JPS55151358A - Fabricating method of thin film integrated circuit - Google Patents

Fabricating method of thin film integrated circuit

Info

Publication number
JPS55151358A
JPS55151358A JP5957079A JP5957079A JPS55151358A JP S55151358 A JPS55151358 A JP S55151358A JP 5957079 A JP5957079 A JP 5957079A JP 5957079 A JP5957079 A JP 5957079A JP S55151358 A JPS55151358 A JP S55151358A
Authority
JP
Japan
Prior art keywords
layer
thin film
solder
conductive layer
preferable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5957079A
Other languages
Japanese (ja)
Inventor
Takeshi Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5957079A priority Critical patent/JPS55151358A/en
Publication of JPS55151358A publication Critical patent/JPS55151358A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof

Abstract

PURPOSE:To eliminate the deterioration of adherence of an electrode with a resistance thin film on a substrate by employing an electrode consisting of a conductive layer having preferable adherence with the thin film and a conductive layer having preferable solderability. CONSTITUTION:A desired circuit element 2 is formed on an insulating substrate 1. Then, a conductive layer 3 having preferable adherence with the circuit 2 and a conductive layer 4 having preferable solderability are formed by a vacuum evaporating process or the like. Further, a conductive layer 5 made of Au or the like is so formed as to enclose the layers 3 and 4. Thereafter, a solder layer is formed on the layer 5 by a solder dip. In this case, the layer 5 making contact with the solder layer is partly vanished into the solder layer. However, the layer 4 coated with the layer 5 is protected by the layer 5 and not vanished into the solder layer.
JP5957079A 1979-05-15 1979-05-15 Fabricating method of thin film integrated circuit Pending JPS55151358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5957079A JPS55151358A (en) 1979-05-15 1979-05-15 Fabricating method of thin film integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5957079A JPS55151358A (en) 1979-05-15 1979-05-15 Fabricating method of thin film integrated circuit

Publications (1)

Publication Number Publication Date
JPS55151358A true JPS55151358A (en) 1980-11-25

Family

ID=13117023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5957079A Pending JPS55151358A (en) 1979-05-15 1979-05-15 Fabricating method of thin film integrated circuit

Country Status (1)

Country Link
JP (1) JPS55151358A (en)

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