JPH0530848Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an automatic soldering device that automatically solders a board.

[Prior Art] A typical prior art will be described with reference to FIGS. 4, 5, and 6.

In the automatic soldering device 101 shown in FIG. 4, an endless chain 105 to which a pin 104 is fixed is wound around a pair of rotationally driven sprockets 102 and 103, and a pair of circumferential rails 107 and 108 are connected with a solder tank 106 in between. is provided and is locked to the pin 104 so as to be movable up and down, and the circumferential rails 107, 10
A carrier 109 is provided which is conveyed on the 8.

A board 110 to be soldered is placed on the carrier 109 upstream of the solder tank 106, and the carrier 109 is swung over the solder tank 106 by swinging parts 111 and 112 provided on the circumferential rails 107 and 108, respectively. By moving the substrate 1
10 is oscillated to solder it to the substrate 110, and the soldered substrate 110 is taken out from the carrier 109 downstream of the solder layer 106.

In the automatic soldering device 116 shown in FIG. 5, a pair of sprockets 117 and 118 that are rotationally driven are connected to conveying units 121 and 122 with a solder tank 123 in between, and an endless chain 120 having a pawl 119 fixed thereto is wound around the pair of sprockets 117 and 118. They are arranged symmetrically.

Both conveyance sections 121 and 122 are provided upstream of the solder layer.
The board 124 to be soldered is placed between the claws 119 of the solder tank 123, and the solder is blown up onto the board 124 on the solder tank 123 by blowing up the solder using a solder blowing device (not shown) provided in the solder tank 123. Soldering is performed, and the nails 11 are soldered downstream of the solder tank 123.
By separating the board 9, the soldered board 124 is discharged.

Furthermore, in the automatic soldering device 131 shown in FIG.
A pair of sprockets 132, 13 that are rotationally driven
Endless chain 13 with claws 134 fixed to 3
Conveying parts 136, 137 in which 5 is wrapped around
are arranged symmetrically with the solder tank 138 in between.

Upstream of the solder tank 138, both conveyance sections 136,
Board 139 to be soldered between claws 134 of 137
The board is placed on the solder tank 138 by swinging both the transport parts 136 and 137 as shown in FIG. 139 is swung to solder the board 139, and the board 139 that has been soldered is discharged.

[Problem to be solved by the invention] However, in the automatic soldering apparatus 101 of FIG. 4, the carrier 109 of the board 110 to be soldered is
The board 110 that has been set and soldered to
In most cases, a worker must take out the material from the carrier 109, resulting in poor work efficiency.
Further, although the removal can be performed using an automatic device, a separate dedicated device is required. Further, the width of the carrier 109 must be larger than the width of the substrate 110, and the width of the device must be increased by the width of the carrier 109 being larger than the width of the substrate 110.

In the automatic soldering device 116 shown in FIG.
9 is fixed to the chain 120, and the board 124 cannot be conveyed while being oscillated. Therefore, a solder blow-up device must be provided to blow up the solder, and the cost increases by the cost of this device. Also, because the specific gravity of the solder is high, it is difficult to blow up the solder, so if the lead wire length under the board is 25 mm or more, the lead wire will get caught in the solder blowing device, making it impossible to solder.

Furthermore, in the automatic soldering device 131 shown in FIG.
Since it is necessary to provide a swinging device for swinging the entire transport sections 136 and 137, the size of the device has increased.

An object of the present invention is to solve the above-mentioned technical problems and provide an automatic soldering device with improved workability without significantly increasing the size or cost of the device.

[Means for Solving the Problem] In order to achieve the above-mentioned problem, the automatic soldering device according to claim (1) includes a pair of sprockets that are rotationally driven and a pin that is fixed and wound around the pair of sprockets. sandwiching a solder tank, including an endless chain to be hung, a circumferential rail placed around the chain, and a hanger that is vertically movably locked to the pin and conveyed along the circumferential rail. A pair of conveyance sections arranged symmetrically in a plane are provided, and the circumferential rail includes: a main rail bent in the vertical direction on the solder tank; and a main rail that slides toward and away from one end of the main rail upstream of the solder layer. a slide rail that is slid toward and away from the other end of the main rail downstream of the solder layer; and a recovery rail that extends from the separation position of the downstream slide rail to the separation position of the upstream slide rail. It consists of.

