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Application filed by Ibiden Co LtdfiledCriticalIbiden Co Ltd
Priority to MYPI0400194priorityCriticalpatent/MY120282A/en
Publication of MY120282ApublicationCriticalpatent/MY120282A/en
Electric Connection Of Electric Components To Printed Circuits
(AREA)
Abstract
PRINTED CIRCUIT BOARD SUITABLE FOR THE HIGH DENSIFICATION OF MOUNTING PARTS USING A SOLDER BUMP (1) AND HAVING IMPROVED CONNECTION AND MOUNTING RELIABILITY, WHEREIN THE PRINTED CIRCUIT BOARD INCLUDES A MOUNTING PAD PROVIDED WITH A SOLDER BUMP (1) BY COVERING THE MOUNTING SURFACE WITH A SOLDER RESIST (4) , AND A POSITION OF FORMING THE SOLDER BUMP (1) IS ARRANGED SO AS TO MATCH WITH A POSITION OF THE VIAHOLE (5) , OR A SIZE OF THE OPENING PORTION FORMED IN THE SOLDER RESIST IS MADE LARGER THAN A SIZE OF A LAND OF THE VIAHOLE (5) SO AS NOT BE OVERLAP THE SOLDER RESIST WITH THE VIAHOLE (5).