JPS61235070A - Solder treating equipment - Google Patents

Abstract

PURPOSE:To perform efficiently and surely the cleaning and drying by a through automatic treatment by constituting of the solder dipping part of rotary type and the cleaning and drying part of rotary type having cleaning mechanism and drying mechanism. CONSTITUTION:The solder dipping part 1 has the structure of rotary type, receives at a receiving part 4 the electronic component fed from the feeding part 3 and clamps it by the clamping part 5. A flux is then coated by the flux coating part 6, the flux is removed from the lead by the flux removing part 7, the lead is heated by the preheating part 8 and the solder is dipped in the solder tank 9. It is then cleaned by three precleaning tanks 11-13 and delivered to the cleaning and drying part 2 via the delivery part 14. The cleaning and drying part 2 is of rotary part as well and the receiving part 19 receives the electronic component via the transfer part 18 from the solder dipping part 1, cleans in order in the cleaning tanks 20-23, dries with hot air at the drying part 25 via the water cutting mechanism 24 and releases from the releasing part 26 to the storing part 27.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a solder processing apparatus for electronic components, and in particular to a solder processing apparatus that is effective for use in solder dipping and cleaning and drying processing for leads or bumps of surface-mounted semiconductor devices. It is related to.

[Background technology]

When electronic components are mounted on a printed circuit board or the like, their leads or bumps are soldered to predetermined locations on the board.

Therefore, in order to improve the soldering properties of electronic component leads or bumps to a board, it is common practice to pre-dip them with solder to coat them with solder at the time of completion of manufacturing. Various devices are provided for performing such solder dipping.

By the way, when performing solder dipping, there are many different external structures depending on the electronic component, and when performing automatic integrated processing, it is necessary to prepare a holding mechanism that retains the structure of each type of electronic component. This requires extremely troublesome and difficult processing.

In particular, in recent years, as semiconductor devices have become more highly integrated, structures that were previously unavailable have appeared, increasing the cost of manufacturing and managing solder dipping equipment. has become an obstacle.

For example, recently, flat package type semiconductor devices and even plastic leaded chip carrier (PLCC) type semiconductor devices, in which lead tips are bent and surface-mounted, are being provided in order to achieve higher integration and lower costs. As a result, solder dipping to the leads tends to become more difficult.On the other hand, semiconductor devices that have completed the solder dipping device for the leads must be cleaned to remove solder residue, etc. and drying is required. Even in the cleaning and drying process, it is becoming difficult to automate the process due to changes in the pan cage structure.

Furthermore, the present inventors have discovered that conventionally, the solder dipping device and the cleaning/drying device are each configured as separate devices, which causes problems such as not only being unable to perform automatic soldering processing but also increasing the size of the structure. Ta.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a solder processing apparatus that can efficiently and reliably perform solder dipping to leads or bumps of electronic components, washing and drying through an integrated automatic process.

Another object of the present invention is to provide a compact and multi-functional solder processing device.

Still another object of the present invention is to provide a compact solder processing device that facilitates processing and improves efficiency.

[Summary of the invention]

The present invention incorporates both the solder dip section and the cleaning/drying section into one device as a rotary type structure, and while electronic components are transferred between these processing sections, not only the solder dipping section but also the cleaning and drying process is carried out consistently. It is possible to perform automatic processing, ensure efficient processing, and obtain a compact and multifunctional solder processing device.

In addition, a rotary mechanism that can rotate intermittently and move up and down is provided in the solder dipping section and the cleaning/drying section, and when the rotary mechanism is lowered, a different process is applied to each electronic component at each processing position, thereby making processing easier. Moreover, the efficiency can be improved and a compact structure can be obtained.

〔Example〕

FIG. 1 is a schematic overall plan view showing an embodiment of the solder processing apparatus of the present invention, FIG. 2 is a schematic cross-sectional view thereof, FIG. 3 is a cross-sectional view of the rotary mechanism of the solder dip part, and FIG. A side view of the clamp section, FIG. 5 is a partial sectional view of the drive section of the lifting section, FIG. 6 is a plan view of the pre-cleaning section, FIG. 7 is a sectional view thereof, and FIG.
The figure is a plan view of the transfer section, Figure 9 (al, (bl, te)
1 are A-A in FIG. 8, respectively.

