JPH02244665A - Ic holding device of solder coating device for ic - Google Patents

Abstract

PURPOSE:To automate a coating process and to prevent solder tailings and others from attaching to an IC so as to improve it in quality by a method wherein a pin is extracted from a carrier holding plate and the mounting of the IC is executed on the upper traveling section of a transfer chain and the IC is coated with solder on the lower traveling section. CONSTITUTION:When a carrier 1 on a transfer chain reaches to the position of a housing case 33, an actuator 22 extracts a pin 13 inserted into a holding plate 11 and then inserts the pin 13 into the through-hole of an IC to mount the IC on the holding plate 11. When the carrier 1 mounted with the IC reaches to the lower traveling section of the transfer chain, the IC is suspended by the pin 13 and the lead terminals of the IC face downward. Keeping the IC in this position, it is coated with solder, and then a pin 23 is extracted from the through-hole of the IC by an actuator 42 to dismount the IC from the carrier 1 and house it in a housing case 41. By this setup, a solder coating process is automated to prevent flux and solder tailings from attaching to an IC and to improve it in quality.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an IC holding device in an IC solder coating device that automatically solders the lead terminals of an IC having a through hole.

[Conventional technology]

As is well known, it prevents oxidation of IC lead terminals and
In order to easily and reliably solder the product after it has been mounted on the printed circuit board, the lead terminals are coated with solder in advance.

(Problem to be Solved by the Invention) Conventionally, when applying solder coating to the lead terminals of an IC, the IC was manually attached to a jig attached to a carrier.
were placed one by one, and this jig was further attached to the carrier. In addition, even after solder coating is completed on the lead terminals, the jig must be manually removed from the carrier and the IC removed from the jig.
Since the parts were removed one by one, it required a lot of manpower and was time-consuming. Therefore, there are drawbacks such as poor solder coating workability and increased costs.

This invention was made to solve the above problems, and the process of soldering the IC is automatically performed by passing a pin through a hole formed in the mold of the IC and then hanging it. The object of the present invention is to obtain an IC holding device in an IC solder coating device.

[Means to solve the problem]

The IC holding device in the IC solder coating device according to the present invention includes a pair of connecting shafts that connect the conveying chains in a direction perpendicular to the running direction thereof, and a pair of connecting shafts connecting the conveying chains with each other in a direction perpendicular to the running direction thereof. A pair of retaining pieces slidably engaged, a base attached between these engaging pieces, and a holder attached to the base for holding the IC. A plate, a through hole formed in this retaining plate, a pin that passes through the through hole of the IC held on the retaining plate and the through hole of the retaining plate, and a pin that acts in the direction of constantly inserting this pin into the through hole of the retaining plate. a first actuator that moves pins when an IC whose lead terminals are not coated with solder is mounted on the carrier; and a carrier whose lead terminals are not coated with solder. and a second actuator that moves the pin when the pin is removed from the carrier.

[Function] In this invention, the first actuator in the upper horizontal running part of the conveyor chain first pulls out the pin inserted through the holding plate of the carrier, holds the IC on the holding plate, and then removes the IC. By inserting a pin into the through hole, I
C is attached to the holding plate. Next, when the carrier with the IC mounted thereon travels on the horizontal running section below the conveyance chain, the IC is suspended from the pin, and in this state the solder coating process is performed on the IC. Next, after the process of coating the IC with solder is completed, the IC mounted on the holding plate is removed by pulling out the pin from the through hole of the IC using the second actuator.

