JPH0281052U - - Google Patents
Info
- Publication number
- JPH0281052U JPH0281052U JP14064689U JP14064689U JPH0281052U JP H0281052 U JPH0281052 U JP H0281052U JP 14064689 U JP14064689 U JP 14064689U JP 14064689 U JP14064689 U JP 14064689U JP H0281052 U JPH0281052 U JP H0281052U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- bath
- cleaning tank
- transports
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 5
- 230000004907 flux Effects 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Molten Solder (AREA)
Description
第１図ａ，ｂはこの考案の一実施例を示す平面
図と側面図、第２図はＩＣが収納されているケー
スを示す斜視図、第３図ａ，ｂはＩＣを搬送する
機構を示すもので、第３図ａは、第１図ｂのＸ部
の拡大側面図、第３図ｂは、第３図ａの―線
による断面図、第３図ｃは、第３図ｂの案内板の
他の形状を示す断面図、第４図ａ〜ｄは、第１図
ａ，ｂのはんだ槽の部分を示したもので、第４図
ａははんだ槽部分の拡大平面図、第４図ｂは、第
４図ａの―線による側断面図、第４図ｃは、
第４図ａの―線による側断面図、第４図ｄは
、第４図ａの―線による側断面図である。
図中、１はＩＣ用全自動はんだ付け装置、２は
ＩＣ、３はリード端子、４はケース、５は基台、
６は搬送レール、７は送出装置、８はエアシリン
ダ、９はロツド、１０は搬送チエン、１１はスプ
ロケツト、１２は爪、１３は取付板、１４は酸洗
浄槽、１５は水洗浄槽、１６はフラクサ、１７は
予備加熱器、１８ははんだ槽、１９は水洗浄槽、
２０は温水洗浄槽、２１は仕上洗浄槽、２２はヒ
ータ、２３は可動レール、２４は可動台、２５は
エアシリンダ、２６はロツド、２７は収納装置、
２８はエアシリンダ、２９はロツド、３０は爪、
３１は案内板、３２はスリツト、３３は押え板、
４１は噴流槽、４２ははんだ融液、４３はワイヤ
レール、４４はワイヤ、４５は支承具、４６は案
内板、４７はスリツトである。
Figures 1a and b are a plan view and side view showing an embodiment of this invention, Figure 2 is a perspective view of a case in which an IC is stored, and Figures 3a and b are a mechanism for transporting an IC. Figure 3a is an enlarged side view of the X part in Figure 1b, Figure 3b is a sectional view taken along the line - - in Figure 3a, and Figure 3c is an enlarged side view of the X section in Figure 3b. 4a to 4d, which are cross-sectional views showing other shapes of the guide plate, show the solder bath portions of FIGS. 1a and b, and FIG. 4a is an enlarged plan view of the solder bath portion. Figure 4b is a side sectional view taken along the line - in Figure 4a, and Figure 4c is a
FIG. 4a is a side sectional view taken along the line ---, and FIG. 4d is a side sectional view taken along the -- line in FIG. 4a. In the figure, 1 is a fully automatic IC soldering device, 2 is an IC, 3 is a lead terminal, 4 is a case, 5 is a base,
6 is a transport rail, 7 is a delivery device, 8 is an air cylinder, 9 is a rod, 10 is a transport chain, 11 is a sprocket, 12 is a pawl, 13 is a mounting plate, 14 is an acid cleaning tank, 15 is a water cleaning tank, 16 is a fluxer, 17 is a preheater, 18 is a soldering bath, 19 is a water cleaning bath,
20 is a hot water cleaning tank, 21 is a finishing cleaning tank, 22 is a heater, 23 is a movable rail, 24 is a movable table, 25 is an air cylinder, 26 is a rod, 27 is a storage device,
28 is an air cylinder, 29 is a rod, 30 is a claw,
31 is a guide plate, 32 is a slit, 33 is a holding plate,
41 is a jet tank, 42 is a solder melt, 43 is a wire rail, 44 is a wire, 45 is a support, 46 is a guide plate, and 47 is a slit.
Claims (1)
送させる搬送レールと、前記ＩＣを間欠的に搬送
する搬送チエンと、前記ＩＣにはんだ付けを行う
前に洗浄を行う酸洗浄槽および水洗浄槽と、洗浄
された前記ＩＣをフラツクス処理するフラクサと
、はんだ付け処理を施すはんだ槽と、はんだ付け
を行つた後の前記ＩＣを洗浄する水洗浄槽とを順
次配設した全自動はんだ付け装置において、前記
はんだ槽と対応する部分の前記搬送レールを切り
欠いて切欠部分を設け、この切欠部分に前記ＩＣ
を前記リード端子以外の部分において支持し滑動
させるための複数本のワイヤを平行に張架するこ
とにより形成したワイヤレールを設けたことを特
徴とするＩＣ用全自動はんだ付け装置。 A transport rail that transports an IC having lead terminals to be soldered; a transport chain that transports the IC intermittently; an acid cleaning tank and a water cleaning tank that perform cleaning before soldering the IC; In the fully automatic soldering apparatus, a fluxer for flux treatment of the cleaned IC, a soldering bath for performing soldering treatment, and a water cleaning bath for cleaning the IC after soldering are arranged in sequence. A notch is provided by cutting out the transport rail at a portion corresponding to the solder bath, and the IC is placed in this notch.
1. A fully automatic soldering device for IC, characterized in that a wire rail formed by stretching a plurality of wires in parallel is provided for supporting and sliding the IC at a portion other than the lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989140646U JPH0438528Y2 (en) | 1989-12-06 | 1989-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989140646U JPH0438528Y2 (en) | 1989-12-06 | 1989-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0281052U true JPH0281052U (en) | 1990-06-22 |
| JPH0438528Y2 JPH0438528Y2 (en) | 1992-09-09 |
Family
ID=31405011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989140646U Expired JPH0438528Y2 (en) | 1989-12-06 | 1989-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438528Y2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121131U (en) * | 1977-03-02 | 1978-09-27 | ||
| JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
| JPS5881561A (en) * | 1981-11-06 | 1983-05-16 | Tamura Seisakusho Co Ltd | Jig for aligning and supporting of object to be soldered |
| JPS58158992A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Solder treating device for electronic part |
-
1989
- 1989-12-06 JP JP1989140646U patent/JPH0438528Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121131U (en) * | 1977-03-02 | 1978-09-27 | ||
| JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
| JPS5881561A (en) * | 1981-11-06 | 1983-05-16 | Tamura Seisakusho Co Ltd | Jig for aligning and supporting of object to be soldered |
| JPS58158992A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Solder treating device for electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0438528Y2 (en) | 1992-09-09 |
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