BB and CC sectional views, FIG. 10 is also a partial sectional view of the transfer section, - FIG. 11 is a sectional view of the rotary mechanism of the washing and drying section, FIG. 12 is a plan view of the tray, and FIG. 13 14 is a plan view of the cleaning section, FIG. 14 is a sectional view thereof, FIG. 15 is a sectional view of the index drive section, FIG. 16 is a sectional view of the draining mechanism, and FIG.
Figure 7 is a schematic sectional view of the drying oven, Figure 18 (al, (bl)
1A and 1B are a perspective view and a sectional view, respectively, of a plastic leaded chip carrier type semiconductor device to which the present invention can be applied.

First, referring to FIG. 1 and FIG. 2, the solder processing apparatus of this embodiment has a compact integrated structure in which a solder dip section 1 and a cleaning/drying section 2 are provided together in one device. The system is configured so that each process can be fully automated with a single device.

The solder dip section 1 has a rotary type structure, and is used for handling electronic components supplied from the supply section 3, for example, in FIG.
(As shown in bl, there is a receiving section 4 that receives a so-called plastic leaded chip carrier type semiconductor device, a clamp section 5 that clamps an electronic component, and a lead protruding to the outside of the electronic component that is intermittently fed from the clamp section 5. A flux application section 6 that applies flux, a flux application section 7 that removes flux from the leads, a preheat section 8 that heats and activates the leads to improve solder leakage, and a preheated lead A solder tank 9 for dipping solder, an empty stage 10, and three pre-cleaning tanks 11 and 12 for pre-cleaning electronic components after solder dipping.
．． 13, a transfer section 14 that transfers pre-cleaned electronic components to a cleaning/drying section, and an empty stage 15.

These portions 4 to 15 are arranged in the circumferential direction at equal intervals of 30 degrees from each other.

A rotary mechanism 16 is located in the center of each of these parts 4 to 15, and as will be described later, this rotary mechanism 16 clamps the electronic components from above and below and intermittently rotates clockwise and raises and lowers them at 30 degree angles. Each of the sections 4 to 15 performs a predetermined process on the electronic component.

On the other hand, the washing and drying section 2 also has a rotary type structure,
The cleaning/drying section 2 of this embodiment, which is arranged in parallel on the same base 17 as the solder dip section 1, includes a receiving section 19 that receives electronic components from the delivery section 14 of the solder dip section 1 via the transfer section 18; Four cleaning tanks 20.21, 22.23 that sequentially clean electronic components, a draining mechanism 24 that removes residual moisture adhering to electronic components and cleaning jigs after cleaning, and a drying section 25 that dries electronic components with hot air. and a discharge section 26 that discharges electronic components into a storage section 27.

These portions 19 to 26 are arranged in the circumferential direction at equal intervals of 45 degrees from each other. A rotary mechanism 28 is located in the center of each of these parts 19 to 26, and as will be explained later, this rotary mechanism 28 stores electronic components in a jig or tray 29 in an aligned state and arranges them at every 45 degree angle. It rotates intermittently in a clockwise direction to perform predetermined processing on electronic components in each of the sections 19-26.

The rotary mechanism 16 of the solder dip part l has a structure that can rotate and move up and down, and as shown in FIG. , a hollow support 31, a bearing receiver 32, and a housing 3 attached to the upper part of the rotating shaft.
3, a disk 34 attached to the upper end of the rotating shaft 30 with a presser fitting 35, an air supply manifold 36, and a disk 3
4, and a lower cover 39 that is fixed to the support column 31 via a spacer 38. The rotary mechanism 16 can sequentially transport electronic components between the processing units 4 to 15 by intermittently rotating the rotating shaft 30 using a drive source.

In this case, in order to clamp the electronic components, clamp mechanisms 40 are provided at a total of 12 locations on the outer peripheral side of the rotary mechanism 16 corresponding to each of the processing sections 4 to 15. That is, as shown in FIGS. 3 and 4, the clamp mechanism 40 is connected to the manifold 36 via an air supply pipe 41, and includes a valve 43 held by a flange 42, and a valve 43 connected to the manifold 36 through an air supply pipe 41.
3, and a pair of clamp arms 46 that are opened and closed in the vertical direction by the rotary actuator 44 and clamp the electronic component 45 from above and below.
It has

This clamp arm 46 has a clamping surface that supports the electronic component 4.
By configuring the entire upper and lower surfaces of the electronic components 5 to be clamped from above and below, the heat of the solder is transferred to the electronic components 4 during solder dipping.
It is possible to prevent the conduction to the elements within 5 and the destruction of the elements.

