JPS6434578A - Automatic soldering method and device for printed circuit board - Google Patents

Automatic soldering method and device for printed circuit board

Info

Publication number
JPS6434578A
JPS6434578A JP18992587A JP18992587A JPS6434578A JP S6434578 A JPS6434578 A JP S6434578A JP 18992587 A JP18992587 A JP 18992587A JP 18992587 A JP18992587 A JP 18992587A JP S6434578 A JPS6434578 A JP S6434578A
Authority
JP
Japan
Prior art keywords
plural
circuit board
printed circuit
hot blast
heat sources
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18992587A
Other languages
Japanese (ja)
Inventor
Hisashi Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIYAADE KK
Original Assignee
JIYAADE KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIYAADE KK filed Critical JIYAADE KK
Priority to JP18992587A priority Critical patent/JPS6434578A/en
Publication of JPS6434578A publication Critical patent/JPS6434578A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To solder a printed board in short time despite the size of an IC chip by arranging plural radiation type heat sources with reflection shades and plural hot blast blowers in the cover arranged on the conveyor transferring a printed board. CONSTITUTION:The plural heat sources 15 having a shade type reflection plate 17 are arranged inside a cover 21 of U shaped cross section, mounted on a freely traveling conveyor 1 arranged at the lower part thereof and the printed circuit board to be transferred is heated. As said heat source 15 a far infrared ray lamp, infrared ray lamp, harogen lamp, etc., are appropriate. Moreover plural duct type hot blast blowers 16 are arranged between said heat sources 15 and the air subjected to a temp. rise to the specified temp. by the heating heater 18 installed therein is blown toward the conveyor 1 from a lower injection nozzle 19. Thereafter this hot blast is exhausted from an upper exhaust duct 8 by an exhaust fan 7 and fed into said blower 16. The printed circuit board can be soldered in a short time.
JP18992587A 1987-07-29 1987-07-29 Automatic soldering method and device for printed circuit board Pending JPS6434578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18992587A JPS6434578A (en) 1987-07-29 1987-07-29 Automatic soldering method and device for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18992587A JPS6434578A (en) 1987-07-29 1987-07-29 Automatic soldering method and device for printed circuit board

Publications (1)

Publication Number Publication Date
JPS6434578A true JPS6434578A (en) 1989-02-06

Family

ID=16249504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18992587A Pending JPS6434578A (en) 1987-07-29 1987-07-29 Automatic soldering method and device for printed circuit board

Country Status (1)

Country Link
JP (1) JPS6434578A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04111388A (en) * 1990-08-30 1992-04-13 Fujitsu Ltd Manufacture of semiconductor device, and heating furnace

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057637A (en) * 1983-09-09 1985-04-03 Hitachi Ltd Soldering device for semiconductor element
JPS61289697A (en) * 1985-06-18 1986-12-19 松下電器産業株式会社 Soldering
JPS63180368A (en) * 1987-01-21 1988-07-25 Eiteitsuku Tekutoron Kk Method and device for reflow soldering

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057637A (en) * 1983-09-09 1985-04-03 Hitachi Ltd Soldering device for semiconductor element
JPS61289697A (en) * 1985-06-18 1986-12-19 松下電器産業株式会社 Soldering
JPS63180368A (en) * 1987-01-21 1988-07-25 Eiteitsuku Tekutoron Kk Method and device for reflow soldering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04111388A (en) * 1990-08-30 1992-04-13 Fujitsu Ltd Manufacture of semiconductor device, and heating furnace

Similar Documents

Publication Publication Date Title
JPS556118A (en) Control panel for microwave oven
CN1201118C (en) Cooling apparatus for microwave oven having lighting lamps
CA2059010A1 (en) Convection-radiant heated oven
NZ500723A (en) Space heater providing radiant and blown warm air to space beneath heater
EP0315762A3 (en) Continuous furnace for soldering electronic components
JPS6434578A (en) Automatic soldering method and device for printed circuit board
GB2015153A (en) Cooking Stoves
JPS5674367A (en) Soldering preheater
JPS55156064A (en) Radiation device of infrared rays
GB1582437A (en) Apparatus for drying ceramic articles
JPS6411396A (en) Curing furnace
JPH09237965A (en) Reflow furnace
CN108819500A (en) A kind of color press of drying device
JP3495205B2 (en) Heating equipment
JP3062699B2 (en) Printed circuit board reflow method and reflow furnace
KR910006604B1 (en) Hot water space heating apparatus
JPS5594442A (en) Heat treating furnace of upset pipe
JPS55120062A (en) Fixing device
JP2001308511A (en) Method and device for reflow soldering
JPS5749975A (en) Flash fixing device
JP2579931Y2 (en) Hot air preheater
JP2524628Y2 (en) Curing equipment
JPS6327810Y2 (en)
JPH04339561A (en) Preheater for automatic soldering apparatus
JPH0641718Y2 (en) Continuous reflow equipment