JPS60125765U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS60125765U JPS60125765U JP1381884U JP1381884U JPS60125765U JP S60125765 U JPS60125765 U JP S60125765U JP 1381884 U JP1381884 U JP 1381884U JP 1381884 U JP1381884 U JP 1381884U JP S60125765 U JPS60125765 U JP S60125765U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- abstract
- groove
- protrude
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の実施例としてチップ部品とリード付き部
品を実装した配線板の断面図。第２図は本考案による配
線板へチップ部品を実装する個所に溝を設けた回路パタ
ーン例の平面図、第３図は第２図の配線板にチップ部品
とリード付き部品を実装した配線板の断面図。
１・・・印刷配線板、２・・・座、３，４・・・溝、５
・・・接着剤、６・・・チップ部品、７・・・回路パタ
ーン、８・・・クリームハンダ、９・・・リード付き部
品。FIG. 1 is a cross-sectional view of a wiring board on which chip components and leaded components are mounted as a conventional example. Figure 2 is a plan view of an example of a circuit pattern in which grooves are provided at locations where chip components are mounted on a wiring board according to the present invention, and Figure 3 is a wiring board in which chip components and leaded components are mounted on the wiring board of Figure 2. Cross-sectional view. 1... Printed wiring board, 2... Seat, 3, 4... Groove, 5
... Adhesive, 6... Chip parts, 7... Circuit pattern, 8... Cream solder, 9... Parts with leads.
Claims (1)
設け、前記溝部に熱硬化性接着剤を基板表面から突出し
て埋設させたことを特徴とする印刷配線板。1. A printed wiring board, characterized in that a circular or polygonal groove is provided on at least one side of the wiring board, and a thermosetting adhesive is embedded in the groove so as to protrude from the surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1381884U JPS60125765U (en) | 1984-02-03 | 1984-02-03 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1381884U JPS60125765U (en) | 1984-02-03 | 1984-02-03 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60125765U true JPS60125765U (en) | 1985-08-24 |
Family
ID=30498172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1381884U Pending JPS60125765U (en) | 1984-02-03 | 1984-02-03 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60125765U (en) |
-
1984
- 1984-02-03 JP JP1381884U patent/JPS60125765U/en active Pending
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