The rotary mechanism 16 and the clamp mechanism 40 are entirely movable up and down. As shown in FIG. 5, the elevating part 47 for vertical movement includes an elevating cylinder 48, an elevating base 49, a bracket 51 attached to the upper end of the cylinder 48 with a mounting member 50, and fixed to this bracket 51. It consists of a guide shaft 52 and a bearing 53 into which the guide shaft 52 is inserted. By moving the rotary mechanism 7 and the clamp mechanism 40 up and down as a whole using the elevating section 47, the electronic components 45 held by the clamp mechanism 40 can be lowered to each processing device and subjected to required processing.

The lifting stroke of the lifting section 47 is indicated by S in FIG.

In order to enhance the cleaning effect by pre-cleaning the solder-dipped electronic components 45 before sending them to the cleaning/drying section 2, in this embodiment, each pre-cleaning tank 11, 12, 13 is arranged in a fan shape as shown in FIG. The electronic components 45 in this embodiment, which are arranged at equal intervals in the circumferential direction, are pre-cleaned simultaneously in one pre-cleaning tank, four at a time.

As shown in FIG. 7, the preliminary cleaning tanks 11, 12, and 13 have an ultrasonic cleaning tank structure with a vibrator 54 and an oscillator 55 at the bottom, and their height is constant. The electronic components 45 are preliminarily washed by being moved in and out of the washing water in each of the pre-washing tanks 11, 12, and 13 by the vertical movement of the clamp part 40 by the elevating part 47. Note that the reference numeral 56 is a wash water overflow pipe, and the reference numeral 57 is a water supply port.

As shown in FIGS. 8 to 10, the transfer section for transferring electronic components from the solder dipping section 1 to the washing and drying section 2 is transferred from the transfer section 14 to the cleaning and drying section 2 by a transfer means (not shown). A chute 58 on which the delivered electronic component 45 is placed;
A stopper 59 provided at the tip of the chute 58, a support bracket 60 and a support body 6 that support the chute 58.
1 and the electronic component 45 on the chute 58.
Above, there is a two-pronged fork-shaped transport claw 62 that transports eight pieces in two rows at a time from the left to the right in FIG. A vacuum chuck 64 vacuum-chucks electronic components 45, two rows at a time, eight in total, and transfers them into the holding holes 63 of the tray 29 of the receiving section 19. In addition, the code|symbol 65 is a water tank.

The rotary mechanism 28 of the cleaning/drying section 2 has a structure in which it can rotate intermittently in an index type and can move up and down like the rotary mechanism 16 of the solder dip section 1 described above, but the number of processing sections for cleaning and drying is 8. Therefore, the two intermittent rotation angles are 45 degrees. Furthermore, in the cleaning and drying section 2, the electronic component 45 is sequentially subjected to various processes such as cleaning and drying while being held in the holding hole 63 in the tray 29 as shown in FIG. This is different from case 1.

That is, as shown in FIG. 11, the rotary mechanism 28 of the washing/drying section 2 has a rotating shaft 6 driven, for example, clockwise by a drive source such as a motor 87 (FIG. 15), which will be described later.
6, a hollow support 67, a bearing receiver 68, a housing 69 attached to the upper part of the rotating shaft 66, and a disc attached to the upper end of the rotating shaft 66 with a presser metal fitting 71 and rotatable together with the rotating shaft 66. 70, a non-rotatable disk 75 which is fixed to the disk 70 and is attached to the upper part of a rotatable shaft 72 having a hollow lower part via a bearing 73 and a bearing case 74, an upper cover 76, and a support column. 6
7.

Furthermore, a support arm 78 for supporting the tray 29 is attached to the lower surface of the disc 70. Note that a lid 79 is provided on the tray 29 to prevent the electronic components 45 from flying out.

As the elevating section for vertically moving the cleaning/drying section 20 rotary mechanism 28 and the like as a whole, a structure similar to the elevating section 47 for elevating and lowering the solder dip section 1 described above can be used. With such an elevating section, the electronic components 45 in the tray 29 are immersed and cleaned in the cleaning water 80 of the cleaning tanks 20 to 23 as shown by the solid line in FIG. It can be raised from 80.

