KR0151975B1 - Electronic component mounting board's heating and automatic sending device - Google Patents

Abstract

The present invention relates to a heating and automatic reversing apparatus for heating a PCB on which an electronic component is mounted at a constant temperature and automatically inverting the technical component thereof. The technical configuration of the substrate transfer conveyor (3) to which the PCB (2) is transferred is provided. A rodless cylinder 4 is installed at one end thereof, and a stopper 6 installed in a spring 5 is installed at the tip of the rodless cylinder 4 so as to be located within the guide gap 8 extending from the connection chain 7. A guide plate 8 having a substrate insertion groove 11 formed thereon is installed on the connection chain 7 which is installed to enter and insert the PCB 2 into the sprocket wheels 9 and 9 '. The PCB 2 is inserted into the substrate insertion groove 11 of the guide plate 8 to be inserted in the vertical direction, and the guide plate 8 to which the PCB 2 is fixed is placed vertically on the connection chain 7. And the heater 15 is rolled up to the upper side of the drying furnace 12 in which the heat insulating material 14 is installed on the periphery. On both sides of the heater (15), a blower fan (17) which is extended with the motor (16) is installed so that the PCB (2) transferred through the connection chain (7) is heated at a constant temperature, and the drying furnace (12) of the The substrate transfer conveyor 18 is installed at the rear, and the PCB 2 is inserted into the substrate when the PCB 2 entered through the guide plate 8 on the connection chain 7 enters the chain inverting portion 19. In (11), they are separated from their own weight and automatically reversed.

Accordingly, the PCB which is mounted with electronic parts is automatically transferred and heated to a certain temperature so that the PCB can be easily and easily inspected for the electrical mounting state of electronic parts. In addition to improving workability and productivity, the PCB mounted with electronic components can be automatically reversed to improve the efficiency of the lead cutting process of the next component.

Description

Heating and automatic transfer device of electronic component mounting board

1 is a configuration diagram illustrating a method for mounting an electronic component of a general PCB.

2 is a schematic configuration diagram of an electronic component mounting board heating and automatic transfer device according to the present invention.

3 is a side structure diagram of a substrate drying furnace of the present invention.

* Explanation of symbols for main parts of the drawings

1: board entry part 2: PCB

3, 18: substrate transfer conveyor 4: rodless cylinder

5: spring 6: stopper

7: connecting chain 8: guide plate

9, 9 ': sprocket wheel 10: substrate transfer unit

11 substrate insertion hole 12 drying furnace

13 substrate heating part 14 heat insulating material

15 heater 16: motor

17: blower fan 19: chain reversal unit

20: substrate turning part

The present invention is to test the soldering (soldering) state of the electronic components by heating the printed circuit board (hereinafter referred to as PCB) mounted by the automatic soldering machine to a certain temperature, and turn over the soldering test completed PCB The present invention relates to a heating and automatic transfer device of an electronic component mounting board which can be automatically transferred to improve the efficiency of the next process. In particular, a front and rear transfer cylinder is provided at one end of a substrate transfer conveyor that transfers a PCB placed on a jig pallet. On the upper side, a stopper installed in the spring is installed, and the PCB is inserted into a plurality of guide plates protruded from the chain. Since the completed PCB is automatically turned over and transported as a substrate transfer conveyor, the PCB on which the electronic components are mounted is automatically flipped over and damaged. It is heated to a certain temperature so that the mounting state of the electronic components of the PCB can be easily and easily inspected, and the defective board is found early before the assembly of the PCB to improve product reliability and productivity. Of course, the present invention relates to a heating and automatic transfer device for an electronic component mounting board, in particular, by automatically inverting and transporting a PCB on which an electronic component is mounted, thereby improving the efficiency of the next part lead cutting process.

In a generally known method of mounting an electronic component of a PCB, as shown in FIG. 1, the PCB 23 on which the electronic component 22 to be transferred through the substrate transfer conveyor 21 is mounted has a soldering machine 24. The electronic component 22 is fixed on the substrate while passing through, and the PCB 23 having completed the soldering operation is turned upside down to perform the lead cutting operation on the back surface of the mounted electronic component 22, and the lead cutting. The completed PCB 23 is to be assembled and assembled in a set by inspecting and adjusting the mounting state of the electronic component through the waveform inspection regulator of the PCB inspection unit 25.

