JPS58199590A - Soldering device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a soldering device that automatically solders IC lead terminals.

As is well known, it prevents oxidation of IC lead terminals and
Easy soldering after mounting C on the printed circuit board,
In order to ensure this, the lead terminals are soldered in advance.

By the way, conventionally, when soldering IC lead terminals, the IC was manually attached to a jig attached to a carrier.
was placed one by one, and the jig was then attached to the carrier. In addition, even after soldering to the lead terminals is completed, it is necessary to manually remove the jig from the carrier and remove the IC from the jig.
Since the parts were removed one by one, it required a lot of manpower and was time-consuming.Therefore, there were drawbacks such as poor soldering workability and increased costs.

This invention was made in order to eliminate the above-mentioned drawbacks; the case containing the IC is simply placed on the soldering device, and then transported.

The present invention provides a soldering device that can automatically perform all processes such as soldering and removal. This invention will be explained below.

FIGS. 1(a) and 1(b) are a plan view and a side view schematically showing an embodiment of the present invention, in which 1 is a soldering device, 2 is an I
Cl3 is a lead terminal of the IC2, and 4 is a case made of synthetic resin or the like in which the IC2 is housed in a row in the longitudinal direction and one of the ICs is open. 5 is a shooter on which a plurality of cases 4 in which the ICs 2 are housed are placed in parallel;
Reference numeral 6 denotes a first slide device on which the IC 2 from the shooter 5 is placed and transferred to the next carrier; 7 a carrier on which the IC 2 is removably mounted and transferred; and 8 a pair of carriers T is transferred. The soldering device 1 is stretched in an endless manner so that the horizontal surface of the soldering device 1 is placed above and below. 9 is a drive device, 10 is a drive sprocket for driving the conveyance check 78 by the drive device 9, 11 is a driven sprocket, 12 is a fluxer, 13 is a dip type solder bath, 14 is a washer, 15 is a dryer, 16 1T is the second slide device on which the soldered workpiece C2 is placed and transferred to the next extrusion device; 1T is the second slide device [1B IC
This is an extrusion device that extrudes 2.

Figures 2 (a) and (b) show the shooter 5 and the first
FIG. 2 is an enlarged perspective view and side view of a part of the slide device 6 of FIG. In addition, in FIG. 2(a), only one side of the shooter 5 is shown. In these figures, 7a, 2b
, . . . indicate the first, second, . . . , specific ICs among the IC2. 21 is a base on which the required number of cases 4 containing the IC 2 is placed; 22 is a first stopper for engaging and disengaging the IC 2; 23 is a rotating shaft fixed to the first stopper 22; 24; is a drive device for rotating the rotation shaft 23, and a pneumatic drive, a pulse motor, or the like is used as the power. 25 is a second stopper; 26 is a non-slip member attached to the second stopper 425 and made of a material with a large friction coefficient such as rubber; 2T is a non-slip member that connects the first stopper 22 and the second stopper 25; A hinge with a spring that is rotatably connected; 28 is a shaft that rotatably supports the base 21; 29 is the shaft 28;
This is a driving device such as an air cylinder that tilts the base 21 using the base 21 as a fulcrum.

3(a) and 3(b) are an enlarged front view and a cross-sectional view taken along line X-X of the first slide device 6 in FIG. 1, and FIG. 2(b) is a side view. Some of them are shown below.

31 is the base of the first slide device 6, 32 is the I
A slider for transporting C2; 33 is a stand for receiving the IC2;
34 is a plurality of convex portions on which the IC 2 is placed; 35 is a sliding shaft that is fixed to the base 33 in order to allow the base 33 to slide up and down; and 36 is a longitudinal axis of the base 31. A guide shaft 37 provided in the direction is a bearing fixed to both ends of the slider 32 in the longitudinal direction, and the guide shaft 36 is slidably fitted in the horizontal direction, and the slide shaft 35 is fitted in the vertical direction. ing. Reference numeral 38 denotes an intermediate bearing fixed at the lower part of the slider 32 and approximately in the middle of both bearings 3T, 39 a spring fitted to the guide shaft 36 between the bearing 37 and the intermediate id bearing 39 of the intermediate bearing 38, and 41 a spring fitted to the guide shaft 36. The intermediate bearing 3
8 and the slide bearing 39 is a spring fitted to the guide shaft 36.