The automatic soldering device according to claim (2) includes: a pair of sprockets that are rotationally driven; an endless chain to which a pin is fixed and wound around the pair of sprockets; and a circuit placed around the chain. a pair of conveyance sections disposed symmetrically across a solder tank, including a rail and a hanger that is vertically movably locked to the pin and conveyed along the circumferential rail, the circumferential rail being , a main rail that swings vertically on the solder tank, a slide rail that slides toward and away from one end of the main rail upstream of the solder layer, and a slide rail that slides toward and away from one end of the main rail downstream of the solder layer. It consists of a slide rail that slides toward and away from each other, and a collection rail that extends from the separated position of the slide rail on the downstream side to the separated position of the slide rail on the upstream side.

[Function] In the automatic soldering device according to claim (1), the upstream slide rail is brought close to one end of the main rail upstream of the solder tank, thereby narrowing the space between the hangers of both conveying sections and performing soldering. The soldering process is performed by holding the board to be processed and soldering the board by swinging it according to the bending of the main rail while holding the board, and separating the downstream slide rail from the other end of the main rail downstream of the solder layer. The space between the hangers of both transport parts is widened and the soldered boards are separated.

In the automatic soldering device according to claim (2), the upstream slide rail is brought close to one end of the main rail upstream of the solder tank, thereby narrowing the space between the hangers of both conveyance sections, and thereby allowing the substrates to be soldered to be soldered. The board is held in place while the board is held in place, and soldering is performed by swinging the board according to the swinging of the main rails.At the downstream of the solder layer, the downstream slide rail is separated from the other end of the main rail. Spread the space between the hangers in the transport section and separate the soldered boards.

[Example] Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a simplified perspective view of an automatic soldering device according to an embodiment of the present invention.

The automatic soldering device 1 includes transport sections 2 and 3. The transport section 2 and the transport section 3 are arranged symmetrically with the solder tank 4 in between. The conveyance section 2 includes a pair of sprockets 5 and 6, an endless chain 7 that is wound around the sprockets 5 and 6, and a single or plural pins (four shown) pins 8 that are fixed to the chain 7.
, a circumferential rail 13 consisting of a main rail 9, slide rails 10, 11, and a collection rail 12, and a single or plural hangers (four shown) 14.

The hanger 14 has a main body portion 16 having a groove portion 15.
, a holding part 18 having an engagement groove 17 that engages with the substrate 30 , a roller 19 provided on the main body part 16 ,
It consists of 20, 21, and 22. The pin 8 is loosely inserted into the groove 15 of the hanger 14. roller 19,
A circumferential rail 13 is inserted between 20, 21, and 22. Therefore, the hanger 14
It is fixed to be vertically movable and conveyed along the circumferential rail 13. The slide rails 10 and 11 are
It is slidably driven by actuators 23 and 24. This rail 9 has an inclined part 25 and a flat part 26.
and an inclined portion 27, and includes a swinging portion 28 bent in the vertical direction.

The conveyance section 3 is configured similarly to the conveyance section 2, and includes sprockets 31, 32 and a chain 33.
, a pin 34 , a circumferential rail 39 consisting of a main rail 35 , slide rails 36 and 37 and a collection rail 38 , and a hanger 40 . Further, the main rail 35 is configured similarly to the main rail 9. Further, the hanger 40 is configured similarly to the hanger 14. Furthermore, the slide rails 36 and 37 are
They are slidably driven by actuators 41 and 42, respectively.

The sprocket 5 and the sprocket 31 are driven to rotate in opposite directions (arrow 51 direction and arrow 52 direction) by a motor (not shown). With this, the chain 7, pin 8, and hanger 14
Chain 33 and pin 34 are aligned in the direction of arrow 51.
and the hanger 40 are rotated in the direction of arrow 52, respectively.

When the hangers 14 and 40 are moved from the collection rails 12 and 38 to the main rails 9 and 35, respectively, the arms of the actuators 23 and 41 are retracted and the collection rails 12 and 38 and the slide rail 10,
36 are linearly arranged, respectively, so that the hangers 14, 10 are connected to the collecting rails 12, 3.
8 to slide rails 10 and 36, respectively. Next, the arms of the actuators 23 and 41 are extended, respectively, and the slide rails 10 and 36 and the main rails 9 and 35 are respectively straightened, so that the hangers 14 and 40 are aligned with each other.
36 to the main rails 9 and 35, respectively. When the hangers 14 and 40 are moved from the slide rails 10 and 36 to the main rails 9 and 36, respectively, the arms of the actuators 23 and 41 are retracted, respectively.

