JPS6353936A - Pellet bonder - Google Patents

Pellet bonder

Info

Publication number
JPS6353936A
JPS6353936A JP19793186A JP19793186A JPS6353936A JP S6353936 A JPS6353936 A JP S6353936A JP 19793186 A JP19793186 A JP 19793186A JP 19793186 A JP19793186 A JP 19793186A JP S6353936 A JPS6353936 A JP S6353936A
Authority
JP
Japan
Prior art keywords
pellet
lead frame
bonding
deviation
predetermined position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19793186A
Other languages
Japanese (ja)
Inventor
Shoichi Tanaka
彰一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP19793186A priority Critical patent/JPS6353936A/en
Publication of JPS6353936A publication Critical patent/JPS6353936A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To achieve pellet bonding with a high alignment accuracy by a method wherein a bonding position is automatically detected and a deviation from a reference position is calculated and the discrepancy of the position of a pellet from the reference position is automatically corrected in accordance with the deviation. CONSTITUTION:A lead frame 16 is intermittently shifted by a shifting pin 17 and a pellet 11 is bonded to the lead frame while in the stoppage period of the shifting. The lead frame 16 is intermittently shifted and, while it is staying at the position beneath an ITV 18, the relative position of the pellet 11 on the lead frame is detected and the deviation of the relative position from the reference position on the lead frame is calculated by an information processor 19. In accordance with the deviation, driving motors 14a and 14b are controlled and 1st predetermined position of the pellet on a table 12 is corrected and then 2nd predetermined position of the pellet transferred by an attracting collet 15 is automatically controlled so as to coincide with the reference position.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体装置の製造工程にＪ３いて用いられる
ペレットボンディングＨＩ＆に関Ｊるものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to pellet bonding HI& used in the manufacturing process of semiconductor devices.

従来の技術 従来、半導体装置の組立工程のひとつの作業を行なうペ
レットボンディング装置では第２図に示すようにダイシ
ング後粘着性シートに貼り付けられたペレット群の中か
らビジコンなどの層像手段によって良品のペレット１の
みを吸着コレット（図示せず）により吸着し、ペレット
位置調整部のテーブル２の上に載置し、Ｌを位置調整風
３などによりペレット１をＸ−Ｙ方向に位置決めし、さ
らに、ペレット１を第２の吸着コレット４により吸着し
、リードフレーム５の所定の位置にボンディングしたの
ち、このリードフレーム５を搬送部の送り爪６などによ
り間欠送りする。Conventional technology Conventionally, in pellet bonding equipment that performs one of the steps in the assembly process of semiconductor devices, as shown in Figure 2, non-defective products are selected from a group of pellets pasted on an adhesive sheet after dicing using a layer imager such as a vidicon. Only the pellet 1 of is adsorbed by a suction collet (not shown), placed on the table 2 of the pellet position adjustment section, L is positioned by the position adjustment air 3 etc., and the pellet 1 is positioned in the X-Y direction. After the pellet 1 is sucked by the second suction collet 4 and bonded to a predetermined position on the lead frame 5, the lead frame 5 is intermittently fed by the feed pawl 6 of the conveying section.

発明が解決しようとする問題点 従来のリードフレーム５にペレット１をボンディングす
るペレットボンディング装置においては、装置における
機械的変動や熱的変動などの影響により、ペレット１の
リードフレーム５の上でのボンディング位置にずれが生
じることがある。このペレット１のボンディング位置の
ずれ吊は、次の工程であるワイヤーボンディングに悪影
響を与えるものであり、ワイヤーボンディングを容易な
ものとするためには、ペレット１をリードフレーム５の
所定の位置に正確にボンディングする必要がある。Problems to be Solved by the Invention In the conventional pellet bonding device for bonding the pellet 1 to the lead frame 5, the bonding of the pellet 1 on the lead frame 5 is difficult due to mechanical fluctuations, thermal fluctuations, etc. in the device. Misalignment may occur. This misalignment of the bonding position of the pellet 1 has a negative effect on the next step, wire bonding.In order to make wire bonding easier, it is necessary to place the pellet 1 precisely at the predetermined position on the lead frame 5. It is necessary to bond to.

本発明はこのような問題点を解決するもので、ペレット
のリードフレーム上のボンディング位置を常に一定に保
持できるペレットボンディング装置を捉供することを目
的とするものである。The present invention solves these problems, and aims to provide a pellet bonding device that can always keep the bonding position of pellets on a lead frame constant.

問題点を解決するための手段 この問題点を解決するために本発明は、ペレットを第１
の所定位置に位置決めするペレット位置調整部と、前記
第１の所定位置のペレットをリードフレーム上の第２の
所定位置に搬送してボンディングする吸着コレット部と
、前記リードフレームを間欠的に搬送する搬送部と、ボ
ンディングされた前記ペレットと前記リードフレームと
の相対位置を検出する検出部と、前記相対位置とその基
準位置とのＧ差値に基いて前記ペレット位＠調整部を駆
動し、前記第１の所定位置を補正する補正部とを有する
ものである。Means for Solving the Problem In order to solve this problem, the present invention provides pellets as
a pellet position adjustment unit that positions the pellet at a predetermined position on the lead frame; a suction collet unit that transports the pellet at the first predetermined position to a second predetermined position on the lead frame for bonding; and a suction collet unit that transports the lead frame intermittently. a conveyance section, a detection section that detects the relative position of the bonded pellet and the lead frame, and a detection section that drives the pellet position @ adjustment section based on the G difference value between the relative position and its reference position; and a correction section that corrects the first predetermined position.