Reference numeral 42 is a chino coupled with the slide bearing 39 to convey the slider 32, and 43 is a drive spruker for driving the chino 42, which is driven by a drive device (not shown). 44 is a driven sprukerato, 45 is the slide shaft 35
46 is a drive device such as an air cylinder that operates the push-up plate 45.

FIGS. 4(a) and 4(b) are a partially cutaway view and a side view showing an enlarged part of the carrier 7 in FIG.
A) is formed symmetrically with respect to the center line 0, and only one side thereof is shown. In these figures (1, 51 is the outer frame of the carrier 7, 52 and 53 are the front wheels and rear wheels provided on the outer frame 51, 54 is a bearing formed protruding from the outer frame 51, and 55 is the outer frame of the carrier 7. a guide shaft fixed to the bearing 54;
5B is a slide bearing slidably fitted on the guide shaft 55; 57 and 58 are springs fitted between the bearings 54 and the slide bearings 56 and on the guide shaft 55; 59 is a spring fitted on the carrier 77; Conveyance check 78 for conveyance
It is a mounting piece formed integrally with the slide bearing 56 and is fixed integrally with the slide bearing 56 by a set screw 60. Reference numeral 61 denotes a positioning bin, which is provided on the upper part of the outer frame 51 in order to correct the stopping position of the carrier 7 by stopping the conveyance chino 8.

62 is an inner frame provided inside the outer frame 51, 63 is a protruding piece formed on the inner frame 62, and 64 is a pin fixed to the outer frame 51, into which the protruding piece 63 is slidably fitted. There is.

A spring 65 is fitted between the outer frame 51' and the protruding piece 63 and the pin 64. 66 is a through hole provided in the inner frame 62 so that the positioning bin 61 does not come into contact with the inner frame 62. 6T is a mounting body formed for mounting the IC2, and a mounting piece 6B for lifting the IC2 is provided at the bottom thereof. Reference numeral 69 is a spring that acts in the closing direction of the mounting piece 68, and TO is a shaft that is provided on the inner frame 62 and rotatably supports the mounting body 6T. Reference numeral 71 denotes an engagement plate, and a taper 72 is formed on the lower surface of the engagement plate to push it down and open the attachment piece 68 when it engages with the attachment body 67 . 73 is a pin fixed to the inner frame 62, and the engagement plate 7
1 and is fitted with a spring 74 that is movable up and down and returns the engagement plate 71 upward. 81 is the carrier 7
This is an engaging body that slides up and down to correct the stopped position and engage with the first positioning pin 61, and has a recess 82 formed on its lower surface. Reference numeral 83 denotes a push-down plate that pushes down the engagement plate 71, and is provided with a prad 84 that comes into contact with the upper surface of the engagement plate 71. 85 is a stopper that holds the inner frame 62 at 5 so that it does not fall below a predetermined position in order to mount the IC 2 thereon.

And the engaging body 81. Each of the push-down plates 83 is moved up and down by a drive device such as an air cylinder (not shown).

5(a) and 5(b) are an enlarged plan view and side view showing the second slide device 16 and extrusion device 17 in FIG. 1, with the second slide device 16 shown schematically and 47 The receiver is a stand, and 48 is a convex portion.The difference from the first slide device 6 shown in FIG. 2(b) is that the receiver is a stand 47. to push out and transfer the IC2. The convex portion 48 is formed continuously in the longitudinal direction of the IC 2. In the extrusion device iy,
91 is a base, 92 is an extrusion plate for extruding the IC2, 93
94 is a bearing of the slide shaft 93, and 95 is a driving device such as an air cylinder for operating the push plate 92. 96 is a mounting table on which the IC 2 pushed out from the second slide device 16 is placed, and 97 is a guide having a convex cross section on which the IC 2 is placed.

Next, the operation will be explained.

In FIG. 2, a plurality of cases 4 in which ICs 2 are housed are placed on the convex portion 21a of the substrate 21 in a horizontal position as shown by two-dot chain lines. Next, when the drive device 29 is actuated to tilt the base 21 at a predetermined angle, the IC 2 inside the case 4 slides down, and the ICs 2a and 2b on the left side in the figure are exposed from the case 4, and the tip of the IC 2a is exposed. comes into contact with the #th stopper 22 and is locked. Next, when the drive device 24 is actuated, the first stopper 22, which is integral with the first rotation shaft 23, rotates in the direction of arrow A and reaches the position indicated by the two-dot chain line, thereby releasing the lock from the IC 21. Because of this, IC2a slipped down,
The receiver of the first slide device [6 is placed on the convex portion 34 of the stand 33. At the same time, the second stopper 25 also rotates in the direction of arrow B due to the rotation of the first stopper 22, so the anti-slip 26 presses the second IC 2b as shown by the two-dot chain line, causing it to slide down. No, keep it at 5. Further, the first stopper 22 and the second stopper 25 are bent by the hinge 2T, and the second stopper 2 is bent by the repulsive force of the spring of the hinge 27.
5, IC2b is pressed even more strongly and I
Ensure that C2b does not slip.