When the hangers 14 and 40 are moved from the main rails 9 and 35 to the collection rails 12 and 38, respectively, the arms of the actuators 24 and 42 are extended, and the main rails 9 and 35 and the slide rails 11 and 37 are moved linearly, respectively. Therefore, hanger 1
4 and 40 are moved from the main rails 9 and 35 to the slide rails 11 and 37, respectively. Next, the arms of the actuators 24 and 42 are respectively retracted, and the slide rails 11 and 37 and the collection rails 12 and 38 are respectively straightened, and thereby the hanger 1
4 and 40 are moved from the slide rails 11 and 37 to the collection rails 12 and 38, respectively. hanger 14,
40 moves from the slide rails 11 and 37 to the recovery rails 12 and 38, respectively, the actuator 2
4 and 42 arms are each extended.

In the automatic soldering apparatus 1 configured as described above, the board 30 to be soldered is placed between the hangers 14 and 40 on the slide rail 10 and
When moving from 36 to main rails 9 and 35, respectively, it is held between these hangers 14 and 40. While the board 30 is being held, the hangers 14 and 40 are
It is transported to the swinging section 28 of the main rails 9, 35. At the inclined part 25 of the swinging part 28, the hanger 14,
40 slides on the pins 8 and 34 while the inclined portion 25
conveyed along the With this, the substrate 30
comes into sliding contact with the surface of the solder bath 4 from its tip. The hangers 14, 40 are then conveyed along the flat section 26. As a result, the entire substrate 30 comes into sliding contact with the surface of the solder bath 4. Furthermore, the hangers 14 and 40 are conveyed along the slope 27 while sliding on the pins 8 and 34. By this,
The substrate 30 begins to separate from the surface of the solder bath 4 from its tip, and later the rear end of the substrate 30 also separates from the solder bath 4. In this way, soldering is completed. The hangers 14 and 40 are transported from the main rails 9 and 35 to the slide rails 11 and 37, respectively, while holding the soldered board 30 between them. Next, since the hangers 14 and 40 are separated from each other, the board 30 that has been soldered is separated from the hangers 14 and 40. In this way, soldering to the board 30 is automatically performed.

FIG. 2 is a perspective view of another embodiment of the present invention. What should be noted in this embodiment is that in this automatic soldering device 60, the main rails 9 and 3 shown in FIG.
An actuator 6 for swinging the main rails 61, 62 in place of the swinging section 5
3, 64, 65, and 66, respectively. In this embodiment, parts corresponding to those in the embodiment of FIG. 1 are given the same reference numerals.

The hangers 14, 40 are the slide rails 10, 3
6 to the main rails 61, 62, the arms of the actuators 63, 64, 65, 66 are extended as shown in FIG. It is transported onto the solder bath 4 with the substrate 30 sandwiched therebetween. On the solder tank 4, the arms of the actuators 64 and 66 are shown in FIG.
The arms of actuators 63 and 65 are then retracted as shown in FIG. 3, and then the arms of actuators 64 and 66 are retracted as shown in FIG.
4, and then the arms of actuators 63, 65 are extended as shown in FIG. 3. This causes the hangers 14, 40 to
The substrate 30 is transported in the same manner as described in the illustrated embodiment, thereby completely soldering the substrate 30.

In addition, as another embodiment of the present invention, the swinging portion 28 may have a different shape so that the main rails 9, 35 can be bent in the vertical direction.

In addition, as another embodiment of the present invention, this rail 6
1 and 62 may be divided into a plurality of parts, and each of the divided main rails may be made to swing.

Further, the method of swinging the main rails 61 and 62 may be other methods.

[Effect of the invention] The automatic soldering device according to claim (1) includes: a pair of sprockets that are rotationally driven; an endless chain to which a pin is fixed and wound around the pair of sprockets; a pair of conveyance units disposed symmetrically across a solder bath, including a circumferential rail to be placed on the circumferential rail, and a hanger that is vertically movably locked to the pin and conveyed along the circumferential rail; The circumferential rail includes a main rail bent in the vertical direction above the solder bath, a slide rail that slides toward and away from one end of the main rail upstream of the solder layer, and a main rail bent in the vertical direction above the solder layer, and a slide rail that slides toward and away from one end of the main rail downstream of the solder layer. It consists of a slide rail that slides toward and away from the other end, and a recovery rail that extends from the separated position of the slide rail on the downstream side to the separated position of the slide rail on the upstream side.

