JPS5524440A - Ceramic package - Google Patents

Ceramic package

Info

Publication number
JPS5524440A
JPS5524440A JP9690378A JP9690378A JPS5524440A JP S5524440 A JPS5524440 A JP S5524440A JP 9690378 A JP9690378 A JP 9690378A JP 9690378 A JP9690378 A JP 9690378A JP S5524440 A JPS5524440 A JP S5524440A
Authority
JP
Japan
Prior art keywords
thermal expansion
expansion coefficient
package body
arising
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9690378A
Other languages
Japanese (ja)
Inventor
Akio Inoue
Mitsuo Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9690378A priority Critical patent/JPS5524440A/en
Publication of JPS5524440A publication Critical patent/JPS5524440A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent cracks from arising on a package body by providing an intermediate material larger in thermal expansion coefficient than the package body on a junction of the package body and a base smaller in thermal expansion coefficient than that.
CONSTITUTION: A package body 1 of ceramic material and a base 2 consisting of a material smaller in thermal expansion coefficient than the body 1 like Mo are joined through an intermediate material 5 larger in thermal expansion coefficient than the package body 1 like copper which is inserted between the junctions 3, 3. Cracks can be prevented from arising on the body 1 because there works a compressive stress on the body 1 at cooling as a result, Since compressive stress works on the body 1 at all times, the heat generated on the element at operation may be something to improve fatigue strength against repeated load for tension of the body 1.
COPYRIGHT: (C)1980,JPO&Japio
JP9690378A 1978-08-08 1978-08-08 Ceramic package Pending JPS5524440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9690378A JPS5524440A (en) 1978-08-08 1978-08-08 Ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9690378A JPS5524440A (en) 1978-08-08 1978-08-08 Ceramic package

Publications (1)

Publication Number Publication Date
JPS5524440A true JPS5524440A (en) 1980-02-21

Family

ID=14177321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9690378A Pending JPS5524440A (en) 1978-08-08 1978-08-08 Ceramic package

Country Status (1)

Country Link
JP (1) JPS5524440A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6404333B1 (en) 1997-11-03 2002-06-11 Invotronics Manufacturing Gauge instrument for use in a motor vehicle

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102971A (en) * 1978-01-31 1979-08-13 Toshiba Corp Semiconductor device
JPS595978U (en) * 1982-07-01 1984-01-14 久原 要 Tennis referee counter

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102971A (en) * 1978-01-31 1979-08-13 Toshiba Corp Semiconductor device
JPS595978U (en) * 1982-07-01 1984-01-14 久原 要 Tennis referee counter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6404333B1 (en) 1997-11-03 2002-06-11 Invotronics Manufacturing Gauge instrument for use in a motor vehicle

Similar Documents

Publication Publication Date Title
JPS5524440A (en) Ceramic package
JPS5627988A (en) Semiconductor laser device
JPS5593230A (en) Soldering method for semiconductor device
JPS5285476A (en) Semiconductor wafer accommodating jig
JPS6486538A (en) Member for semiconductor device
JPS5662345A (en) Load frame and semiconductor device
JPS52117075A (en) Semiconductor device
JPS5394885A (en) Mount structure for semiconductor laser element
JPS5236980A (en) Heat sink for semiconductor devices
JPS5362093A (en) Fuel assembly
JPS5425165A (en) Semiconductor device
JPS53135579A (en) Liquid sealing semiconductor device
JPS5274951A (en) High temperature heat exchanger
JPS6473745A (en) Semiconductor device and manufacture thereof
JPS5655807A (en) Displacement converter of semiconductor-bonding type
JPS5512730A (en) Semiconductor device
JPS55104445A (en) Manufacture of composite material
JPS5334162A (en) Relieving method for thermal stress in connecting part in appliance of double structure for high temperature and the like
JPS52135667A (en) Dicing method of semiconductor wafer
JPS5350674A (en) Semiconductor device
JPS5419364A (en) Semiconductor device
JPS55113321A (en) Jig for heat treatment
JPS52155458A (en) Forcible cooling type tubulated plate structure in heat exchante
JPS57210648A (en) Semiconductor device
JPS52129291A (en) Semiconductor laser device