JP2527420Y2 - Soldering equipment for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a solder coating apparatus for preliminarily solder coating a lead frame integrally connected to lead terminals of a plurality of electronic components.

[Conventional technology]

As is well known, in order to prevent oxidation of the lead terminals of electronic components such as ICs and to easily and surely solder after mounting the electronic components on the printed circuit board, apply solder coating to the lead terminals in advance. I have.

[Problems to be solved by the invention]

By the way, conventionally, when solder coating is applied to a lead frame of an electronic component or a lead frame integrally connected to each of the lead terminals of a plurality of electronic components, the electronic component or the lead is manually attached to a jig mounted on a carrier. Electronic components with a frame were placed one by one, and this jig was further mounted on a carrier. Also, after the solder coating is finished on the lead terminals, manually remove the jig from the carrier,
Furthermore, since electronic components were taken out one by one from the jig,
It was labor intensive and time consuming. Therefore, there has been a problem that the workability of the solder coating is poor and the cost increases.

The present invention has been made to solve the above-mentioned problem, and the lead frame of the electronic component is engaged with the engaging claw integrally with the lead terminal of the electronic component, and the upper surface of the electronic component is pressed, so that the electronic component is formed. An object of the present invention is to provide an electronic component solder coating apparatus in which engagement and disengagement and solder coating are automatically performed.

[Means for solving the problem]

The electronic component solder coating apparatus of the present invention has a plurality of chain bodies connected continuously, and has a pair of oblong chains running along guide rails, and one of the one-way chains. The two chains are arranged so that the major axis direction of the other chain is parallel to the major axis direction of the other chain, and the engagement portion at one end of the lead frame that integrally connects the lead terminals of a plurality of electronic components is connected to one chain. The lead frame is disposed such that the engaging portion at the other end of the lead frame is opposed to the other chain, and each of the engaging devices provided on each of the pair of chains is connected to the lead frame. A solder coating device that engages with each of both ends and performs solder coating on a lead frame in an engaged state, wherein the engagement device is a selected specific chain body. A pin that penetrates and protrudes through the chain body, is vertically movable and is formed in an elongated shape, and a compression spring that is provided to always hold the pin upward.
A pedestal fixed to the lower end of the pin, a rotatable engaging claw fixed to the pedestal and engaging with the engaging portion of the lead frame below the pedestal; fixed to the pedestal; And a rotatable pressing piece that presses the upper surface of the electronic component in the lead frame. And a first engagement body that can move up and down, and a second engagement body that can contact the pressing piece,
The first and second engagement members are located at positions where an engagement device provided on the one chain and an engagement portion at one end of the lead frame are engaged, an engagement position provided on one chain, and A position where the engagement with the engagement portion at one end of the lead frame is released, a position where the engagement device provided on the other chain is engaged with the engagement portion at the other end of the lead frame, and the other chain And the engagement device at the other end of the lead frame is provided at a position where the engagement is released.

[Action]

In this invention, when the pressing tool is lowered and the pin of the transport chain is lowered, the engaging device is also lowered and the engaging claw is moved to the first position.
It rotates by the engagement body of. At the same time, since the pressing piece is rotated by the second engaging body, the engaging claw is engaged with the engaging portion of the lead frame, and a standby state is established for the pressing piece to be pressed by the electronic component. Next, when the first engagement body descends,
The engaging claws rotate in the opposite direction to engage with the lead frame of the electronic component. Next, as the pin rises due to the restoring force of the compression spring with the rise of the pressing tool, the engaging claw and the pressing piece rise, and then the pressing piece detaches from the second engaging body, and the pressing piece moves as described above. By rotating in the opposite direction and engaging the engaging portion of the lead frame with the engaging claw and pressing the upper surface of the electronic component with the pressing piece, the electronic component does not come off even when being transported.