As shown in FIG. 13, the cleaning tanks 20, 21, 22, and 23 are arranged in a fan shape at equal intervals in the circumferential direction. The structure of the cleaning tanks 20 to 23 is an ultrasonic vibration type cleaning tank structure having a vibrator 81 and an oscillator 82, as shown in FIG. Note that the reference numeral 83 in FIG. 14 is a pipe for overflowing the wash water. Also, reference numeral 84.8 in FIG.
5 are a cleaning water supply port and a drain port, respectively.

As shown in FIG. 15, the index drive section 86 of the rotary mechanism 28 of the washing/drying section 2 includes a motor 87, spur gears 88 and 89 that mesh with each other, and a roller gear index 9.
0, a flange 91, and a base 92 to which these are attached.
and a cam portion 93 consisting of a 35 degree cam, a 90 degree cam, or the like.

Note that a mechanism similar to this index drive section 86 can be used as the index drive section of the solder dip section 1.

The drain mechanism 24 for removing residual moisture from the cleaned electronic components 45 is compressed against the electronic components 45 in the holding holes 63 of the tray 29 supported by the holding arms 78, as shown in FIG. It has a structure in which a pair of upper and lower air nozzles 94 are provided for injecting air. In addition, the code 95
96.97 is the frame and drain pipe.

By providing the draining mechanism 24, the electronic components 45 can be dried efficiently.

Further, as shown in FIG. 17, the drying section 25 includes a drying oven 101 having a blower 98, a heater 99, and an air pipe 100.

As shown in FIGS. 18A and 18B, the present invention can be applied to a PLCC type semiconductor device as shown in FIG. 18 as an example of the electronic component used in this embodiment. The PLCC type semiconductor device is made by bending the leads 45a extending in all directions around the package 45 inward toward the back surface of the package.Since the sides of this type of electronic component cannot be clamped, it is extremely difficult to handle it. However, according to this embodiment, it is possible to solder these electronic components extremely easily.

Next, the operation of this embodiment will be explained.

First, the electronic component 45 to be soldered is supplied from the supply section 3 to the receiving section 4 of the solder dip section 1, and is clamped from above and below by the clamp arm 46 of the clamp mechanism 40 provided in the rotary mechanism 16 in the clamp section 5.

After that, the rotary mechanism 16 is rotated at a predetermined angle, 3 in this embodiment.
By rotating clockwise by 0 degrees, electronic component 4
5 is transferred to the flux application section 6. Here, when the rotary mechanism 16 and the clamp mechanism 40 are lowered by the stroke S as a whole by the lifting cylinder 48 of the lifting section 47, the electronic component 45 held by the clamp arm 46
is immersed in a flux bath, and flux is applied to the leads 45a to improve solder leakage.

Next, the rotary mechanism 16 and the clamp mechanism 40 are raised to the raised position by the lifting cylinder 48, and then rotated by a predetermined angle and transferred to the flux removing section 7. In this flux removing section 7, the lifting cylinder 4 is
At step 8, the rotary mechanism 16 and the clamp mechanism 40 are lowered to remove excess flux, and then raised again, and the rotary mechanism 16 and the clamp mechanism 40 are entirely rotated intermittently at a predetermined angle. 45 is transferred to the Breheat section 8.

In this breech section 8 as well, the rotary mechanism 16 and the clamp mechanism 40 are lowered by the lifting cylinder 48 to preheat the lead 45a of the electronic component 45 and activate the flux, and then raised again.

Thereafter, the electronic component 45 is transferred to the position of the solder bath 9 by the intermittent rotation of the rotary mechanism 16, and at this position, the rotary mechanism 16 and the clamp mechanism 4 are moved by the lifting cylinder 48.
By lowering the lead 45a, the lead 45a is subjected to solder dipping.

At this time, by making the entire clamping surface of the clamp arm 46 contact and clamp the upper and lower surfaces of the electronic component 45, conduction of the heat of the solder to the elements within the electronic component 45 is controlled. Thermal destruction of the element is prevented.

The electronic component 45 that has been soldered is moved to the rotary mechanism 1.
6 and the clamp mechanism 40, the empty stage 10 is raised again, and further rotated intermittently by a predetermined angle.
sent to. In the empty stage IO, the electronic component 45
is lowered and raised as the rotary mechanism 16 and clamp mechanism 40 are lowered and raised as a whole in order to carry out each process in other processing parts, but the next process is performed without undergoing soldering process. is intermittently fed to the pre-cleaning position by a predetermined angle.

