JPH04296088A - Thick film hybrid integrated circuit device - Google Patents
Thick film hybrid integrated circuit deviceInfo
- Publication number
- JPH04296088A JPH04296088A JP10502791A JP10502791A JPH04296088A JP H04296088 A JPH04296088 A JP H04296088A JP 10502791 A JP10502791 A JP 10502791A JP 10502791 A JP10502791 A JP 10502791A JP H04296088 A JPH04296088 A JP H04296088A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thick film
- integrated circuit
- hybrid integrated
- screen printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000007650 screen-printing Methods 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 239000011241 protective layer Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 abstract description 7
- 230000001681 protective effect Effects 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 238000009966 trimming Methods 0.000 abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920001225 polyester resin Polymers 0.000 abstract description 2
- 239000004645 polyester resin Substances 0.000 abstract description 2
- 229920002050 silicone resin Polymers 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 2
- 239000010408 film Substances 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、厚膜混成集積回路体に
関し、特に、最上層に保護層を形成した厚膜混成集積回
路体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film hybrid integrated circuit, and more particularly to a thick film hybrid integrated circuit having a protective layer formed on the top layer.
【０００２】0002
【従来の技術】従来の一般的なスクリーン印刷法を用い
た厚膜混成集積回路体の製造方法を図２（（ａ）〜（ｆ
））を用いて説明する。[Prior Art] A method for manufacturing a thick film hybrid integrated circuit using a conventional general screen printing method is shown in FIGS.
)).
【０００３】まず、９６％アルミナセラミック基板１（
ａ）上に、スクリーン印刷法によって金属導体配線２を
形成し（ｂ）、その後、同様の方法により、厚膜抵抗体
３を形成し（ｃ）、保護ガラス４等を形成する（ｄ）。First, a 96% alumina ceramic substrate 1 (
a) Metal conductor wiring 2 is formed thereon by screen printing (b), then thick film resistor 3 is formed by the same method (c), and protective glass 4 etc. are formed (d).
【０００４】次に、抵抗体トリミングを行い、抵抗値を
調整したのち、部品６の搭載および端子７の取り付けを
行う（ｅ）。Next, after trimming the resistor and adjusting the resistance value, parts 6 are mounted and terminals 7 are attached (e).
【０００５】そして、最後に、有機樹脂中に厚膜印刷基
板全体を浸漬し、保護コーティング５を行い（ｆ）厚膜
混成集積回路体を製造する。Finally, the entire thick film printed board is immersed in an organic resin and a protective coating 5 is applied to produce a thick film hybrid integrated circuit (f).
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、この従
来の厚膜混成集積回路体では、有機樹脂の保護コート５
を浸漬法により形成するため、有機樹脂を大量に使用し
なければならないことになり、それだけコスト高になっ
ているという問題点があった。[Problems to be Solved by the Invention] However, in this conventional thick film hybrid integrated circuit, the organic resin protective coat 5
Since it is formed by a dipping method, a large amount of organic resin must be used, which raises the problem of increased costs.
【０００７】本発明は、上記の問題点にかんがみてなさ
れたもので、有機樹脂を大量に使用しなくても保護層を
形成することができるようにした厚膜混成集積回路体の
提供を目的とする。The present invention has been made in view of the above problems, and aims to provide a thick film hybrid integrated circuit body in which a protective layer can be formed without using a large amount of organic resin. shall be.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
本発明の厚膜混成集積回路は、最上層にスクリーン印刷
法を用いて形成した有機樹脂の保護層を有するものであ
る。Means for Solving the Problems In order to achieve the above objects, the thick film hybrid integrated circuit of the present invention has an organic resin protective layer formed by screen printing as the uppermost layer.
【０００９】[0009]
【作用】上記構成からなる厚膜混成集積回路体によれば
、有機樹脂の保護層はスクリーン印刷法により形成され
るので、不必要な有機樹脂の使用がなくなる。[Function] According to the thick film hybrid integrated circuit having the above structure, the organic resin protective layer is formed by screen printing, thereby eliminating the need for unnecessary use of organic resin.
【００１０】0010
【実施例】以下、本発明の実施例について図面を参照し
て説明する。Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.
【００１１】図１（（ａ）〜（ｆ））は本発明の一実施
例に係る厚膜混成集積回路体の製造工程を示す図である
。FIGS. 1(a) to 1(f) are diagrams showing the manufacturing process of a thick film hybrid integrated circuit according to an embodiment of the present invention.
【００１２】実施例に係る厚膜混成集積回路体は、図１
の（ｆ）に示すように、セラミック基板１上に金属導体
配線２，厚膜抵抗体３および保護ガラス４を設け、これ
らの上に有機樹脂５の保護層を設けてある。この有機樹
脂５は、スクリーン印刷法により形成されている。The thick film hybrid integrated circuit body according to the embodiment is shown in FIG.
As shown in (f), a metal conductor wiring 2, a thick film resistor 3, and a protective glass 4 are provided on a ceramic substrate 1, and a protective layer of an organic resin 5 is provided thereon. This organic resin 5 is formed by a screen printing method.
【００１３】この厚膜混成集積回路体は以下のようにし
て製造される。This thick film hybrid integrated circuit body is manufactured as follows.
【００１４】まず、９６％アルミナセラミック基板１（
ａ）上にスクリーン印刷法により金属導体配線２を形成
する（ｂ）。この金属導体の材料としては、金，銀，銀
−パラジウム，銀−白金，銅，ニッケル等があるが、本
実施例では銀−白金（Ａｇ−Ｐｔ）導体を使用している
。First, a 96% alumina ceramic substrate 1 (
a) Metal conductor wiring 2 is formed on top by screen printing method (b). Materials for this metal conductor include gold, silver, silver-palladium, silver-platinum, copper, and nickel, but in this embodiment, a silver-platinum (Ag-Pt) conductor is used.