Next, when the drive device 24 rotates in the opposite direction to the direction of arrow A, the first stopper 22 also rotates in the same direction, and the first stopper 22 becomes the closed position. At the same time, the second stopper 25 also rotates in the direction opposite to the direction of arrow B, so that the anti-slip 26 releases the pressure on the IC 2b. For this reason, IC2b
slides down and comes into contact with the first stopper 22 and stops. And the upper IC2c, IC2d,...
, also decreases sequentially. Note that the second stopper 25 is attached to the hinge 2
Due to the repulsive force of spring 1, it returns to the initial position indicated by the solid line.

Next, in FIG. 3, the protrusion 3 of the sliding device 6 shown in
4, the slider 32 causes the cheno 42 to run by the rotation of the drive sprocket 43.
The slide bearing 39 connected to the chino 42 moves it forward in the direction of arrow C in the figure. Then, the front bearing 3T comes into contact with the front end 31a of the base 31 and stops. At this time, the slider 32 is mounted on a bearing 37 that is integral with the slider 32. Intermediate bearing 38
Since it is driven by the slide bearing 39 via the cover spring 40.41, the elasticity of the spring 40.41 acts as a buffer and prevents the impact caused by the abutment of the base 310. next,
When the drive unit [46 operates to raise the push-up plate 45, the push-up plate 45 comes into contact with the slide shaft 35, and the receiver pushes up the stand 33.
is held in the position where it is attached.

Next, when the IC 2 is attached to the carrier 77, the first slide device 6 performs the reverse operation as described above, the slider 32 returns to the shooter 5, and the shooter 5 again performs the same operation as described above. Then, the next IC 2b is placed on the protrusion 34 of the stand 33.

Next, in FIG. 4, the carrier T is driven by the transporting chino 8 and stops at the position where the first slide device 6 places the IC 2. By the way, the transportation Cheno 8
could not stop carrier 7 at the correct position,
The first slide device 6 often shifts back and forth and stops. For this reason.

In order to correct the carrier T to an accurate stopping position, the engaging body 8
1 is lowered, and the recess 82 of the engaging body 81 is engaged with the positioning pin 61 of the outer frame 51. At this time, the slide bearing 5
6 is fixed in position by stopping the conveyance cheno 8, but the outer frame 51 is moved by the expansion and contraction of the springs 57 and 58, and the position of the outer frame 51 is corrected.

Next, as shown in FIGS. 6(a) and (b), the push-down plate 8
3, the prad 84 comes into contact with the upper surface of the engagement plate 71 and pushes down the engagement plate T1, so that the mounting body 67 engages with the taper 72. Then, the mounting body 67 rotates around the shaft 70 while pressing the spring 69, opens the mounting piece 68 outward, and mounts the IC 2 as shown by the two-dot chain line in FIG. 6 (1, ,). to keep it in good condition.

At this time, the support of the first slide device 6 stops at a position where the table 33 rises and the IC 2 placed on the convex portion 34 is mounted on the mounting piece 68 .

Next, as the push-down plate 83 rises, the p-rad 84 moves to the engagement plate 71.
When the pin 73 engages with the engagement plate T1, the engagement plate 71 rises due to the repulsive force of the spring 74, and the attached body 6T
is released from the taper 72 and rotates about the shaft 70 due to the repulsive force of the spring 69, so that the mounting piece 68 is attached to the IC.
Attach 2.

After the mounting piece 68 has mounted the IC2, the push-up plate of the first slide device 6 shown in FIG. 3 is lowered, and the receiver base 33 is also lowered by its own weight, so that the IC2 is removed from the convex portion.