At the preliminary cleaning position, the electronic component 45 is first lowered and raised in the first preliminary cleaning tank 11 as the rotary mechanism 16 and the clamp mechanism 40 are lowered and raised. The electronic component 45 is immersed in cleaning water in the lowered position and is preliminarily cleaned with ultrasonic vibration energy from the oscillator 55 and the vibrator 54 . This preliminary cleaning operation is sequentially performed in the other preliminary cleaning tanks 12, 13 in the same manner following the preliminary cleaning tank 11.

The electronic component 45 that has been pre-washed in the last pre-wash tank 13 is sent to the delivery section 14 by the intermittent rotation of the rotary mechanism 16.

The electronic components 45 in the delivery section 14 are transferred onto the chute 58 of the transfer section 18 by a transfer means (not shown), and the electronic components 45 are transferred to the eighth column by two rows at a time, eight in total, by a forked conveyance claw 62.
It is sequentially transferred from left to right as seen in the figure, and is stopped at a predetermined position by a stopper 59.

A total of 16 electronic components 4 are transferred to a predetermined position on the chute 58 by performing the transfer operation using the transfer claw 62 twice.
5 is vacuum-adsorbed on its upper surface by a vacuum chuck 64, and transferred and stored in the holding hole 63 of the tray 29 waiting in the receiving section 19 of the washing and drying section 2.

Since the tray 29 is supported by a support arm attached to the rotary mechanism 28, the rotary mechanism 28 is rotated clockwise by the motor 87 at a predetermined angle, that is, in the case of the cleaning and drying section 2 of this embodiment, only 45 degrees. By intermittent rotation, it is transferred to the first cleaning tank 21 position.

In this cleaning tank 21, the electronic components 45 are immersed together with the tray 29 in the cleaning water 80 by lowering the rotary mechanism 28 as a whole using a lifting means (not shown) such as the lifting cylinder 4. , by applying ultrasonic vibration energy using the oscillator 82 and the vibrator 81.

The electronic components 45 after cleaning are raised to a predetermined position as the rotary mechanism 28 is raised, and then transferred to the next cleaning tank 21 by the intermittent rotation of the rotary mechanism 28.

The electronic components 45 in the cleaning tank 21 are operated and processed in the order of lowering, cleaning, and raising, as in the case of the cleaning tank 20, and are then sent to the third cleaning tank 22 and then to the fourth cleaning tank 23. Cleaning treatment is carried out in the same manner.

Therefore, the electronic component 45 in this embodiment is subjected to preliminary cleaning by the preliminary cleaning tanks 11, 12, 13 of the solder dip section 1 and cleaning by the cleaning tanks 20, 21, 22, 23 of the cleaning/drying section 2, thereby making it possible to solder Foreign matter such as dregs is reliably and thoroughly washed away.

After the cleaning process, the electronic components 45 are intermittently fed to the draining mechanism 24, and in the lowered position, compressed air is sprayed from the upper and lower air nozzles 94, thereby scattering and removing residual moisture etc. .

Thereafter, the electronic component 45 is intermittently sent to the drying section 25 and lowered, and is completely dried in the drying oven 101 by hot air blown from the blower 98 through the heater 99.

The electronic component 45 that has completed drying is intermittently fed to the discharge section 26, and then discharged and stored in the storage section 27 by a discharge means (not shown). Thereby, 1 for the electronic component 45
The solder dip and wash dry process of the cycle is completed.

The various processes in the solder dipping section 1 and the cleaning/drying section 2 described above are performed simultaneously in each processing section by sending the electronic components 45 to the processes in sequence. That is, for example, when the rotary mechanism 16 in the solder dip section 1 is lowered, all the electronic components 45 clamped by the respective clamp mechanisms 40 are lowered at the same time, but each undergoes different processing depending on the rotational position at that time. In addition, with the intermittent rotation of the rotary mechanism 16, each of them simultaneously undergoes different processes in the next process at the next processing position. This means that the cleaning and drying section 2
The same applies to the electronic components 45 of each processing section depending on the rotational position of the rotary mechanism 28, and the electronic components 45 of each processing section are simultaneously subjected to different processing, and by repeating the processing, the cleaning and drying is automatically completed in sequence.

