JPS5735363A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5735363A
JPS5735363A JP11028180A JP11028180A JPS5735363A JP S5735363 A JPS5735363 A JP S5735363A JP 11028180 A JP11028180 A JP 11028180A JP 11028180 A JP11028180 A JP 11028180A JP S5735363 A JPS5735363 A JP S5735363A
Authority
JP
Japan
Prior art keywords
spacer
copper
insulating spacer
contacted
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11028180A
Other languages
Japanese (ja)
Other versions
JPS5846177B2 (en
Inventor
Hiroyuki Akiyama
Hiroshi Itahana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11028180A priority Critical patent/JPS5846177B2/en
Publication of JPS5735363A publication Critical patent/JPS5735363A/en
Publication of JPS5846177B2 publication Critical patent/JPS5846177B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the gap between an insulating spacer and a spacer which is compressed by said insulating spacer due to a foreign material by providing a part made of soft metal at the end surface of the insulating spacer. CONSTITUTION:Heat radiating fins 6 for cooling are contacted with a semiconductor element 4. Wiring copper conductors 3 are contacted with the fins 4. Ceramic insulating spacers 1 are contacted with the conductors 3. Copper spacers 9 are provided between said insulating spacer 1 and a stack supporting part 2, and between the insulating spacer 1 and a spring supporting part 2. By holding both sides of the insulting spacer 1 with soft copper parts, the contact surface is kept in good condition even though the copper is deformed by the foreign material, and the crack of the ceramic spacer can be prevented.
JP11028180A 1980-08-13 1980-08-13 semiconductor equipment Expired JPS5846177B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11028180A JPS5846177B2 (en) 1980-08-13 1980-08-13 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11028180A JPS5846177B2 (en) 1980-08-13 1980-08-13 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5735363A true JPS5735363A (en) 1982-02-25
JPS5846177B2 JPS5846177B2 (en) 1983-10-14

Family

ID=14531706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11028180A Expired JPS5846177B2 (en) 1980-08-13 1980-08-13 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5846177B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079752U (en) * 1983-11-08 1985-06-03 株式会社東芝 Power semiconductor stack
JPS60169660A (en) * 1984-02-14 1985-09-03 Nippon Mining Co Ltd Combustivity improving method for diesel engine fuel
JP2017188622A (en) * 2016-04-08 2017-10-12 東芝三菱電機産業システム株式会社 Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079752U (en) * 1983-11-08 1985-06-03 株式会社東芝 Power semiconductor stack
JPS60169660A (en) * 1984-02-14 1985-09-03 Nippon Mining Co Ltd Combustivity improving method for diesel engine fuel
JPH0448938B2 (en) * 1984-02-14 1992-08-10 Nippon Mining Co
JP2017188622A (en) * 2016-04-08 2017-10-12 東芝三菱電機産業システム株式会社 Semiconductor device

Also Published As

Publication number Publication date
JPS5846177B2 (en) 1983-10-14

Similar Documents

Publication Publication Date Title
US4117508A (en) Pressurizable semiconductor pellet assembly
SE9600649D0 (en) Heat conductor device
EP0279601A3 (en) Electrical conductor arrangement
KR840007483A (en) Semiconductor device and manufacturing method
JPS5735363A (en) Semiconductor device
JPS55103746A (en) Semiconductor power supply assembly and method of manufacturing same
GB8308751D0 (en) Mounting of semiconductor devices
JPS5784157A (en) Resin seal type semiconductor device
MY132219A (en) Method of manufacturing a semiconductor device suitable for surface mounting
IT8520503A0 (en) APPARATUS AND METHOD FOR THE IMPROVED THERMAL COUPLING OF A SEMICONDUCTOR ENCLOSURE TO A COOLING PLATE AND THE INCREASED ELECTRICAL COUPLING OF THE ENCLOSURE CONDUCTORS ON MORE THAN ONE SIDE OF THE ENCLOSURE TO A CIRCUIT BOARD.
GB971703A (en) A semiconductor device
JPS6459841A (en) Semiconductor device
JPS6442135A (en) Semiconductor device
ES8402676A1 (en) Glass-molded semiconductor device.
JPS57120358A (en) Semiconductor device
JPS53110371A (en) Ceramic package type semiconductor device
JPS57182461A (en) Heat dissipating substrate
JPS56124249A (en) Semiconductor device
JPS5750439A (en) Semiconductor device
JPS5745974A (en) Pressure contact type semiconductor device
US4558257A (en) Travelling wave tube arrangements
JPS5513918A (en) Radiator
JPS57160138A (en) Lead frame for semiconductor device
EP0335589A3 (en) Device for cooling electrical and electronic equipment
JPS6419939A (en) Electric machine wiring