Next, the engaging body 81 that engages the positioning pin 61 rises and releases the engagement, and the conveying chino 8 also travels intermittently due to the intermittent drive of the drive device 9, reaching the primary fluxer 12. At this time, as shown in FIG. 7, since there is no stopper 85 shown in FIG. 4 at the fluxer 12, the inner frame 6
The protruding piece 63 of the IC 2 is released from the stopper 85, the inner frame 62 is lowered by its own weight, the lead terminal 3 of the IC 2 is treated with flux, further soldered in the solder bath 13, and cleaned in the washer 14. It is dried with hot air in the dryer 15 and reaches the second slide device 16 .

At the second slide device 16, the carrier 7 performs the reverse operation to remove the IC 2, and the receiver of the second slide device 16 is placed on the convex portion 48 of the stand 47.

In the second slide device 16, in the first extrusion device 1T, as shown in FIGS.
After pushing out the IC 2 placed on the convex portion 48 of the T in the direction of the arrow and transferring it to the guide 91 of the mounting table 96, the IC 2 is
Remove 2.

In this way, the entire process of soldering the lead terminals 3 of the IC 2 is completed.

As explained above, in this invention, by simply placing the case containing the IC on the chute, the IC is placed on the pedestal of the first slide device by the intermittent operation of the stopper of the chute, and the IC is placed on the pedestal of the first slide device. The stand is moved and transferred to the carrier, where the IC on the stand is mounted and the IC is removed from the carrier after passing through the processes of flux treatment, soldering, cleaning, and drying. The entire process of transferring the IC to the extrusion device using the slide device and extruding the IC onto the mounting table using the extrusion device has been automated, which completely eliminates manual work that requires manpower and time, improving work efficiency and reducing costs. has advantages.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a plan view and a side view schematically showing an embodiment of the present invention, and FIGS. 2(a) and (b) are a part of the shooter and slide device shown in FIG. 1. Figures 3(a) and 3(b) are an enlarged perspective view and side view of the slide device shown in Figure 1, a front view and a plane cross-sectional view taken along line X-X, and Figure 4 ( a) and (b) are a partially cutaway view and side view showing an enlarged part of the carrier in Fig. 1, and Fig. 5 (a)
, (b) is a plan view and a side view showing an enlarged view of the slide device and extrusion device shown in FIG. 1, and FIGS. 6(a) and (b) are a side view and a front view showing the operation of the carrier shown in FIG. 4. , FIG. 7 is a side view showing the operation of the carrier. In the figure, 1 is the soldering device, 2 is the IC, 3 is the lead terminal, 4 is the case, 5 is the shooter, 6 is the sliding device, 7 is the carrier, 8 is the conveyance chino, and 9 is the drive device. ,
10 is a driving sprocket, 11 is a driven sprocket, 1
2 is a fluxer, 13 is a soldering bath, 14 is a cleaning device, 15 is a dryer, 16 is a driving device, 25 is a second stopper, 26
27 is a hinge, 29 is a drive device, 31 is a base, 32 is a slider, 33 is a support, 34 is a convex portion, 35
is a slide shaft, 36 is a guide shaft, 37 is a bearing, 38 is an intermediate bearing, 39 is a slide bearing, 40.41 is a spring, 45
is the push-up plate, 4T is the stand, 48 is the convex part, 51 is the outer frame, 5
4 is a bearing, 55 is a guide shaft, 56 is a slide bearing, 57
．． 58 is a spring, 61 is a positioning pin, 62 is an inner frame, 63
64 is a protruding piece, 64 is a pin, 65 is a spring, 6T is a mounting body, 6
8 is a mounting piece, B9 is a spring, TO is a shaft, γ1 is an engagement plate, 7
2 is a taber, T3 is a pin, 74 is a spring, 81 is an engaging body,
82 is a recess, 83 is a push-down plate, 85 is a guide, 91 is a base, 92 is an extrusion plate, 95 is a drive device, 96 is a mounting table, 97
is a guide.

Claims (1)

[Claims] A carrier on which an IC to be soldered is mounted, a transporting chino that transports this carrier, a drive device that drives this transporting chino, a fluxer, a soldering bath, a cleaning machine,
The soldering apparatus includes a dryer, a shooter that accommodates a plurality of the ICs to be soldered and sequentially sends them out, a first slide device that places the ICs from the shooter and transports them to the carrier; a second slide device that places the IC mounted on the carrier on a stand and transports the IC, and a drive device that moves the extrusion plate to move the IC of the second slide device to the second slide A soldering device characterized by being equipped with an extrusion device for extruding from the device.