Note that the present invention is not limited to the above embodiments,
Various other variations are possible.

For example, the number and arrangement of each processing section, the structure of the drive mechanism, etc. may be other than those described above.

〔effect〕

(1) A rotary type solder dip unit that performs solder dipping on electronic components sent from the supply unit, a cleaning mechanism that cleans solder-dipped electronic components delivered from this solder dip unit, and By comprising a rotary type cleaning and drying section having a drying mechanism for drying electronic components, solder dipping to leads of electronic components and cleaning and drying can be performed efficiently and reliably through integrated automatic processing.

(2) With the above-mentioned il+, both the solder dip part and the cleaning/drying part have a rotary structure, and the image processing part is integrated into one device, so it is compact and versatile. It is possible to obtain a solder processing device having functions.

(3) Even if the electronic component is a surface-mounted semiconductor device, soldering can be performed reliably.

(4) By holding the electronic component from above and below at least at the solder dip part with the holding surface of the holding member in contact with almost the entire top and bottom surfaces of the surface-mounted electronic component, heat from the solder can be removed. It can be conducted from the upper and lower surfaces to the elements in the electronic component, thereby preventing the elements from being destroyed.

(5) A rotary type solder dipping section that performs solder dipping on electronic components sent from the supply section, a cleaning mechanism that cleans solder-dipped electronic components delivered from this solder dipping section, and It consists of a rotary type washing and drying section that has a drying mechanism for drying electronic components.
The solder dip section is provided with a rotary mechanism that rotates intermittently around a rotation axis at predetermined angles and that can be raised and lowered, and is provided on the outside of this rotary mechanism in correspondence with each soldering position and that holds electronic components from above and below. The cleaning/drying section includes a rotary mechanism that rotates intermittently around a rotation axis at predetermined angles and can be raised and lowered, and a rotary mechanism provided outside the rotary mechanism corresponding to each cleaning/drying processing position. In addition, by being equipped with a support mechanism that holds the tray containing electronic components, it is possible to perform different processing on electronic components at the same time in each processing section by lowering the rotary mechanism. Processing is easy and efficient, and the structure can be compact.

[Brief explanation of the drawing]

FIG. 1 is a schematic overall plan view showing an embodiment of the solder processing apparatus of the present invention, FIG. 2 is a schematic cross-sectional view thereof, FIG. 3 is a cross-sectional view of the rotary mechanism of the solder dip part, and FIG. A side view of the clamp section, FIG. 5 is a partial sectional view of the drive section of the lifting section, FIG. 6 is a plan view of the pre-cleaning section, FIG. 7 is a sectional view thereof, and FIG.
The figure is a plan view of the transfer section, Figure 9 (al, (bl, Tc
) are A-A in Fig. 8, respectively. BB and CC sectional views, FIG. 1O is a partial sectional view of the transfer section, FIG. 1I is a sectional view of the rotary mechanism of the washing and drying section, FIG. 12 is a plan view of the tray, and FIG. 13 is a partial sectional view of the transfer section. A plan view of the cleaning section, FIG. 14 is a sectional view thereof, FIG. 15 is a sectional view of the index drive section, FIG. 16 is a sectional view of the draining mechanism, and FIG. 17 is a sectional view of the cleaning section.
The figure is a schematic sectional view of a drying oven, and FIGS. 18 (al and bl) are a perspective view and a sectional view, respectively, of a plastic leaded chip carrier type semiconductor device to which the present invention can be applied. 2... Washing and drying section, 3...
- Supply section, 4... Receiving section, 5... Clamping section, 6... Flux application section, 7... Flux removal section, 8... Preheating section, 9... Solder tank, 10・・・
・Empty stage, 11.12.13...Preliminary cleaning tank, 14...Delivery section, 15...Empty stage, 16
... Rotary mechanism, 17... Base, 18... Transfer section, 19... Receiving section, 20.21.22.
23...Cleaning tank, 24...Draining mechanism, 25...
・Drying section, 26... Discharging section, 27... Storage section, 28... Rotary mechanism, 29... Tray, 30.
...Rotating shaft, 31...Hollow support, 32...
・Bearing receiver, 33... Housing, 34... Disc, 35...
Holding metal fitting, 36... Manifold, 37... Upper cover, 38... Spacer, 39...
...Lower cover, 40...Clamp mechanism, 41...Air supply pipe, 42
...Flange, 43...Valve, 44...
Rotary actuator, 45... Electronic component, 46... Clamp arm, 47... Lifting section, 48... Lifting cylinder, 49... Lifting base, 5o... Mounting member, 51
... Placket, 52... Guide shaft, 53...
・Bearing, 54... Vibrator, 55... Oscillator, 56... Washing water overflow pipe, 57...
・Water supply port, 5th...Chute, 59...Stopper, 60...Support bracket, 61...Support body, 62...Transportation claw, 63.
...Holding hole, 64...Vacuum chuck, 65...Water tank, 66...
Rotating shaft, 67...Hollow support column, 68...Bearing receiver, 69...Housing, 70...Disc, 71...
Metal fittings, 72...Shaft, 73...Bearing, 74...Bearing case, 75...Disc, 76...Top cover, 7
7... Lower cover, 78... Support arm, 79...
... Lid, 80 ... Washing water, 81 ... Vibrator, 82 ... Oscillator, 83 ... Washing water overflow pipe, 84 ... Supply port, 8
5... Drain port, 86... Index drive unit, 87... Motor, 88.89... Spur gear, 90... Roller gear index, 91... Flange, 92... Base, 93・
...Cam part, 94...Air nozzle, 95...
Moisture removal section, 96... Frame, 97... Drain vibe, 98... Prower, 99... Heater, 100... Air pipe, 101... Drying oven.

