JPS56140633A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPS56140633A JPS56140633A JP4429480A JP4429480A JPS56140633A JP S56140633 A JPS56140633 A JP S56140633A JP 4429480 A JP4429480 A JP 4429480A JP 4429480 A JP4429480 A JP 4429480A JP S56140633 A JPS56140633 A JP S56140633A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductor
- resin
- pellet
- silver paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/838—Bonding techniques
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- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To prevent the impossibility of connections to occur on a conductor due to the oozing out of the solvent of silver paste by covering the surrounding of the part to which a pellet of a thin-film substrate is connected by an Si series resin. CONSTITUTION:A Ta thin film resistor 2, a Ta thin film capacitor 3, and a conductor pattern 4 are formed on an insulating substrate 1. Then the Si series resin 5 is printed on a specified part of a substrate 1. Then, after the resin 5 is hardened, the silver paste 6 is applied in the pattern wherein the resin 5 is printed, and the semiconductor pellet 7 is mounted. Then, the silver paste is hardened, and the pellet 7 is bonded to the substrate 1. Thereafter, the pellet 7 and the conductor on the substrate 1 are connected and wired by a gold wire 8 by the wire bonding method. Since a dam of the resin 5 is formed beforehand on the specified part on the substrate 1, the phenomena such that the solvent of the silver paste is ozzed out to the surface of the conductor and the connections on the conductor is rendered impossible can be eliminated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4429480A JPS56140633A (en) | 1980-04-04 | 1980-04-04 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4429480A JPS56140633A (en) | 1980-04-04 | 1980-04-04 | Electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56140633A true JPS56140633A (en) | 1981-11-04 |
Family
ID=12687482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4429480A Pending JPS56140633A (en) | 1980-04-04 | 1980-04-04 | Electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56140633A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63244648A (en) * | 1987-03-30 | 1988-10-12 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS63187330U (en) * | 1987-05-25 | 1988-11-30 | ||
JPH01205032A (en) * | 1988-02-09 | 1989-08-17 | Nippon Steel Corp | Manufacture of high-strength electric resistance welded tube for automobile use |
JPH01130552U (en) * | 1988-02-29 | 1989-09-05 | ||
JPH0897533A (en) * | 1994-09-22 | 1996-04-12 | Ibiden Co Ltd | Electronic part mounting device |
US8378555B2 (en) | 2009-10-23 | 2013-02-19 | Murata Manufacturing Co., Ltd. | Electromechanical conversion element and actuator |
-
1980
- 1980-04-04 JP JP4429480A patent/JPS56140633A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63244648A (en) * | 1987-03-30 | 1988-10-12 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS63187330U (en) * | 1987-05-25 | 1988-11-30 | ||
JPH01205032A (en) * | 1988-02-09 | 1989-08-17 | Nippon Steel Corp | Manufacture of high-strength electric resistance welded tube for automobile use |
JPH01130552U (en) * | 1988-02-29 | 1989-09-05 | ||
JPH0897533A (en) * | 1994-09-22 | 1996-04-12 | Ibiden Co Ltd | Electronic part mounting device |
US8378555B2 (en) | 2009-10-23 | 2013-02-19 | Murata Manufacturing Co., Ltd. | Electromechanical conversion element and actuator |
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