JPS57128051A - Soldering method and apparatus for semiconductor product - Google Patents

Soldering method and apparatus for semiconductor product

Info

Publication number
JPS57128051A
JPS57128051A JP56012967A JP1296781A JPS57128051A JP S57128051 A JPS57128051 A JP S57128051A JP 56012967 A JP56012967 A JP 56012967A JP 1296781 A JP1296781 A JP 1296781A JP S57128051 A JPS57128051 A JP S57128051A
Authority
JP
Japan
Prior art keywords
product
unit
fed
soldering
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56012967A
Other languages
Japanese (ja)
Inventor
Shunichi Watabe
Yoshio Abe
Joichiro Kageyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP56012967A priority Critical patent/JPS57128051A/en
Publication of JPS57128051A publication Critical patent/JPS57128051A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To automatically and efficiently coat a solder by soldering a necessary part to be soldered while moving a semicoductr product along a soldering line.
CONSTITUTION: A semiconductor product integrated on a produt supply unit 10 is supplied to the rails 26 of a product moving mechanism 20, is then fed to a flux coating unit 12, is coated with the flux on the external lead terminal, and is then fed to a soldering unit 14. The product is coated with the solder on the external lead terminal. Thereafter, the product is cooled by a cooling fan 34, and is then washed with cleaning water in a cleaning and drying unit 16 so that the flux residue is removed, and water droplets are scattered by a draining unit 24, and is dried with hot air by a drying unit 44. The semiconductor device thus completely dried is fed on the rails 26 to a product recovery unit 18, and is contained in a product containing magazine 46.
COPYRIGHT: (C)1982,JPO&Japio
JP56012967A 1981-02-02 1981-02-02 Soldering method and apparatus for semiconductor product Pending JPS57128051A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56012967A JPS57128051A (en) 1981-02-02 1981-02-02 Soldering method and apparatus for semiconductor product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56012967A JPS57128051A (en) 1981-02-02 1981-02-02 Soldering method and apparatus for semiconductor product

Publications (1)

Publication Number Publication Date
JPS57128051A true JPS57128051A (en) 1982-08-09

Family

ID=11820007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56012967A Pending JPS57128051A (en) 1981-02-02 1981-02-02 Soldering method and apparatus for semiconductor product

Country Status (1)

Country Link
JP (1) JPS57128051A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199590A (en) * 1982-05-17 1983-11-19 近藤　権士 Soldering device
JPS5939946U (en) * 1982-09-09 1984-03-14 東京生産技研株式会社 Electronic component soldering equipment
JPS5939947U (en) * 1982-09-09 1984-03-14 東京生産技研株式会社 Electronic component soldering equipment
JPS5972794U (en) * 1982-11-05 1984-05-17 株式会社タムラ製作所 Jig for aligning and supporting integrated circuit components
JPS59101274A (en) * 1982-11-29 1984-06-11 Jonan Denki Kogyosho:Kk Dil type automatic soldering device for ic
JPS6142477A (en) * 1984-07-30 1986-02-28 エレクトロバート・リミテツド Device for treating electronic part,etc.
JPS61235070A (en) * 1985-04-10 1986-10-20 Ideya:Kk Solder treating equipment
JPS62138460U (en) * 1986-02-25 1987-09-01
JPS632359A (en) * 1986-06-21 1988-01-07 Tamura Seisakusho Co Ltd Fixture for soldering
JPH0211665U (en) * 1989-06-15 1990-01-24
JPH0281052U (en) * 1989-12-06 1990-06-22

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718330A (en) * 1980-07-10 1982-01-30 Toshiba Corp Method of and apparatus for soldering semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718330A (en) * 1980-07-10 1982-01-30 Toshiba Corp Method of and apparatus for soldering semiconductor device

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199590A (en) * 1982-05-17 1983-11-19 近藤　権士 Soldering device
JPS635249Y2 (en) * 1982-09-09 1988-02-12
JPS5939946U (en) * 1982-09-09 1984-03-14 東京生産技研株式会社 Electronic component soldering equipment
JPS5939947U (en) * 1982-09-09 1984-03-14 東京生産技研株式会社 Electronic component soldering equipment
JPS5972794U (en) * 1982-11-05 1984-05-17 株式会社タムラ製作所 Jig for aligning and supporting integrated circuit components
JPH0124937Y2 (en) * 1982-11-05 1989-07-27
JPS59101274A (en) * 1982-11-29 1984-06-11 Jonan Denki Kogyosho:Kk Dil type automatic soldering device for ic
JPS6142477A (en) * 1984-07-30 1986-02-28 エレクトロバート・リミテツド Device for treating electronic part,etc.
US4596353A (en) * 1984-07-30 1986-06-24 Electrovert, Ltd. Lead tinning system
JPS61235070A (en) * 1985-04-10 1986-10-20 Ideya:Kk Solder treating equipment
JPS62138460U (en) * 1986-02-25 1987-09-01
JPH0334919Y2 (en) * 1986-02-25 1991-07-24
JPS632359A (en) * 1986-06-21 1988-01-07 Tamura Seisakusho Co Ltd Fixture for soldering
JPH046103B2 (en) * 1986-06-21 1992-02-04 Tamura Seisakusho Kk
JPH0211665U (en) * 1989-06-15 1990-01-24
JPH0442057Y2 (en) * 1989-06-15 1992-10-02
JPH0281052U (en) * 1989-12-06 1990-06-22
JPH0438528Y2 (en) * 1989-12-06 1992-09-09

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