〔Example〕

Figures 1 to 4 show an embodiment of the present invention, where Figure 1 is a plan view of a carrier holding an IC, and Figure 2 (a).
, (b) are a plan view and a side view showing the shape of the IC, FIG. 3 is an enlarged sectional view showing the main part of FIG. 1, and FIG. 4 is a configuration diagram showing an outline of the IC solder coating device. . In these figures, 1 indicates a carrier holding an IC, 2 indicates an IC,
3 is a lead terminal of the IC 2; 4 is a through hole formed in the molded portion of the IC 2; 5 is an endless, parallel structure, and is stretched so that its horizontal running portions are on the upper and lower sides. A pair of conveyance chains, 6 a pair of connecting shafts connecting the conveying chains 5 in a direction perpendicular to the running direction thereof, 7 sliding between the connecting shafts 6 and 6; A pair of freely engaged engaging pieces 7a are engaging portions formed on the engaging piece 7, and are connected to each connecting shaft 6 via the collar 8.
It is slidably engaged with. 9 is a collar presser for preventing the collar 8 from being pulled out from the engagement piece 7; 1;
0 is a base mounted between the engaging pieces 7, 11 is a holding plate that holds the IC 2 disposed in the gear rear 1, and 12 is a transparent plate formed on the holding plate 11. Hole, 1
3 is a pin inserted into the through hole 12 of the holding plate 11 and the through hole 4 of the IC 2; 14 is a mounting plate to which the pin 13 is attached;
15 is a guide plate provided on the upper part of the mounting plate 14; 16 is a guide shaft that guides the guide plate 15; 17 is a fixed plate that fixes the interval between the guide shafts 16; 11 is a tension spring that acts in the direction of being inserted into the through hole 12 at all times, and its one end is attached to the mounting plate 14 and the other end is attached to the mounting piece 19 attached to the base 10. Reference numeral 20 indicates a through hole formed in the base 10 for passing the tension spring 18, and reference numeral 21 indicates a through hole formed in the base 10 for passing the tension spring 18; A tension spring for restoring to the position is attached at one end to the engagement piece 7 and at the other end to the collar 8. Reference numeral 22 denotes a first member for moving the pin 13 in the direction of pulling out the pin 13 relative to the through hole 12 of the holding plate 11 in order to mount the IC 2 on the carrier 1.
actuator 23, the first actuator 2
The second rod 24 is an engagement pin formed at the tip of the rod 23.

In FIG. 4, 31 indicates the entire IC solder coating device, 32 indicates the sprocket of the conveying chain 5, and 33
A storage case in which the IC2 before being coated with solder is stored and arranged, 34.35 is a cleaning tank, 36 is a fluxer, 37 is a preheater, 38 is a solder tank, 39 is a cleaning tank, 4° is a a dryer; 41 is a storage case for storing the solder-coated IC2; 42 is a second actuator;
In order to detach the IC2 whose lead terminals 3 are coated with solder from the carrier 1, the pins 13 are moved in the direction of pulling them out from the holding plate 11 and each through hole 4.12 of the IC2.

Next, the operation will be explained.

In FIG. 4, carrier 1 is intermittently transported in the direction of arrow A by transport chain 5. In FIG. Then, once the carrier 1 that has been transported to the storage case 33 stops, the first actuator 22 is moved as shown in FIG.
is driven, and the rod 23 moves in the B direction. Next, the engagement pin 24 located at the position indicated by the solid line rotates in the direction of the arrow C and reaches the position indicated by the two-dot chain line, and at the same time, the rod 23 moves in the direction opposite to the direction of the arrow B, so that the engagement pin 24 is attached to the mounting plate. 14
the mounting plate 14 while engaging the tension spring 18 and biasing the tension spring 18.
Move to the position indicated by the two-dot chain line. Therefore, pin 13
moves and separates from the through hole 12 of the engagement plate 11, so the IC 2 in the storage case 33 is pushed out toward the carrier 1 by a pushing device (not shown) and stored in each holding plate 11. At this time, the lead terminal 3 of the IC 2 faces upward. Next, the rod 23 is driven by the first actuator 22.
When the is moved again in the direction of arrow B, the mounting plate 14 moves in the same direction together with the engagement pin 24 due to the restoring force of the tension spring 18, so the pin 13 moves and the through hole 1 of the retaining plate 11 is moved.
2 and the through hole 4 of IC2, so IC2 is inserted into carrier 1.
will be installed on the Next, the carrier 1 with the IC 2 mounted thereon moves intermittently on the upper horizontal running portion in the direction of arrow A in FIG. 4, and then descends downward. At this time, IC2
is in the horizontal direction as shown in FIG. Next, the carrier 1 further moves on the lower horizontal running section. At this time,
Since the IC 2 is suspended by the pin 13, the lead terminal 3 is directed downward. Next, the lead terminals 3 of the IC2 are connected to each cleaning tank 34, 35, . Fluxa 36. After performing each process in the preheater 37, the solder bath 3
8 rises to coat the lead terminal 3 with solder. Next, the solder bath 38 descends, and then the cleaning bath 39 and the drying bath @40.
After each process is carried out in the storage case 41, the paper is transported to the storage case 41.