However, when mounting the electronic component 22 of the PCB 23 as described above, the PCB 23 soldered through the soldering machine 24 is the lead of the electronic component 22 mounted by the worker flipping over one by one By performing the cutting operation, the work is cumbersome and the workability and productivity is deteriorated.

In addition, the PCB 23 is heated to a predetermined temperature through a heater before the inspection and adjustment of the substrate through the PCB inspection unit 25 to completely inspect the electrical mounting state of the electronic components, while on the substrate transfer conveyor 21 Since it is impossible to install a separate heater, the mounting state due to the soldering of the electronic component 22 cannot be properly inspected, thereby causing a defect of the PCB.

The present invention is to improve the various problems as described above, the purpose is to automatically transfer the PCB mounted electronic components while heating it to a certain temperature to easily and easily inspect the electronic mounting state of the electronic components of the PCB. In addition, early detection of defective substrates prior to assembly of the PCB set improves product reliability and improves workability and productivity, as well as automatically inverts and transfers the PCB on which electronic components are mounted to the back of the next electronic component. The present invention provides a heating and automatic transfer device for an electronic component mounting board that can further improve the efficiency of cutting the finished lead.

As a technical configuration for achieving the above object, the present invention, the front and rear transfer cylinder (rodless cylinder) is installed at one end of the substrate transfer conveyor to which the PCB is transferred, the stopper is installed in the spring is installed in the front and rear transfer cylinder tip A substrate entry part installed to insert the PCB into the guide plate communicated with the chain one by one;

A guide plate having a substrate insertion groove is placed on the shaft of the sprocket wheel and the connecting chain, and the PCB is inserted in the substrate insertion groove of the guide plate in a vertical direction. A substrate conveying portion which is placed perpendicular to and passes through the drying furnace;

Heater is rolled up to the upper side of the drying furnace in which the heat insulating material is installed on the periphery, the substrate heating unit which is installed on both sides of the heater and the blower fan that is extended to the motor is installed to heat the PCB transferred through the connection chain to a certain temperature;

A substrate transfer conveyor is installed at the rear of the drying furnace, and when the guide plate placed on the connecting chain enters the chain inversion part, the PCB is separated from its own weight in the substrate insertion groove and automatically reversed when the guide plate placed on the chain is inverted. By providing a heating and automatic transfer device of the electronic component mounting board including a portion.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a schematic configuration diagram of an electronic component mounting substrate heating and automatic transfer device according to the present invention, and FIG. 3 is a side structural view of a substrate drying furnace according to the present invention. The present invention provides a substrate entry part 1 and a substrate transfer part 10, It consists of the board | substrate heating part 13 and the board | substrate inversion part 20. As shown in FIG.

The substrate entry portion 1 for allowing the PCB 2 on which the electronic component is mounted to enter the drying furnace 12 includes a rodless cylinder 4 at one end of the substrate transfer conveyor 3 to which the PCB 2 is transferred. The stopper 6 installed in the spring 5 is installed at the tip of the rodless cylinder 4 to enter the PCB 2 into the connecting plate 7 and the guide plate 8 protruded. It is installed for insertion.

In addition, the substrate transfer part 10 which is vertically installed on the connection chain 7 and transfers the PCB 2 is inserted into the substrate insertion groove on the connection chain 7 which is extended from both sprocket wheels 9 and 9 '. A guide plate (8) having a (11) formed therein is placed, and a PCB (2) is inserted into the board insertion groove (11) of the guide plate (8) to be inserted in the vertical direction, and the guide in which the PCB (2) is fixed The diaphragm 8 is installed vertically on the connecting chain 7 so as to pass through the drying furnace 12.

In addition, in the substrate heating unit 13 which is installed to heat the PCB 2 to be transferred to a constant temperature, the heater 15 is rolled up above the drying furnace 12 in which the heat insulating material 14 is installed on the periphery. (15) Both sides of the motor 16 and the blower fan 17 is provided to be installed so that the PCB (2) transferred through the connection chain (7) for a constant temperature heating.

