JPS5899842U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5899842U
JPS5899842U JP1981193664U JP19366481U JPS5899842U JP S5899842 U JPS5899842 U JP S5899842U JP 1981193664 U JP1981193664 U JP 1981193664U JP 19366481 U JP19366481 U JP 19366481U JP S5899842 U JPS5899842 U JP S5899842U
Authority
JP
Japan
Prior art keywords
semiconductor chip
metal wire
semiconductor equipment
thermoplastic resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981193664U
Other languages
Japanese (ja)
Inventor
薗　陸郎
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1981193664U priority Critical patent/JPS5899842U/en
Publication of JPS5899842U publication Critical patent/JPS5899842U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例の平面図、第２図は本考案の実
施例の側断面図である。 図において、１は半導体チップ、２は基板、３はり−・
ド端子、４はボンデイングワイ゛ヤー、５は気泡を含む
熱可塑性樹脂による包囲体、６はパッケージを示す。FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a side sectional view of the embodiment of the present invention. In the figure, 1 is a semiconductor chip, 2 is a substrate, 3 is a beam...
4 is a bonding wire, 5 is an enclosure made of thermoplastic resin containing air bubbles, and 6 is a package.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップとリード端子とが金属線により接続され、
該半導体チップ、該金属線及び該１月−ビードの一部が
樹脂にて成形されてなる半導体装置において、該半導体
チップ、該金属線及び該リードｉ子の該金属線接続部が
、気泡を含む熱可塑性樹脂により包囲されてなることを
特徴とする半導体装置。The semiconductor chip and lead terminals are connected by metal wires,
In a semiconductor device in which a part of the semiconductor chip, the metal wire, and the January-bead are molded with resin, the semiconductor chip, the metal wire, and the metal wire connection portion of the lead i are free from air bubbles. A semiconductor device characterized in that it is surrounded by a thermoplastic resin containing a thermoplastic resin.
JP1981193664U 1981-12-28 1981-12-28 semiconductor equipment Pending JPS5899842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981193664U JPS5899842U (en) 1981-12-28 1981-12-28 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981193664U JPS5899842U (en) 1981-12-28 1981-12-28 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5899842U true JPS5899842U (en) 1983-07-07

Family

ID=30107012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981193664U Pending JPS5899842U (en) 1981-12-28 1981-12-28 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5899842U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51126764A (en) * 1975-04-25 1976-11-05 Toshiba Corp Resin sealed semiconductor unit manufacturing process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51126764A (en) * 1975-04-25 1976-11-05 Toshiba Corp Resin sealed semiconductor unit manufacturing process

Similar Documents

Publication Publication Date Title
JPS5827934U (en) semiconductor equipment
JPS596839U (en) semiconductor equipment
JPS5899842U (en) semiconductor equipment
JPS5856446U (en) Resin-encapsulated semiconductor device
JPS592155U (en) Resin-encapsulated integrated circuit
JPS5933254U (en) semiconductor equipment
JPS614436U (en) Packages for semiconductor devices
JPS5895062U (en) semiconductor equipment
JPS60141148U (en) semiconductor equipment
JPS5945935U (en) Resin-encapsulated semiconductor device
JPS58138350U (en) lead frame
JPS5991747U (en) semiconductor equipment
JPS6073249U (en) Resin-encapsulated semiconductor device
JPS5958941U (en) semiconductor equipment
JPS585347U (en) Resin-encapsulated semiconductor device
JPS59117166U (en) Resin-encapsulated semiconductor device
JPS5887355U (en) semiconductor equipment
JPS6068654U (en) semiconductor equipment
JPS6076040U (en) semiconductor equipment
JPS5881937U (en) semiconductor equipment
JPS59191744U (en) semiconductor equipment
JPS58109263U (en) semiconductor equipment
JPS58155849U (en) semiconductor equipment
JPS5977264U (en) Resin-encapsulated semiconductor device
JPS59131155U (en) semiconductor equipment