KR960033191A - Heating and automatic reversing device of electronic component mounting board - Google Patents

Heating and automatic reversing device of electronic component mounting board Download PDF

Info

Publication number
KR960033191A
KR960033191A KR1019950003935A KR19950003935A KR960033191A KR 960033191 A KR960033191 A KR 960033191A KR 1019950003935 A KR1019950003935 A KR 1019950003935A KR 19950003935 A KR19950003935 A KR 19950003935A KR 960033191 A KR960033191 A KR 960033191A
Authority
KR
South Korea
Prior art keywords
pcb
guide plate
substrate
chain
heating
Prior art date
Application number
KR1019950003935A
Other languages
Korean (ko)
Other versions
KR0151975B1 (en
Inventor
최병희
Original Assignee
배순훈
대우전자 주식호사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 배순훈, 대우전자 주식호사 filed Critical 배순훈
Priority to KR1019950003935A priority Critical patent/KR0151975B1/en
Publication of KR960033191A publication Critical patent/KR960033191A/en
Application granted granted Critical
Publication of KR0151975B1 publication Critical patent/KR0151975B1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212Printed circuits or mounted components having integral heating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Attitude Control For Articles On Conveyors (AREA)

Abstract

본 발명은 전자부품이 실장된 PCB를 일정온도 가열하고, 이를 자동적으로 반전시킬 수 있도록 한 가열 및 자동 반전장치에 관한 것으로 그 기술적인 구성은, PCB(2)가 이송되는 기판이송 컨베이어(3)의 일단에 로드레스 실린더(4)가 설치되며, 상기 로드레스 실린더(4) 선단에는 스프링(5)에 탄설된 스토퍼(6)가 입설되어 연결체인(7)과 연설된 안내격판(8)내에 상기 PCB(2)를 진입시켜 삽입토록설치되며, 양측 스프라켓 휘일(9)(9')과 연서된 연결체인(7)상에 기판 삽입홈(11)이 형성된 안내격판(8)이 입설되며, 상기 안내격판(8)의 기판 삽입홈(11)내에 PCB(2)가 삽입되어 수직방향으로 입설되며, 상기 PCB(2)가 고정된 안내격판(8)이 연결체인(7)상에 수직으로 입설되어 건조로(12)를 통과토록 설치되고, 단열재(14)가 주연에 착설된 건조로(12)의 상측으로 히이터(15)가 횡설되며, 상기 히이터(15) 양측은 모터(16)와 연설된 송풍팬(17)이 설치되어 연결체인(7)을 통해 이송되는 PCB(2)를 일정온도 가열토록 하며, 상기 건조로(12)의 후방에 기판 이송 컨베이어(18)가 설치되고 연결체인(7)상에 안내격판(8)을 개재하여 입설된 PCB(2)가 체인 반전부(19)에 진입시 PCB(2)가 기판삽입홈(11)내에서 자중으로 이탈되어 자동으로 반전토록 되는 것이다. 이에 따라서, 전자부품이 실장된 PCB를 자동적으로 이송하며 이를 일정온도 가열하여 PCB가 전자부품 전기적 실장상태를 손쉽고, 용이하게 검사토록 하며, PCB의 세트 조립전에 불량기판을 조기 발견하여 제품의 신뢰성을 향상시키면서 작업성 및 생산성을 향상시킴은 물론, 전자부품이 실장된 PCB를 자동으로 반전시켜 차기 공전인 부품이면의 리이드 커팅 공정의 효율을 향상시킬 수 있는 것이다.The present invention relates to a heating and automatic reversing apparatus for heating a PCB on which an electronic component is mounted at a constant temperature and automatically inverting the PCB. The technical configuration of the present invention is a substrate transfer conveyor (3) to which a PCB (2) is transferred. A rodless cylinder 4 is installed at one end of the rodless cylinder 4, and a stopper 6 mounted on a spring 5 is installed at the tip of the rodless cylinder 4 in the guide plate 8 protruding from the connecting chain 7 to the end thereof. A guide plate 8 having a substrate insertion groove 11 formed therein is installed on the connection chain 7 connected to both sprocket wheels 9 and 9 'to enter and insert the PCB 2. The PCB 2 is inserted into the substrate insertion groove 11 of the guide plate 8 to be inserted in the vertical direction, and the guide plate 8 to which the PCB 2 is fixed is vertically mounted on the connection chain 7. The heater 15 is horizontally placed on the upper side of the drying furnace 12 in which the heat insulator 14 is installed on the periphery. On both sides of the heater 15, a blower fan 17, which is extended from the motor 16, is installed to allow heating of the PCB 2 transferred through the connection chain 7 to a predetermined temperature. The substrate transfer conveyor 18 is installed at the rear and the PCB 2 enters the chain inverting portion 19 when the PCB 2 entered through the guide plate 8 on the connection chain 7 enters the chain inverting portion 19. 11) it will be displaced to its own weight and automatically reversed. Therefore, it automatically transfers PCB mounted with electronic parts and heats it to a certain temperature so that PCB can easily and easily inspect the electrical mounting state of electronic parts. In addition to improving workability and productivity, the PCB mounted with electronic components can be automatically reversed to improve the efficiency of the lead cutting process for the next idle component.

