JPS647541A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS647541A
JPS647541A JP62160915A JP16091587A JPS647541A JP S647541 A JPS647541 A JP S647541A JP 62160915 A JP62160915 A JP 62160915A JP 16091587 A JP16091587 A JP 16091587A JP S647541 A JPS647541 A JP S647541A
Authority
JP
Japan
Prior art keywords
electrodes
nonconductor
substrate
solders
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62160915A
Other languages
Japanese (ja)
Inventor
Michihiko Inaba
Nobuo Iwase
Seiichi Hirata
Satoshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62160915A priority Critical patent/JPS647541A/en
Publication of JPS647541A publication Critical patent/JPS647541A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the realiability of bonding corresponding to the microscopical formation of an element by a method wherein conductors are each sealed in holes bored at positions, where correspond to electrodes, of a substrate, the conductor parts are projected relatively to nonconductor parts and the substrate and the nonconductor plates, wherein the conductors are sealed, are connected to each other. CONSTITUTION:Holes 2 to correspond to the parts consisting of semiconductor or ceramic glass of electrodes are bored in a nonconductor substrate 1 constituted of at least one kind of a material out of materials of glass, ceramic, silicon, polyimide, Teflon and silicone rubber and solders 3 are each sealed in the holes 2 by a supersonic soldering unit. After that, the solders are etched with the surface layer only of the nonconductor substrate or the surface layers of the solders 3 are projected by plating or by redipping in a low-melting point solder and are fixed by pressure corresponding to the electrodes 6. Thereby, even though the pitch between the electrodes of a semiconductor chip becomes narrow, packaging of semiconductor device, is made possible and is provided with low-cost and high-accuracy bumps.
JP62160915A 1987-06-30 1987-06-30 Manufacture of semiconductor device Pending JPS647541A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62160915A JPS647541A (en) 1987-06-30 1987-06-30 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62160915A JPS647541A (en) 1987-06-30 1987-06-30 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS647541A true JPS647541A (en) 1989-01-11

Family

ID=15725065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62160915A Pending JPS647541A (en) 1987-06-30 1987-06-30 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS647541A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0804056A3 (en) * 1996-04-26 1999-02-03 NGK Spark Plug Co. Ltd. Improvements in or relating to connecting board
CN1325056C (en) * 2002-05-20 2007-07-11 大塚制药株式会社 Chloasma amelioration composition and dullness amelioration composition
WO2012111187A1 (en) 2011-02-14 2012-08-23 株式会社Ｊ－オイルミルズ Skin collagen production promoter

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0804056A3 (en) * 1996-04-26 1999-02-03 NGK Spark Plug Co. Ltd. Improvements in or relating to connecting board
CN1325056C (en) * 2002-05-20 2007-07-11 大塚制药株式会社 Chloasma amelioration composition and dullness amelioration composition
WO2012111187A1 (en) 2011-02-14 2012-08-23 株式会社Ｊ－オイルミルズ Skin collagen production promoter

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