JPS5680152A - Thin-film type integrated circuit device - Google Patents

Thin-film type integrated circuit device

Info

Publication number
JPS5680152A
JPS5680152A JP15832579A JP15832579A JPS5680152A JP S5680152 A JPS5680152 A JP S5680152A JP 15832579 A JP15832579 A JP 15832579A JP 15832579 A JP15832579 A JP 15832579A JP S5680152 A JPS5680152 A JP S5680152A
Authority
JP
Japan
Prior art keywords
thin
integrated circuit
solder
film type
type integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15832579A
Other languages
Japanese (ja)
Inventor
Takeshi Nakajima
Yoichi Matsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15832579A priority Critical patent/JPS5680152A/en
Publication of JPS5680152A publication Critical patent/JPS5680152A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits

Abstract

PURPOSE:To prevent the flowage of the solder layer of the thin-film type integrated circuit whose electrode patterns have been provided at both ends of a thin film resistance formed on an insulative substrate, by forming each electrode pattern into shape which has a slit or cut. CONSTITUTION:On an insulative substrate 1 of ceramic or the like, a resistance element 2 of a desired pattern is formed of tantalum or the like. Then this is coated with the first conductive layer 3 of NiCr or the like which is adhesive to the resistance element 2 so that the thickness is 200-300Angstrom and the second conductive layer 4 of Au or the like which is adhesive to solder by, e.g., vacuumevaporation. Moreover, these conductive layers are pattened into shape shown in the figure by photoresist method or the like. By said constitution, because a slit 5 or cut 6 has been made in the conductive layers 3 and 4, the flowage of the solder layer can be prevented when it is formed by solder dip.
JP15832579A 1979-12-06 1979-12-06 Thin-film type integrated circuit device Pending JPS5680152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15832579A JPS5680152A (en) 1979-12-06 1979-12-06 Thin-film type integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15832579A JPS5680152A (en) 1979-12-06 1979-12-06 Thin-film type integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5680152A true JPS5680152A (en) 1981-07-01

Family

ID=15669166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15832579A Pending JPS5680152A (en) 1979-12-06 1979-12-06 Thin-film type integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5680152A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289201A (en) * 1988-05-17 1989-11-21 Matsushita Electric Ind Co Ltd Chip resistor and manufacture thereof
US6703666B1 (en) * 1999-07-14 2004-03-09 Agere Systems Inc. Thin film resistor device and a method of manufacture therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289201A (en) * 1988-05-17 1989-11-21 Matsushita Electric Ind Co Ltd Chip resistor and manufacture thereof
US6703666B1 (en) * 1999-07-14 2004-03-09 Agere Systems Inc. Thin film resistor device and a method of manufacture therefor
US7276767B2 (en) 1999-07-14 2007-10-02 Agere Systems Inc. Thin film resistor device and a method of manufacture therefor

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