Description

전자부품 실장기판의 가열 및 자동반전 장치Heating and automatic reversing device of electronic component mounting board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 따른 전자부품 실장기판 가열 및 반전장치의 개략 구성도,2 is a schematic configuration diagram of an electronic component mounting board heating and reversing apparatus according to the present invention;

제3도는 본 발명인 기판 건조로의 측면 구조도.3 is a side structure diagram of a substrate drying furnace of the present invention.

Claims (1)

PCB(2)가 이송되는 기판이송 컨베이어(3)의 일단에 로드레스 실린더(4)가 설치되며, 상기 로드레스 실린더(4) 선단에는 스프링(5)에 탄설된 스토퍼(6)가 입설되어 연결 체인(7)과 연설된 안내격판(8)내에 상기 PCB(2)를 진입시켜 삽입토록 설치되는 기판 진입부(1)와, 양측 스프라켓 휘일(9)(9')가 연설된 연결체인(7)상에 기판 삽입홈(11)이 형성된 안내격판(8)이 입설되며, 상기 안내격판(8)의 기판 삽입홈(11)내에 PCB(2)가 삽입되어 수직방향으로 입설되며, 상기 PCB(2)가 고정된 안내격판(8)이 연결체인(7)상에 수직으로 입설되어 건조로(12)를 통과토록 설치되는 기판 이송부(10)와, 단열재(14)가 주연에 착설된 건조로(12)의 상측으로 히이터(15)가 횡설되며, 상기 히이터(15) 양측에는 모터(16)와 연설된 송풍팬(17)이 설치되어 연결체인(7)을 통해 이송되는 PCB(2)를 일정온도 가열토록 설치되는 기판 가열부(13)와, 상기 건조로(12)의 후방에 기판 이송컨베이어(18)가 설치되고, 연결체인(7)상에 안내격판(8)을 개재하여 입설된 PCB(2)가 체인 반전부(19)에 진입시 PCB(2)가 기판 삽입홈(11)내에서 자중으로 이탈되어 자동으로 반전토록 되는 기판 반전부(20)를 포함하여 구성됨을 특징으로 하는 전자부품 실장기판의 가열 및 자동반전장치.A rodless cylinder 4 is installed at one end of the substrate transfer conveyor 3 to which the PCB 2 is transferred, and a stopper 6 mounted on a spring 5 is installed at the front end of the rodless cylinder 4. Substrate entry portion 1, which is installed to enter and insert the PCB 2 into the guide plate 8, which is communicated with the chain 7, and a connecting chain 7 on which both sprocket wheels 9, 9 'are spoken. A guide plate 8 having a substrate insertion groove 11 formed therein is inserted therein, and a PCB 2 is inserted into the substrate insertion groove 11 of the guide plate 8 to be inserted in the vertical direction. 2) a guide plate 8 fixed with a substrate transfer part 10 installed vertically on the connecting chain 7 to pass through the drying furnace 12, and a drying furnace in which the heat insulating material 14 is installed on the periphery. The heater 15 is rolled up to the upper side of the (12), and both sides of the heater (15) is provided with a motor (16) and a blowing fan (17) that is addressed to the PCB (2) which is transferred through the connection chain (7) Constant temperature The substrate heating part 13 which is installed so that the board | substrate, and the board | substrate conveying conveyor 18 are provided in the back of the said drying furnace 12, The PCB (2) installed in the connecting chain 7 via the guide plate 8 via the guide plate 8 is installed. The electronic component mounting board, characterized in that the PCB (2) includes a substrate inverting unit 20 which is to be automatically reversed by being separated into its own weight in the substrate insertion groove (11) when entering the chain inverting unit (19) Heating and automatic reversing device. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950003935A 1995-02-27 1995-02-27 Electronic component mounting board's heating and automatic sending device KR0151975B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950003935A KR0151975B1 (en) 1995-02-27 1995-02-27 Electronic component mounting board's heating and automatic sending device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950003935A KR0151975B1 (en) 1995-02-27 1995-02-27 Electronic component mounting board's heating and automatic sending device