〔Example〕

1 to 3 show an embodiment of the present invention.
1 (a) and 1 (b) are a front view and a side view showing a shape of an electronic component holding device, FIG. 2 is a perspective view showing an enlarged shape of the electronic component, and FIGS. b) is a plan view and a side view showing a schematic configuration of a solder coating apparatus for an electronic component, and FIGS.
FIG. 6 is a front view showing the operation of FIG. In these figures, 1 is an electronic component such as an IC, 2 is a lead terminal, 3
Reference numeral 4 denotes a lead frame in which the lead terminals 2 of the plurality of electronic components 1 are integrally connected, and 4 denotes engagement portions formed at both ends in the longitudinal direction of the lead frame 3. Reference numeral 11 denotes an engagement device for engaging a lead frame of the electronic component 1 for coating the lead terminals 2 of the electronic component 1 with solder. The chain 12 is formed by connecting a plurality of chain
As shown in the figure, it has an endless oval shape in the transport direction (the direction of arrow A) and is suspended by a sprocket 42. In the chain 12, both chains are arranged so that the major axis direction of one chain and the major axis direction of the other chain are parallel to each other, and are arranged in parallel to the running direction similarly to the chain guide 15 in FIG. In order to prevent the engagement device 11 from swaying, the engagement device 11 is provided in two stages, one above the other, and is guided by the chain guide 15 to ensure stable traveling. Pressing tools 16 are provided at the upper part of the chain guide 15 at the front (the entrance side in the conveying direction (arrow A direction)) and at the rear (the outlet side in the conveying direction (arrow A direction)) via cylinders (not shown).
Is provided.

The engaging device 11 is for engaging or disengaging the lead frame 3 of the electronic component 1 from a direction orthogonal to the transport direction (the direction of arrow A). It is formed at a constant interval on the specified specific chain body 12a. The engagement device 11 penetrates and protrudes through the chain body 12a, and is vertically supported via a pedestal 17 on a pin 13 which is vertically movable and formed in an elongated shape. The connection pins are used to connect a plurality of chain members 12a. The connection pins are hollow, and various attachments (engaging device 11 in the present invention) are provided in the hollow portions of the connection pins. Mounting,
Needless to say, it can be removed.

The pin 13 has a block 13a fixed to its upper part, and a compression spring is provided between the block 13a and the chain body 12a.
The compression spring 14 urges the block 13a so that the engagement device 11 is always positioned upward. 1 (a) and 1 (b) show only one side of the engagement device 11.

One end of a hinge 19 is fixed to a lower portion of the pedestal 17, and an engaging claw 18 and an operation piece 21 are fixed to the other end. A coil spring 20 is mounted on the shaft 19a of the hinge 19, and always urges the engaging claw 18 in the direction of arrow B. However, since the upper portion of the engaging claw 18 is in contact with the edge of the pedestal 17, the engaging claw 18 always maintains the position shown in FIG. When the operating piece 21 abuts,
Rotation is possible in the direction opposite to the arrow B direction.

Further, one end of a hinge 23 is fixed to an upper portion of the pedestal 17, and an operating piece 24 is fixed to the other end, and a pressing piece 22 is fixed to a lower portion of the operating piece 24 in a downward direction. . The pressing piece 22 always keeps the position shown in FIG. 1A by the weight of the pressing piece 22 and the operating piece 24, but when a second engaging body 26 to be described later comes into contact with the operating piece 24, the arrow It can rotate in the C direction.

The first engagement body 25 and the second engagement body 26 are arranged at the front stage and the rear stage of the pair of chains 12, and more specifically, the engagement between the engagement device provided on the one chain and one end of the lead frame. A position where the mating portion is engaged, a position where the engagement device provided on one chain is disengaged from the engagement portion at one end of the lead frame, and an engagement device provided on the other chain. The lead frame is provided at a position where the other end of the lead frame is engaged with the engagement portion, and the engagement device provided on the other chain is provided at a position where the engagement with the engagement portion at the other end of the lead frame is released. ing. In the first and second engaging members 25 and 26, the first engaging member 25 and the second engaging member 26 relate to the engaging operation, and the second engaging member relates to the disengaging operation.

