JPS56104454A - Sealing method of semiconductor element - Google Patents
Sealing method of semiconductor elementInfo
- Publication number
- JPS56104454A JPS56104454A JP746280A JP746280A JPS56104454A JP S56104454 A JPS56104454 A JP S56104454A JP 746280 A JP746280 A JP 746280A JP 746280 A JP746280 A JP 746280A JP S56104454 A JPS56104454 A JP S56104454A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- resin
- sealing resin
- semiconductor element
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
PURPOSE:To equalize the thickness of the sealing resin and the flowout of the resin by surrounding the part corresponding to the sealing region of the semiconductor element with a frame and filling the resin therein. CONSTITUTION:The semiconductor element 6 such as an LSI or the like is placed on an insulating substrate 4, and the internal terminal 52 is connected to the external terminal 5 via a gold wire 5. The frame 7 of predetermined size is set as indicated by a broken line within the region designated by two one-dotted broken lines. The circuit body and the frame surface are fitted with normal temperature curable epoxy resin adhesive. Subsequently, the sealing resin is filled in the frame 7. Thus, the sealed part is not raised highly due to the surface tension of the sealing resin, but uniformly formed in a thin thickness. The molten sealing resin is flowed out to the external terminal due to the presence of the frame to prevent the occurrence of improper solder of the external terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP746280A JPS56104454A (en) | 1980-01-24 | 1980-01-24 | Sealing method of semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP746280A JPS56104454A (en) | 1980-01-24 | 1980-01-24 | Sealing method of semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56104454A true JPS56104454A (en) | 1981-08-20 |
Family
ID=11666474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP746280A Pending JPS56104454A (en) | 1980-01-24 | 1980-01-24 | Sealing method of semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56104454A (en) |
-
1980
- 1980-01-24 JP JP746280A patent/JPS56104454A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6436496A (en) | Carrier element incorporated into identification card | |
JPS5731166A (en) | Semiconductor device | |
JPS56122156A (en) | Lead frame for semiconductor device | |
JPS56104454A (en) | Sealing method of semiconductor element | |
JPS5763850A (en) | Semiconductor device | |
JPS57112055A (en) | Integrated circuit package | |
JPS6484651A (en) | Semiconductor device | |
JPS6175549A (en) | Electronic circuit including semiconductor element and manufacture of the same | |
JPS56140633A (en) | Electronic device | |
JPS57136352A (en) | Semiconductor device of resin potted type | |
JPS5795651A (en) | Semiconductor device | |
JPS642399A (en) | Semiconductor device | |
JPS5776867A (en) | Semiconductor device | |
JPS5710951A (en) | Semiconductor device | |
JPS55138240A (en) | Manufacture of semiconductor device | |
JPS55158653A (en) | Hybrid integrated circuit device | |
JPS5636145A (en) | Thin semiconductor integrated circuit device and its manufacture | |
JPS5718348A (en) | Integrated circuit device | |
JPS556862A (en) | Mounting structure of ic for electronic timepiece | |
JPS572537A (en) | Semiconductor device | |
JPS6455291A (en) | Integrated circuit device | |
JPS6436055A (en) | Method of sealing electronic component | |
JPS57187955A (en) | Sealing structure of semiconductor element | |
JPS5778156A (en) | Semiconductor integrated circuit sealing device | |
JPS5752158A (en) | Composite semiconductor device |