In addition, the substrate reversing unit 20 that performs the automatic turning (turning) operation of the PCB 2 inserted into the substrate insertion groove 11 of the guide plate 8, the rear of the drying furnace 12 The substrate transfer conveyor 18 is installed, and when the PCB 2 placed on the connecting chain 7 via the guide plate 8 enters the chain inverting portion 19, the PCB 2 enters the substrate insertion groove 11. It is composed of a configuration that is automatically turned upside down inside the weight.

Referring to the operation and effect of the present invention made of such a configuration as follows.

As shown in FIG. 2 and FIG. 3, when the PCB 2 on which the electronic components are mounted is transferred through the substrate transfer conveyor 3, the entry into the substrate entry portion 1 of the drying furnace 12 is completed. By the action of the rodless cylinder 4 below the substrate entry part 1, the stopper 6 installed on the spring 5 is moved forward and backward to connect the PCB 2 in the drying furnace 12. It is to be inserted into the guide plate 8 to be transported along the chain (7).

The guide plate 8, the substrate insertion groove 11 is formed on one side so that the PCB (2) is easily inserted, the guide plate 8 placed on the axis of the connecting chain (7) is a PCB (2) ) Is passed through the drying furnace 12 in a vertical position, wherein the drying furnace 12 is a blower fan 17 on both sides of the heater 15 soaked inside as shown in FIG. It is installed to heat the PCB 2 while maintaining the inside of the drying furnace 12 at a constant temperature.

Subsequently, the PCB 2, which is fixed to the guide plate 8 and transferred while being uniformly heated along the connection chain 7, is connected to the guide plate 18 on a substrate transfer conveyor 18 located behind the drying furnace 12. When (8) enters, the guide plate (8) is inverted and inclined integrally with the connecting chain (7) by the sprocket wheel (9 '), where the PCB (2) is separated from the substrate insertion groove (11) by its own weight It is located on the substrate transfer conveyor 18 in the upside down state.

Therefore, the PCB 2 that is automatically heated and inverted and completed to be transferred can easily perform a lead cutting process on the back side of the electronic component, which is the next process, and inspects an electronic component mounting state of the heated PCB 2. Therefore, it is possible to adjust the electrical connection of the PCB (2) early to be detected.

As described above, according to the heating and automatic transfer device of the electronic component mounting board according to the present invention, the electronic component is automatically transferred to the PCB while the electronic component is mounted and heated to a constant temperature to easily and easily inspect the electrical mounting state of the electronic component of the PCB. It will be possible to find the defective board early before assembly of the PCB set, improve the reliability of the product, improve the workability and productivity, as well as automatically turn over the PCB on which the electronic component is mounted. There is an excellent effect that can further improve the efficiency of the lead cutting process on the back.

Claims (1)

A rodless cylinder 4 is installed at one end of the substrate transfer conveyor 3 to which the PCB 2 is transferred, and a stopper 6 mounted on a spring 5 is installed at the tip of the rodless cylinder 4. The connecting chain 7 is connected to the sprocket wheels 9 and 9 'and the substrate entry part 1 installed to enter and insert the PCB 2 into the guide plate 8 communicated with the connection chain 7. A guide plate 8 having a substrate insertion groove 11 formed thereon is inserted into the substrate 7, and the PCB 2 is inserted into the substrate insertion groove 11 of the guide plate 8 in a vertical direction. The guide plate 8 on which the PCB 2 is fixed is installed vertically on the connecting chain 7 to be installed to pass through the drying furnace 12, and the heat insulating material 14 is installed on the periphery. The heater 15 is rolled up to the upper side of the drying furnace 12, and the blower fan 17, which is extended to the motor 16, is installed on both sides of the heater 15, and the PCB is transferred through the connection chain 7 (2). Come constant) PCB heating part 13 installed to be heated by a furnace, and a substrate conveying conveyor 18 at the rear of the drying furnace 12, and a PCB placed on a connecting chain 7 via a guide plate 8. When the (2) enters the chain inverting portion 19, the PCB (2) is characterized in that it comprises a substrate inverting portion 20 which is to be automatically turned over in the substrate insertion groove 11 is turned over automatically Heating and automatic transfer device of component mounting board.