【００１５】次に、厚膜抵抗体３および保護ガラス４を
同様の方法により形成する（ｃ）（ｄ）。このとき、厚
膜抵抗体３の抵抗値は目標値の７０％程度に設計してお
き、残りの３０％程度はレーザートリミング法により調
整する。Next, the thick film resistor 3 and the protective glass 4 are formed by the same method (c) and (d). At this time, the resistance value of the thick film resistor 3 is designed to be approximately 70% of the target value, and the remaining approximately 30% is adjusted by laser trimming.
【００１６】次に、有機樹脂５を同様のスクリーン印刷
法により形成する（ｅ）。有機樹脂５の材料としては、
エポキシ樹脂，ウレタン樹脂，シリコン樹脂，フェノー
ル樹脂，ポリエステル樹脂等があり、用途に応じて使い
分けることができる。本実施例では、エポキシ系樹脂を
使用している。Next, organic resin 5 is formed by a similar screen printing method (e). As the material of the organic resin 5,
There are epoxy resins, urethane resins, silicone resins, phenol resins, polyester resins, etc., and they can be used depending on the purpose. In this embodiment, epoxy resin is used.
【００１７】最後に部品６搭載および端子７取り付けを
行い、厚膜混成集積回路を製造する。この厚膜混成集積
回路は、有機樹脂５の保護層をスクリーン印刷法で形成
してあるので、有機樹脂５の層厚が例えば３０μｍ程度
に薄くなっており、樹脂の材料費が従来方法に比較して
半分以下に低減されている。Finally, parts 6 are mounted and terminals 7 are attached to produce a thick film hybrid integrated circuit. In this thick film hybrid integrated circuit, the protective layer of the organic resin 5 is formed by screen printing, so the layer thickness of the organic resin 5 is reduced to, for example, about 30 μm, and the material cost of the resin is lower than that of the conventional method. has been reduced by more than half.
【００１８】[0018]
【発明の効果】以上説明したように本発明の厚膜混成集
積回路体によれば、スクリーン印刷法を用いて形成した
有機樹脂の保護層を設けたので、簡素化でき、樹脂の使
用量を大幅に削減でき、樹脂材料費を半分以下に低減す
ることができるという効果がある。[Effects of the Invention] As explained above, according to the thick film hybrid integrated circuit of the present invention, since the protective layer of organic resin is formed using the screen printing method, it can be simplified and the amount of resin used can be reduced. This has the effect of significantly reducing the cost of resin materials by more than half.
【図１】本発明の一実施例に係る厚膜混成集積回路体の
製造工程を示す図である。FIG. 1 is a diagram showing a manufacturing process of a thick film hybrid integrated circuit according to an embodiment of the present invention.
【図２】従来の厚膜混成集積回路体の製造工程を示す図
である。FIG. 2 is a diagram showing a manufacturing process of a conventional thick film hybrid integrated circuit body.
１ セラミック基板 ２ 金属導体配線 ３ 厚膜抵抗体 ４ 保護ガラス ５ 有機樹脂 ６ 実装部品 ７ 入出力端子 1 Ceramic substrate 2 Metal conductor wiring 3 Thick film resistor 4 Protective glass 5 Organic resin 6 Mounted parts 7 Input/output terminal
Claims (1)
膜印刷配線基板を使用した厚膜混成集積回路体において
、最上層にスクリーン印刷法を用いて有機樹脂の保護層
を形成したことを特徴とする厚膜混成集積回路体。Claim 1: In a thick film hybrid integrated circuit using a thick film printed circuit board having metal conductor wiring and thick film resistors, a protective layer of organic resin is formed on the top layer using a screen printing method. Characteristic thick film hybrid integrated circuit body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10502791A JPH04296088A (en) | 1991-03-25 | 1991-03-25 | Thick film hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10502791A JPH04296088A (en) | 1991-03-25 | 1991-03-25 | Thick film hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04296088A true JPH04296088A (en) | 1992-10-20 |
Family
ID=14396556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10502791A Pending JPH04296088A (en) | 1991-03-25 | 1991-03-25 | Thick film hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04296088A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5996219A (en) * | 1997-01-31 | 1999-12-07 | The Board Of Trustees Of The Leland Stanford Junior University | Method for embedding electric or optical components in high-temperature metals |
| WO2006032836A1 (en) * | 2004-09-22 | 2006-03-30 | Vetco Gray Controls Limited | Thick-film hybrid production process |
| WO2012167009A1 (en) * | 2011-06-03 | 2012-12-06 | Cree, Inc. | Thin film resistor and method for its production |
-
1991
- 1991-03-25 JP JP10502791A patent/JPH04296088A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5996219A (en) * | 1997-01-31 | 1999-12-07 | The Board Of Trustees Of The Leland Stanford Junior University | Method for embedding electric or optical components in high-temperature metals |
| WO2006032836A1 (en) * | 2004-09-22 | 2006-03-30 | Vetco Gray Controls Limited | Thick-film hybrid production process |
| GB2432978A (en) * | 2004-09-22 | 2007-06-06 | Vetco Gray Controls Ltd | Thick-film hybrid production process |
| WO2012167009A1 (en) * | 2011-06-03 | 2012-12-06 | Cree, Inc. | Thin film resistor and method for its production |
| US8570140B2 (en) | 2011-06-03 | 2013-10-29 | Cree, Inc. | Thin film resistor |
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