The first engagement body 25 is supported below the operating piece 21 at the engagement or disengagement position, and can be moved downward by a cylinder or the like (not shown). The union 26 is fixed below the operating piece 24 at the engagement or disengagement position.

In FIG. 3, reference numeral 41 denotes the entire solder coating apparatus, 43 denotes a fluxer, 44 denotes a preheater, 45 denotes a solder bath,
46 is a cleaning device and 47 is a dryer.

Further, in the preceding and subsequent stages of the solder coating device 41,
Each of the conveyors 31 is provided, and the conveyor 31 is provided.
Are arranged in the same direction as the transport direction of the chain 12 (the direction of arrow A).

 Next, the operation will be described.

The engagement device 11 is intermittently transported in the direction of arrow A by the chain 12 and temporarily stops at a predetermined position on the conveyor 31.
After the electronic component 1 is placed on the mounting table 32,
It is conveyed in the direction of arrow A by 31 and stops at the engagement device 11 already stopped at a predetermined position. Here, the lead frame 3 of the electronic component 1 on the mounting table 32 is
First, when the pressing tool 16 presses the pin 13 by driving the cylinder, the operating piece 21 moves down together with the pedestal 17. As a result, as shown in FIG. 4, the operation piece 21 comes into contact with the first engagement body 25, and the engagement claw 18 rotates in the direction opposite to the arrow B direction. At this time, since the operation piece 24 also contacts the second engagement body 26, the pressing piece 22 rotates in the direction of arrow C,
The upper part of the electronic component 1 is not pressed.

Next, as shown in FIG. 5, when the lowering end of the pressing tool 16 is confirmed and the first engagement body 25 is lowered, the contact with the operation piece 21 is released and the engagement is performed by the restoring force of the coil spring 20. The claw 18 engages with the engaging portion 4 of the lead frame 3.

Next, as shown in FIG. 6, when the pressing tool 16 is lifted to release the pressing of the pin 13, the pin 13 is raised by the restoring force of the compression spring 14, so that the electronic component 1 engaged with the engaging claw 18 is moved.
Rises and separates from the mounting table 32 of the belt conveyor 31.
At this time, the contact of the operating piece 24 with the second engaging body 26 is released, so that the pressing piece 22 rotates in the direction opposite to the arrow C direction by its own weight, and presses the upper surface of the electronic component 1. Accordingly, the electronic component 1 is fixed by the engaging claw 18 and the pressing piece 22, and at this time, the first engaging body 25 returns to the original position after confirming the rising end of the pressing tool 16.

Next, the chain 12 once stopped starts running, so that the lead terminal 2 of the electronic component 1 and the lead frame 3
Is fluxed by a solder coating device 41 and a fluxer 43, heated by a preheater 44, coated with solder in a solder bath 45, washed by a cleaning device 46, dried by a dryer 47, and then dried by the engaging device 11. When the engaging portion of the lead frame 3 reaches the position where the engagement is released, the lead frame 3 of the electronic component 1 is disengaged from the engaging claw 18 again by the same lowering operation of the engaging device 11 as described above. Electronic component 1 on conveyor 31
It is mounted on the mounting table 32.

In this manner, the electronic components 1 mounted on the mounting tables 32 of the conveyor 31 are sequentially mounted by the engaging device 11 running from behind, and after being coated with solder, the electronic components 1 are operated by substantially the same operation as described above. The lead frame 3 of the component 1 is disengaged from the engagement claws 18 and is mounted on the mounting table 32.

The second hinge 23 may be provided with a coil spring (not shown) for rotating and pressing the pressing piece 22 in the direction opposite to the arrow C direction.

