JPS58153458U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS58153458U
JPS58153458U JP5049682U JP5049682U JPS58153458U JP S58153458 U JPS58153458 U JP S58153458U JP 5049682 U JP5049682 U JP 5049682U JP 5049682 U JP5049682 U JP 5049682U JP S58153458 U JPS58153458 U JP S58153458U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor device
semiconductor element
semiconductor
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5049682U
Other languages
Japanese (ja)
Inventor
勇 岡本
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP5049682U priority Critical patent/JPS58153458U/en
Publication of JPS58153458U publication Critical patent/JPS58153458U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の樹脂封止形半導体装置の斜視透視図で
、第２図は、第１図のＡ−Ａ’部の拡大断面図である。 第３図は半導体装置が熱歪を受けた状態を示す断面図で
ある。第４図は、本考案の一実施例による要部を示す斜
視透視図であり、第５図は第４図のＢ−Ｂ’線にそう断
面図である。 １．１′・・・・・・リードフレーム、２・・・・・・
半導体素子、３・・・・・・ソルダー、４・・・・・・
外部リード端子、５・・・・・・金属細線、６・・・・
・・合成衝止。FIG. 1 is a perspective perspective view of a conventional resin-sealed semiconductor device, and FIG. 2 is an enlarged sectional view taken along line AA' in FIG. FIG. 3 is a cross-sectional view showing a state in which the semiconductor device is subjected to thermal strain. FIG. 4 is a perspective view showing essential parts according to an embodiment of the present invention, and FIG. 5 is a sectional view taken along line BB' in FIG. 4. 1.1'...Lead frame, 2...
Semiconductor element, 3...Solder, 4...
External lead terminal, 5... Thin metal wire, 6...
...Synthetic blocking.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子が固定されたリード部の裏面が外部へ露出し
た構造を有する樹脂封止形の半導体装置におい−て、前
記リード部は肉薄部と肉厚部とを有し、該肉薄部に前記
半導体素子が接続されていることを特徴とする半導体装
置。In a resin-sealed semiconductor device having a structure in which a back surface of a lead part to which a semiconductor element is fixed is exposed to the outside, the lead part has a thin part and a thick part, and the semiconductor element is attached to the thin part. A semiconductor device characterized in that elements are connected.
JP5049682U 1982-04-07 1982-04-07 semiconductor equipment Pending JPS58153458U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5049682U JPS58153458U (en) 1982-04-07 1982-04-07 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5049682U JPS58153458U (en) 1982-04-07 1982-04-07 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS58153458U true JPS58153458U (en) 1983-10-14

Family

ID=30061292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5049682U Pending JPS58153458U (en) 1982-04-07 1982-04-07 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS58153458U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54137962A (en) * 1978-04-19 1979-10-26 Hitachi Ltd Lead frame with heat sink
JPS578085B2 (en) * 1978-07-22 1982-02-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54137962A (en) * 1978-04-19 1979-10-26 Hitachi Ltd Lead frame with heat sink
JPS578085B2 (en) * 1978-07-22 1982-02-15

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