integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS592155U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009610A (en) * | 2010-06-24 | 2012-01-12 | Mitsubishi Electric Corp | Semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5414659A (en) * | 1977-07-05 | 1979-02-03 | Matsushita Electric Ind Co Ltd | Astable multivibrator |
JPS57176751A (en) * | 1981-04-22 | 1982-10-30 | Toshiba Corp | Semiconductor device |
-
1982
- 1982-06-29 JP JP1982097581U patent/JPS592155U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5414659A (en) * | 1977-07-05 | 1979-02-03 | Matsushita Electric Ind Co Ltd | Astable multivibrator |
JPS57176751A (en) * | 1981-04-22 | 1982-10-30 | Toshiba Corp | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009610A (en) * | 2010-06-24 | 2012-01-12 | Mitsubishi Electric Corp | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS635250Y2 (en) | 1988-02-12 |
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