Therefore, workability can be improved without increasing the size of the device or increasing the cost.

The automatic soldering device according to claim (2) includes: a pair of sprockets that are rotationally driven; an endless chain to which a pin is fixed and wound around the pair of sprockets; and a circuit placed around the chain. A pair of conveyance units arranged symmetrically across a solder tank, including a rail and a hanger that is vertically movably locked to the pin and conveyed along the circumferential rail, the circumferential rail comprising: A main rail that swings vertically above the solder bath, a slide rail that slides toward and away from one end of the main rail upstream of the solder layer, and a slide rail that slides close to and away from one end of the main rail downstream of the solder layer. It consists of a slide rail that slides away from each other, and a collection rail that extends from the separation position of the slide rail on the downstream side to the separation position of the slide rail on the upstream side.

Therefore, workability can be improved without increasing the size of the device or increasing the cost.
Further, by varying the amount of movement of the actuator that swings the rail, the amount of swing displacement and the angle of inclination can be freely set.

[Brief explanation of the drawing]

FIG. 1 is a simplified perspective view of an automatic soldering device according to one embodiment of the present invention, and FIG. 2 is a simplified perspective view of an automatic soldering device according to another embodiment of the present invention. FIG. 3 is a diagram for explaining the operation of the automatic soldering device shown in FIG. 2, and FIGS.
The figure is a simplified diagram of a conventional automatic soldering apparatus, and FIG. 7 is a diagram for explaining the operation of the automatic soldering apparatus of FIG. 6. 1,60...Automatic soldering device, 2,3...Transfer section, 4...Solder tank, 5,6,31,32...Sprocket, 7,33...Chain, 8,34...
... Pin, 9, 35, 61, 62 ... Main rail, 1
0, 11, 36, 37...Slide rail, 1
2,38... Collection rail, 13,39... Surrounding rail, 14,40... Hanger, 23,24,4
1, 42, 63-66...actuator, 28
... Swinging part, 30 ... Board.

Claims (1)

[Claims for Utility Model Registration] (1) A pair of rotationally driven sprockets, an endless chain to which a pin is fixed and wound around the pair of sprockets, and a revolving rail placed around the chain. and a hanger that is vertically movably engaged with the pin and is conveyed along the circumferential rail, and is disposed symmetrically across the solder bath, the circumferential rail comprising: A main rail bent vertically above the solder bath, a slide rail that slides toward and away from one end of the main rail upstream of the solder layer, and a slide rail that moves close to and away from the other end of the main rail downstream of the solder layer. It consists of a slide rail that slides in such a way that the slide rail is separated from the slide rail on the downstream side, and a collection rail that extends from the separation position of the slide rail on the downstream side to the separation position of the slide rail on the upstream side. By placing the hangers close to the ends, the space between the hangers of both transfer parts is narrowed, and the board to be soldered is held between them, and while the board is being held, the board is swung according to the bending of the main rail to perform soldering. An automatic soldering device characterized in that, in the downstream of a layer, the downstream slide rail is moved away from the other end of the main rail to widen the gap between the hangers of both conveying sections and separate the soldered boards. (2) a pair of sprockets that are rotationally driven; an endless chain to which a pin is fixed and wound around the pair of sprockets; a circumferential rail placed around the chain; and a rail that is movable up and down on the pin. a pair of conveyance parts arranged symmetrically across the solder bath, including a hanger that is latched to the solder bath and conveyed along the circumferential rail, and the circumferential rail swings in the vertical direction on the solder bath. A main rail that is moved, a slide rail that is slid toward and away from one end of the main rail upstream of the solder layer, and a slide that is slid toward and away from the other end of the main rail downstream of the solder layer. It consists of a rail and a recovery rail that extends from the separation position of the slide rail on the downstream side to the separation position of the slide rail on the upstream side. The board to be soldered is held by narrowing the gap between the hangers in the transport section, and soldering is performed by swinging the board in accordance with the swinging of the main rail while holding the board, and soldering is carried out on the downstream side of the solder layer. An automatic soldering device characterized in that by separating the slide rail from the other end of the main rail, the gap between the hangers of both conveying sections is widened and the soldered board is separated.