[Effect of the invention]

As described above, in the present invention, a plurality of chain bodies are continuously connected, and a pair of oval chains running along guide rails is provided. Both chains are arranged so that the major axis direction and the major axis direction of the other chain are parallel,
An engagement portion at one end of a lead frame integrally connecting each lead terminal of a plurality of electronic components faces one chain,
The lead frame is arranged such that an engagement portion at the other end of the lead frame faces the other chain,
Each of the engagement devices provided on each of the pair of chains is engaged with each of both ends of the lead frame,
A solder coating device for solder coating a lead frame in an engaged state, wherein the engagement device is formed on a selected specific chain body, and penetrates and protrudes through the chain body. A pin that is vertically movable and formed in a long shape, and a compression spring that is provided so as to always hold the pin upward.
A pedestal fixed to the lower end of the pin, a rotatable engaging claw fixed to the pedestal and engaging with the engaging portion of the lead frame below the pedestal; fixed to the pedestal; And a rotatable pressing piece that presses the upper surface of the electronic component in the lead frame. And a first engagement body that can move up and down, and a second engagement body that can contact the pressing piece,
The first and second engagement members are located at positions where an engagement device provided on the one chain and an engagement portion at one end of the lead frame are engaged, and an engagement device provided on one chain and A position where the engagement with the engagement portion at one end of the lead frame is released, a position where the engagement device provided on the other chain is engaged with the engagement portion at the other end of the lead frame, and the other chain Is provided at a position where the engagement between the engaging device provided at the other end and the engaging portion at the other end of the lead frame is released, so that the mounting and taking out of the electronic component and the solder coating process are automatically performed. In addition, solder coating can be performed while the lead frame is attached to the lead terminals of the electronic components, and the electronic components engaged by the engagement claws are pressed by the pressing pieces, so that the electronic components are transported and solder coated. When is done Because never disengaged, it has the advantage of saving improvements and expenses workability in soldering the coating process is obtained.

[Brief description of the drawings]

FIGS. 1 to 3 show an embodiment of the present invention. FIGS. 1 (a) and 1 (b) are a front view and a side view showing the shape of a holding device for electronic components, and FIG. 3 (a) and 3 (b) are plan and side views schematically showing the configuration of a solder coating apparatus for electronic components, and FIGS. FIG. 2 is a front view showing the operation of FIG. 1. In the drawing, 1 is an electronic component, 2 is a lead wire, 3 is a lead frame, 4 is an engaging portion, 11 is an engaging device, 12 is a chain, 12a is a chain body, 13 is a pin, 14 is a compression spring, and 16 is Pressing tool, 17
Is a pedestal, 18 is an engagement claw, 22 is a pressing piece, 25 is a first engagement body,
26 is a second engaging body, and 41 is a solder coating device.

Claims (1)

(57) [Scope of request for utility model registration] A plurality of chain bodies are continuously connected, and have a pair of oval chains running along guide rails, wherein one of the one-way chains has a longer diameter direction and the other has a longer diameter. The two chains are arranged so that the major axis direction of the chain is parallel to the chain, and an engagement portion at one end of a lead frame integrally connecting lead terminals of a plurality of electronic components faces one chain, and the lead frame The lead frame is disposed such that the engagement portion at the other end of the lead frame faces the other chain, and each of engagement devices provided on each of the pair of chains engages with each of both ends of the lead frame. A solder coating device that performs solder coating on the lead frame in the engaged state, wherein the engagement device is formed on a selected specific chain body, A long pin that penetrates and protrudes through the chain body and that can move up and down, a compression spring provided to always hold the pin upward, and a pedestal fixed to the lower end of the pin. A rotatable engaging claw fixed to the pedestal and engaged with the engaging portion of the lead frame below the pedestal; and an upper surface of the electronic component in the lead frame fixed to the pedestal. A pressing member that presses and lowers the pin, and a first member that can contact the engaging claw and move up and down. And a second engaging member capable of abutting on the pressing piece, wherein the first and second engaging members are associated with an engaging device provided on the one chain and one end of the lead frame. At the position where the mating part engages, provided on one chain The position at which the engaged engagement device is disengaged from the engagement portion at one end of the lead frame, and the engagement device provided on the other chain is engaged with the engagement portion at the other end of the lead frame. A solder coating device for an electronic component, wherein the device is provided at a position where the engagement is provided, and at a position where the engagement between the engagement device provided on the other chain and the engagement portion at the other end of the lead frame is released. .