Publications (2)

Publication Number Publication Date
KR960033191A true KR960033191A (en) 1996-09-17
KR0151975B1 KR0151975B1 (en) 1999-04-15

Family

ID=19408896

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950003935A KR0151975B1 (en) 1995-02-27 1995-02-27 Electronic component mounting board's heating and automatic sending device

Country Status (1)

Country Link
KR (1) KR0151975B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003067758A1 (en) * 2002-02-07 2003-08-14 Mirim Intellectual Robot Technology Co., Ltd Apparatus for automatic insertion of a base in fabrication of quartz oscillator
KR200447298Y1 (en) * 2009-04-01 2010-01-14 (주)엠티알 Manufacturing device for manufacturing of liquidcrystal device turning the glass and method fordriving the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101142169B1 (en) * 2009-09-29 2012-05-03 아메스산업(주) FPCB Unloader

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003067758A1 (en) * 2002-02-07 2003-08-14 Mirim Intellectual Robot Technology Co., Ltd Apparatus for automatic insertion of a base in fabrication of quartz oscillator
KR200447298Y1 (en) * 2009-04-01 2010-01-14 (주)엠티알 Manufacturing device for manufacturing of liquidcrystal device turning the glass and method fordriving the same

Also Published As

Publication number Publication date
KR0151975B1 (en) 1999-04-15

Similar Documents

Publication Publication Date Title
SE9802689D0 (en) Electrical device with a circuit board and method for fitting the device
FR2855933B1 (en) ELECTRIC HEATING DEVICE, IN PARTICULAR FOR A MOTOR VEHICLE
DE3865080D1 (en) HEATER.
FR2687617B1 (en) HEATING / COOLING DEVICE FOR ELECTRIC VEHICLE.
ES2291164T3 (en) AUTOMOTIVE VEHICLE LAMP.
KR880008425A (en) Heat treatment equipment
KR960033191A (en) Heating and automatic reversing device of electronic component mounting board
KR900002671A (en) Reflow Soldering Equipment
CN216531999U (en) SMT (surface mount technology) mounting process system for circuit board
CN211876672U (en) Automatic feeding and discharging oven with good heating effect
CN215893113U (en) Circuit board drying assembly line
JPS6434578A (en) Automatic soldering method and device for printed circuit board
JPS55156064A (en) Radiation device of infrared rays
CN213734070U (en) Paperboard UV ink drying device
KR100411992B1 (en) Anti-burr device
CN115348746A (en) A roast board machine for PCB board processing
JPS57147244A (en) Chip mounting device
KR960031307A (en) Connection conveyor for easy angle maintenance
JPS57130074A (en) Microwave heater
KR970058497A (en) Automatic reversing device of printed circuit board
KR910003176Y1 (en) Reflow soldering device
ES465159A1 (en) Heater for heating cleaning liquid for cleaning windshield glass of vehicle
CN115406211A (en) A roast board machine for PCB board processing
KR900000676A (en) Drying apparatus of microwave trans
JPH04339561A (en) Preheater for automatic soldering apparatus

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20010529

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee