JPS5210677A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5210677A
JPS5210677A JP50087758A JP8775875A JPS5210677A JP S5210677 A JPS5210677 A JP S5210677A JP 50087758 A JP50087758 A JP 50087758A JP 8775875 A JP8775875 A JP 8775875A JP S5210677 A JPS5210677 A JP S5210677A
Authority
JP
Japan
Prior art keywords
semiconductor device
heat
polysilicon
constructing
acquire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50087758A
Other languages
Japanese (ja)
Inventor
Masaharu Noyori
Isamu Kitahiro
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50087758A priority Critical patent/JPS5210677A/en
Publication of JPS5210677A publication Critical patent/JPS5210677A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To acquire a semiconductor device which does not fuse easily in excess electric current but connects easily by heat pressure, by forming a finger part with polysilicon which possesses superior heat-resisting properties and by constructing a metal projection on the top part.
COPYRIGHT: (C)1977,JPO&Japio
JP50087758A 1975-07-16 1975-07-16 Semiconductor device Pending JPS5210677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50087758A JPS5210677A (en) 1975-07-16 1975-07-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50087758A JPS5210677A (en) 1975-07-16 1975-07-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5210677A true JPS5210677A (en) 1977-01-27

Family

ID=13923835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50087758A Pending JPS5210677A (en) 1975-07-16 1975-07-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5210677A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146750A (en) * 1984-12-20 1986-07-04 太平洋セメント株式会社 Manufacture of gypsum board
US5188984A (en) * 1987-04-21 1993-02-23 Sumitomo Electric Industries, Ltd. Semiconductor device and production method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146750A (en) * 1984-12-20 1986-07-04 太平洋セメント株式会社 Manufacture of gypsum board
JPH0159991B2 (en) * 1984-12-20 1989-12-20 Onoda Cement Co Ltd
US5188984A (en) * 1987-04-21 1993-02-23 Sumitomo Electric Industries, Ltd. Semiconductor device and production method thereof

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