JPS55162254A - Composite integrated circuit - Google Patents

Composite integrated circuit

Info

Publication number
JPS55162254A
JPS55162254A JP7034479A JP7034479A JPS55162254A JP S55162254 A JPS55162254 A JP S55162254A JP 7034479 A JP7034479 A JP 7034479A JP 7034479 A JP7034479 A JP 7034479A JP S55162254 A JPS55162254 A JP S55162254A
Authority
JP
Japan
Prior art keywords
layer
resistance
film
thin
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7034479A
Other languages
Japanese (ja)
Inventor
Keiji Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7034479A priority Critical patent/JPS55162254A/en
Publication of JPS55162254A publication Critical patent/JPS55162254A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To obtain resistance values expanding over a wide range by the method wherein the resist is formed in one layer and two layers of different area resistance values when a composite integrated circuit is formed by providing a thin Ta film capacitor and a thin Ta film resistor on the same substrate. CONSTITUTION:Thin Ta film 2 is coated on ceramic insulation substrate 1. By retaining only the region which is to become a capacitor and a low resistance, the film is removed by etching. Constant voltage forming is operated on a part of the capacitor region, and thereby this is converted into dielectric layer 3. Next, the entire surface is covered with a laminate of Ta nitride layer 4 and conducting layer 5 of Ti-Au. Conducting layer 5 on dielectric body 3 is removed by etching. Further, a part of layer 4 is removed, and thereby a desired resistance pattern is obtained. In this way, layer 4 consisting of only one layer is provided at the place where a high resistance is formed. A two layered structure, of layer 4 and layer 2, which was provided previously, is formed at the place where a low resistance is formed. The resistor is heat treated or anodized. After Cr-Au electrode layer 6 is provided, the resistance of the resistor is set at a desired value by laser trimming.
JP7034479A 1979-06-05 1979-06-05 Composite integrated circuit Pending JPS55162254A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7034479A JPS55162254A (en) 1979-06-05 1979-06-05 Composite integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7034479A JPS55162254A (en) 1979-06-05 1979-06-05 Composite integrated circuit

Publications (1)

Publication Number Publication Date
JPS55162254A true JPS55162254A (en) 1980-12-17

Family

ID=13428699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7034479A Pending JPS55162254A (en) 1979-06-05 1979-06-05 Composite integrated circuit

Country Status (1)

Country Link
JP (1) JPS55162254A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0256568A2 (en) * 1986-07-15 1988-02-24 Siemens Telecomunicazioni S.P.A. Process for obtaining thin-film circuits and passive circuit made by said process
JPS63244869A (en) * 1987-03-31 1988-10-12 Fujitsu General Ltd Substrate for thin film hybrid ic
JPS63244866A (en) * 1987-03-31 1988-10-12 Fujitsu General Ltd Substrate for thin film hybrid ic
WO1989006086A1 (en) * 1987-12-18 1989-06-29 Mitsui Mining & Smelting Co., Ltd. Thin-film conductive circuit and process for its production

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5436576A (en) * 1977-08-26 1979-03-17 Shin Kobe Electric Machinery Laminated board for printed wiring circuit with resistance body

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5436576A (en) * 1977-08-26 1979-03-17 Shin Kobe Electric Machinery Laminated board for printed wiring circuit with resistance body

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0256568A2 (en) * 1986-07-15 1988-02-24 Siemens Telecomunicazioni S.P.A. Process for obtaining thin-film circuits and passive circuit made by said process
JPS63244869A (en) * 1987-03-31 1988-10-12 Fujitsu General Ltd Substrate for thin film hybrid ic
JPS63244866A (en) * 1987-03-31 1988-10-12 Fujitsu General Ltd Substrate for thin film hybrid ic
WO1989006086A1 (en) * 1987-12-18 1989-06-29 Mitsui Mining & Smelting Co., Ltd. Thin-film conductive circuit and process for its production
US5032694A (en) * 1987-12-18 1991-07-16 Mitsui Mining & Smelting Co., Ltd. Conductive film circuit and method of manufacturing the same

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