作用 上記構成により、ボンディングされたペレットの相対位
置を検出し、この相対位置と基準位置との偏差値にもと
づいてペレット位＠調整部を制御して、ペレットの第１
の所定位置を補正するので、ペレットのリードフレーム
上の位置を常に一定に保持できる。Operation With the above configuration, the relative position of the bonded pellet is detected, and the pellet position @adjustment unit is controlled based on the deviation value between this relative position and the reference position, and the first
Since the predetermined position of the pellet is corrected, the position of the pellet on the lead frame can always be kept constant.

実施例 以下本発明の一実施例を図面にもとづいて説明する。Example An embodiment of the present invention will be described below based on the drawings.

第１図は本発明の一実施例を示すペレットボンディング
装置のｉ１ｚンディング動作を説明するための制御系を
含む要部斜視図である。Ａはペレット位置調整部で、ペ
レット１１がＵ置されるテーブル１２と、テーブル１２
の上のペレット１１のＸ−Ｙ方向の位置決めを行なって
第１の所定位置にセットするし型位置調整型１３と、該
位置調整型１３をＸ方向およびＹ方向に移動させる駆動
モータ１４ａ、　１４ｂを備えている。Ｂは吸着コレッ
ト部で、出退、昇降移動を行なう＠看コレット１５を備
え、テーブル１２の上の第１の所定位置にあるペレット
１１を吸着し、リードフレーム１６の上の第２の所定位
置に搬送してボンディングする。Ｃはリードフレーム１
６を間欠的に搬送する搬送部で、送り爪１７がリードフ
レーム１６の孔１６ａに係合してリードフレーム１６を
間欠的に搬送する。Ｄはリードフレーム１６にボンディ
ングされたペレット１１とリードフレーム１６との相対
位置を検出する検出部で、麗像装置であるＩＴＶＩ８を
備えている。Ｅはペレット位置調整部Ａを制御してペレ
ット１１の第１の所定位置を補正する補正部で、記憶演
粋は能をもった情報処ｌ！！！装置１９を備え、ペレッ
ト１１とリードフレーム１６の相対位置とその基準位置
との偏差値に基いてペレット位置ｒＪＡｔ＆ｕｌｓＡノ
Ａｎモー’ＩＩ　１４ａ、１４ｂ　ヲ制６１１、位＠調
整爪１３によりペレット１１の第１の所定位置を補正す
る。FIG. 1 is a perspective view of a main part including a control system for explaining the i1z bonding operation of a pellet bonding apparatus showing an embodiment of the present invention. A is a pellet position adjustment section, which includes a table 12 on which pellets 11 are placed, and a table 12.
A mold position adjustment mold 13 for positioning the pellet 11 on the top of the pellet in the X-Y direction and setting it at a first predetermined position, and drive motors 14a and 14b for moving the position adjustment mold 13 in the X and Y directions. It is equipped with Reference numeral B denotes a suction collet section, which is equipped with a collet 15 that moves in and out, and moves up and down. and bonded. C is lead frame 1
In the conveyance section that intermittently conveys the lead frame 16, the feed claw 17 engages with the hole 16a of the lead frame 16 to intermittently convey the lead frame 16. D is a detection unit that detects the relative position between the pellet 11 bonded to the lead frame 16 and the lead frame 16, and is equipped with an ITVI8 which is a reimage device. E is a correction section that controls the pellet position adjustment section A to correct the first predetermined position of the pellet 11; ! ! The device 19 is equipped with a device 19, which controls the pellet position 611 and the adjusting claw 13 to adjust the pellet position 611 and the adjusting claw 13 based on the deviation value between the relative position of the pellet 11 and the lead frame 16 and its reference position. Correct the predetermined position of 1.

次に、その動作について説明する。リードフレーム１６
は送り爪１７により間欠送りされ、その停止期間中にペ
レット１１がリードフレーム１６にボンディングされる
。ペレット１１がボンディングされたリードフレーム１
６は間欠送りされ、ＩＴＶ１８の下方位置での停止期間
中にペレット１１のリードフレーム上での相対位置が検
出され、情報処ｕＮｉ［１９で上記相対位置とリードフ
レーム上の基準位置との偏差値が演粋処理され、この偏
差値に基いて駆動モータ１４ａ、　１４ｂが制御され、
テーブル１２の上での第１の所定位置が補正され、吸着
コレット１５により搬送されたリードフレーム上の第２
の所定位置が基準位置に一致するように自動的に制御さ
れる。Next, its operation will be explained. Lead frame 16
is intermittently fed by the feeding claw 17, and the pellet 11 is bonded to the lead frame 16 during the stop period. Lead frame 1 to which pellet 11 is bonded
6 is fed intermittently, and the relative position of the pellet 11 on the lead frame is detected during the period when the ITV 18 is stopped at the lower position, and the deviation value between the relative position and the reference position on the lead frame is detected in the information processing uNi [19]. is subjected to calculation processing, and the drive motors 14a and 14b are controlled based on this deviation value,
The first predetermined position on the table 12 is corrected, and the second predetermined position on the lead frame conveyed by the suction collet 15 is corrected.
The predetermined position of is automatically controlled to match the reference position.

