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Filing date
Publication date
Application filed by 日立電線株式会社filedCritical日立電線株式会社
Priority to JP3658882UpriorityCriticalpatent/JPS58140645U/en
Publication of JPS58140645UpublicationCriticalpatent/JPS58140645U/en
(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】[Brief explanation of the drawing]
図は本考案のＩＣリードフレームの一実施例を示す平面 図である。
１：機能部、２：アウターリード部。The figure is a plan view showing an embodiment of the IC lead frame of the present invention. 1: Functional section, 2: Outer lead section.
Claims (1)
【実用新案登録請求の範囲】[Scope of utility model registration request]ＩＣチップ用ＩＣリードフレームにおいて、前記ＩＣチ ップのグイボンディング部およびワイヤボンディングイ ンナーリード部とよりなる機能部にアルミニウムを被覆 し、アウターリ−ド部に鉛−錫合金あるいは鉛か錫をメ ッキしてなることを特徴とするＩＣＩＪ−ドフレーム。In an IC lead frame for an IC chip, a functional part consisting of a wire bonding part and a wire bonding inner lead part of the IC chip is coated with aluminum, and an outer lead part is plated with a lead-tin alloy or lead or tin. The ICIJ-de frame is characterized by the following.