Here, by driving the second actuator 42, the IC2
Since the pin 13 is pulled out from the through hole 4, the IC 2 is removed from the carrier 1 and stored in the storage case 41. Next, the carrier 1 from which the IC 2 has been removed rises upward, and the IC 2 is mounted at the storage case 33 that has moved again on the upper horizontal running section.

(Effects of the Invention) As explained above, the present invention includes a pair of connecting shafts that connect two conveying chains in a direction perpendicular to the running direction thereof, and a pair of connecting shafts that connect two conveying chains in a direction perpendicular to the running direction thereof. A pair of engaging pieces slidably engaged, a base mounted between these engaging pieces, and a holding plate attached to the base for holding an IC. , a pin that passes through a through hole formed in this holding plate, a through hole of an IC held on the holding plate, and a through hole of the holding plate, and a spring that acts in the direction of constantly inserting this pin into the through hole of the holding plate. A first actuator moves the pins when an IC whose lead terminals are not coated with solder is mounted on the carrier; A second actuator for moving the pin when detaching; and;
The IC solder coating process is automatically performed, and the I
Since cleaning and solder coating are performed while the IC is suspended, there is no flux or solder particles attached to the IC, which has the advantage of improving the quality of the IC solder coating process.

[Brief explanation of drawings]

Figures 1 to 4 show one embodiment of the present invention. Figure 1 is a plan view of holding an IC, and Figures 2 (a) and (b) are a plan view and side view showing the shape of the IC. 3 are enlarged sectional views showing the main parts of FIG. 1, and FIG. 4 is a configuration diagram showing an outline of an IC soldering apparatus. In the figure, 1 is a carrier, 2 is an IC, 3 is a lead terminal, 4 is a through hole, 5 is a conveyor chain, 6 is a connecting shaft, 7 is an engaging piece, 1
0 is the base, 11 is the holding plate, 12 is the through hole, 13 is the pin, 1
4 is a mounting plate, 15 is a guide plate, 16 is a guide shaft, 17 is a fixing plate, 22 is a first actuator, 31 is an IC solder coating device, 32 is a sprocket, 33.41 is a storage gauge, 34.35. 39 is a cleaning tank, 36 is a fluxer, 37
38 is a soldering bath, 40 is a dryer, and 42 is a second actuator.

Claims (1)

[Claims] A pair of endless conveyor chains are provided in parallel and stretched so that the horizontal running portions are on the upper and lower sides, and the conveyor chains intermittently convey ICs having through holes in the mold portion. , in the IC solder coating device for coating lead terminals of the IC with solder, a pair of connecting shafts connecting the conveying chains in a direction perpendicular to the running direction thereof; and connecting these connecting shafts. a pair of engaging pieces slidably engaged with the shaft; a base mounted between the engaging pieces; and a base for holding the IC on the base. an attached retaining plate, a through hole formed in the retaining plate, and the I held by the retaining plate;
a carrier on which the IC is mounted by a pin inserted through the through hole of C and the through hole of the holding plate, and a spring acting in a direction to constantly insert the pin into the through hole of the holding plate; A first actuator that moves the pin when the IC that is not coated with solder is mounted on the carrier, and a first actuator that moves the pin when the IC whose lead terminals have been coated with solder is removed from the carrier. A second actuator for moving an IC in a solder coating device for IC.
holding device.