発明の効果 以上本発明によれば、ボンディング位置を自助的に検出
して基準位置からの偏差値を求め、この偏差値に基いて
ペレット位置調整部でペレットの基準位置のずれを自動
的に補正するので、ペレットのリードフレーム上のボン
ディング位置を常に一定に保持して、高位置も１度のペ
レットボンディングを達成でき、次の工程にＪ３けるワ
イヤーボンディングを容易にできるものである。Effects of the Invention According to the present invention, the bonding position is automatically detected, the deviation value from the reference position is determined, and the deviation of the pellet reference position is automatically corrected by the pellet position adjustment unit based on this deviation value. Therefore, the bonding position of the pellet on the lead frame is always kept constant, and one-time pellet bonding can be achieved even at a high position, and wire bonding in the next step J3 can be easily performed.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例を示すペレットボンディング
装置のボンディング動作を説明するための制御系を含む
要部斜視図、第２図は従来のペレットボンディング装置
のボンディング動作を説明するための要部斜視図である
。 １１・・・ペレット、１２・・・テーブル、１３・・・
位置調整風、１４ａ、　１４ｂ・・・駆動モータ、１５
・・・吸着コレット、１６・・・リードフレーム、１７
・・・送り爪、１８・・・ＩＴＶ、１９・・・情報誌１
ｇ！装置、Ａ・・・ペレット位置調整部、Ｂ・・・吸着
コレット部、Ｃ・・・搬送部、Ｄ・・・相対位置検出部
、Ｅ・・・補正部。 代理人　　　森　　本　　義　　弘 第ｆ図 ／Ｊｌ・−・ＩｎFIG. 1 is a perspective view of the main parts including a control system for explaining the bonding operation of a pellet bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a main part for explaining the bonding operation of a conventional pellet bonding apparatus. FIG. 11... Pellet, 12... Table, 13...
Position adjustment wind, 14a, 14b... Drive motor, 15
...Adsorption collet, 16...Lead frame, 17
...Feeding claw, 18...ITV, 19...Information magazine 1
g! Apparatus, A... Pellet position adjustment section, B... Adsorption collet section, C... Conveyance section, D... Relative position detection section, E... Correction section. Agent Yoshihiro Morimoto Figure F/Jl・-・In

Claims (1)

【特許請求の範囲】[Claims] １、ペレットを第１の所定位置に位置決めするペレット
位置調整部と、前記第１の所定位置のペレットをリード
フレーム上の第２の所定位置に搬送してボンディングす
る吸着コレット部と、前記リードフレームを間欠的に搬
送する搬送部と、ボンディングされた前記ペレットと前
記リードフレームとの相対位置を検出する検出部と、前
記相対位置とその基準位置との偏差値に基いて前記ペレ
ット位置調整部を駆動し、前記第１の所定位置を補正す
る補正部とを有するペレットボンディング装置。1. A pellet position adjustment unit that positions the pellet at a first predetermined position, a suction collet unit that transports and bonds the pellet at the first predetermined position to a second predetermined position on the lead frame, and the lead frame. a conveyance unit that intermittently conveys the pellet, a detection unit that detects the relative position of the bonded pellet and the lead frame, and a pellet position adjustment unit that adjusts the pellet position based on a deviation value between the relative position and its reference position. and a correction section that is driven and corrects the first predetermined position.
JP19793186A 1986-08-22 1986-08-22 Pellet bonder Pending JPS6353936A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19793186A JPS6353936A (en) 1986-08-22 1986-08-22 Pellet bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19793186A JPS6353936A (en) 1986-08-22 1986-08-22 Pellet bonder

Publications (1)

Publication Number Publication Date
JPS6353936A true JPS6353936A (en) 1988-03-08

Family

ID=16382665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19793186A Pending JPS6353936A (en) 1986-08-22 1986-08-22 Pellet bonder

Country Status (1)

Country Link
JP (1) JPS6353936A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027535A (en) * 1988-06-27 1990-01-11 Nec Corp Die bonding device
US5579980A (en) * 1993-07-26 1996-12-03 Kabushiki Kaisha Shinkawa Chip bonding method and apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027535A (en) * 1988-06-27 1990-01-11 Nec Corp Die bonding device
US5579980A (en) * 1993-07-26 1996-12-03 Kabushiki Kaisha Shinkawa Chip bonding method and apparatus
US5579985A (en) * 1993-07-26 1996-12-03 Kabushiki Kaisha Shinkawa Chip bonding method and apparatus

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