JPS58109263U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS58109263U
JPS58109263U JP1982005204U JP520482U JPS58109263U JP S58109263 U JPS58109263 U JP S58109263U JP 1982005204 U JP1982005204 U JP 1982005204U JP 520482 U JP520482 U JP 520482U JP S58109263 U JPS58109263 U JP S58109263U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor element
metal
semiconductor
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982005204U
Other languages
Japanese (ja)
Inventor
文雄 伊藤
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982005204U priority Critical patent/JPS58109263U/en
Publication of JPS58109263U publication Critical patent/JPS58109263U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ、　　ｂは本考案の一実施例を示す横断面図お
よび平面図であり、第２図は熱硬化によって樹脂、リー
ドフレームおよび金属囲いが収縮する状態を示す断面図
である。 １・・・・・・リードフレーム、２・・・・・・金属囲
い、３・・・・・・半導体素子、４・・・・・・半導体
素子と外部リードを接続する金属細線、５・・・用樹脂
、６・・間外部リード。1A and 1B are a cross-sectional view and a plan view showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a state in which the resin, lead frame, and metal enclosure are contracted by thermosetting. 1...Lead frame, 2...Metal enclosure, 3...Semiconductor element, 4...Metal thin wire connecting the semiconductor element and external lead, 5... Resin for..., external lead between 6...

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子搭載用金属基板の半導体素子搭載部の周辺部
に該金属基体と一体連続した金属囲いを“　　設けたこ
とを特徴とする半導体装置。1. A semiconductor device characterized in that a metal enclosure for integrally continuous with the metal base is provided around a semiconductor element mounting portion of a metal substrate for mounting a semiconductor element.
JP1982005204U 1982-01-19 1982-01-19 semiconductor equipment Pending JPS58109263U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982005204U JPS58109263U (en) 1982-01-19 1982-01-19 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982005204U JPS58109263U (en) 1982-01-19 1982-01-19 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS58109263U true JPS58109263U (en) 1983-07-25

Family

ID=30018015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982005204U Pending JPS58109263U (en) 1982-01-19 1982-01-19 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS58109263U (en)

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