Claims (12)

[Claims] (1) A rotary type solder dip unit that performs solder dipping on electronic components sent from the supply unit, a cleaning mechanism that cleans solder-dipped electronic components delivered from this solder dip unit, and A solder processing device consisting of a rotary type cleaning and drying section that has a drying mechanism for drying electronic components. (2) The solder dip section consists of a flux processing section and a solder tank arranged in the circumferential direction, and the electronic components in each processing section are processed while being intermittently fed around the rotation axis at predetermined intervals. A solder processing apparatus according to claim 1, characterized in that: (3) The solder processing apparatus according to claim 2, wherein the solder dip section is provided with a pre-cleaning section and a delivery section for electronic components to the cleaning mechanism downstream of the solder tank. . (4) The cleaning and drying section includes a plurality of ultrasonic cleaning tanks that clean the electronic components delivered from the solder dip section, and a drying section that dries the cleaned electronic components with hot air in the circumferential direction. 2. The solder processing apparatus according to claim 1, wherein the electronic components in each processing section are processed while being intermittently fed at predetermined intervals around a rotating shaft. (5) The soldering process according to claim 4, characterized in that a draining mechanism is provided between the last-stage cleaning tank and the drying oven to blow away residual moisture from the electronic components by jetting gas. Device. (6) The solder processing apparatus according to claim 1, wherein the electronic component is a surface-mounted semiconductor device. (7) The solder processing apparatus according to claim 6, wherein the semiconductor device is a plastic leaded chip carrier type semiconductor device. (8) The solder processing apparatus according to claim 6, wherein the electronic component at least in the solder dip portion is conveyed with its upper and lower surfaces sandwiched. (9) The solder processing apparatus according to claim 8, wherein the electronic component is held in a state in which the holding member for the electronic component is in contact with the top and bottom surfaces of the electronic component over almost the entire surface thereof. (10) The solder processing apparatus according to claim 6, wherein a plurality of electronic components in the cleaning/drying section are stored and transported in a tray having a plurality of storage holes. (11) A rotary type solder dipping section that performs solder dipping on electronic components sent from the supply section, a cleaning mechanism that cleans solder-dipped electronic components delivered from this solder dipping section, and The solder dip part consists of a rotary type washing and drying section having a drying mechanism for drying electronic components, and the solder dip section includes a rotary mechanism that rotates intermittently at predetermined angles around a rotation axis and can be raised and lowered, and a rotary mechanism outside the rotary mechanism. a rotary mechanism that is provided with a clamp mechanism that is provided in the part corresponding to each soldering processing position and that clamps the electronic component from above and below; and a solder processing apparatus comprising a support mechanism provided outside the rotary mechanism corresponding to each washing and drying processing position and holding a tray containing electronic components. (12) The solder processing apparatus according to claim 11, characterized in that the positions of each processing section, such as a solder dip section and a cleaning/drying section, are fixed.