CN101913046B - Welding device for welding diode - Google Patents
Welding device for welding diode Download PDFInfo
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- CN101913046B CN101913046B CN 201010178765 CN201010178765A CN101913046B CN 101913046 B CN101913046 B CN 101913046B CN 201010178765 CN201010178765 CN 201010178765 CN 201010178765 A CN201010178765 A CN 201010178765A CN 101913046 B CN101913046 B CN 101913046B
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Abstract
The invention discloses a welding device for welding a diode. The welding device comprises a cover plate and a bottom plate, wherein the cover plate comprises a baffle plate, a retaining plate, a weight assisting pin and at least two movable plates, wherein the baffle plate is laminated on the retaining plate; the retaining plate is laminated on the upper surface of the movable plate; the lower surface of each movable plate is provided with a material groove; a through hole is reserved between the upper surface of the movable plate and the material groove; the weight assisting pin is positioned in the through hole, can move along the through hole and can press a material in the material groove; and the lower surface of each movable plate is provided with a fixing pin for fixing a lead frame. The welding device of the invention improves the flatness and the positioning accuracy of the material during the welding and prevents the problems of insufficient welding and deviation of the material.
Description
Technical field
The present invention relates to a kind of graphite welding plate, relate in particular to a kind of welder for welding diode.
Background technology
Diode is the electronic device of commonly using, existing diode is when encapsulation, graphite welding plate is adopted in welding, existing graphite welding plate design is often considered based on welding product size, when carrying out welding diode grain, ignored the interior material of material groove in the high-temperature soldering, such as diode crystal particle, lead frame, weld tabs etc., the motion of these materials in the high-temperature soldering process, and the space between these materials is larger, thereby cause at high temperature can moving to some extent or material welding loose contact, cause diode crystal particle rosin joint or inclination, have a strong impact on the performance of product.
Secondly, fail to pay attention to the orientation problem of the interior diode crystal particle of welder and lead frame, existing welder only solves by being provided with the material groove, but, because its material of lead frame is generally copper, and the welder material is graphite, this bi-material coefficient of expansion at high temperature is different, cause in the material groove, to reserve certain expansion space, this can cause brilliant to be difficult to accurate location in welding process, diode crystal particle and lead frame off normal problem occur, during actual diode package was produced, the defective products that is caused by the off normal problem had accounted for 30 percent in the defective products sum.
Therefore, how to research and develop a kind of welder, solve rosin joint and the orientation problem of existing welder, just become the direction that those skilled in the art make great efforts.
Summary of the invention
The object of the invention provides a kind of welder for welding diode, and this welder has improved planarization and the positioning accuracy of material when welding, and has avoided rosin joint and the off normal problem of material.
For achieving the above object, the technical solution used in the present invention is: a kind of welder for welding diode, comprise cover plate and base plate, described cover plate comprises baffle plate, fixed head, auxiliary heavy pin, at least two portable plates, baffle plate is stacked on the fixed head, fixed head is stacked in the portable plate upper surface, and the portable plate lower surface is provided with the material groove
Be provided with through hole between described portable plate upper surface and the material groove, auxiliary heavy pin is positioned at this through hole, and auxiliary heavy pin can move along described through hole direction also can push down material in the material groove;
Described at least two portable plates are positioned at same plane, and each portable plate lower surface is provided with the fixing pin for the anchor leg framework,
Portable plate is connected by directed pin with fixed head, and portable plate has the guide slot that embeds for this orientation pin, and fixed head has the locating hole corresponding with this orientation pin;
In the guide slot of directed pin embedding portable plate and the locating hole of fixed head, leave the horizontal space that moves along the lead frame bearing of trend for portable plate between this orientation pin and the guide slot;
Described base plate is positioned at the portable plate below.
Related content in the technique scheme is explained as follows:
1, in the such scheme, described auxiliary heavy pin is "T"-shaped pin, and described through hole is "T"-shaped through hole.
2, in the such scheme, described directed pin is "T"-shaped pin, described guide slot is "T"-shaped guide slot, and this "T"-shaped pin embeds in this "T"-shaped guide slot, leaves the horizontal space that moves along the lead frame bearing of trend for portable plate between this "T"-shaped pin and the "T"-shaped guide slot.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, utilize auxiliary heavy pin to flatten material, not only can make material be close to lead frame, can also make material remain formation state, such design can be avoided the problem that rosin joint and crystal grain tilt in the high-temperature soldering process.
2, by the fixing same lead frame of some portable plates, can make portable plate follow the lead frame expanded by heating and move, the materials such as drive crystal grain follow lead frame to move, the problem of crystal grain off normal when such design can be avoided welding, overcome existing graphite welding plate because the crystal grain off normal problem that lead frame expands and brings has improved the precision of crystal grain location greatly.
Description of drawings
Accompanying drawing 1 is looked schematic diagram for cover plate master of the present invention;
Accompanying drawing 2 is the elevational schematic view of accompanying drawing 1;
The schematic diagram of accompanying drawing 3 after for cover plate of the present invention upset;
Accompanying drawing 4 is E place enlarged drawing in the accompanying drawing 3;
Accompanying drawing 5 is looked schematic diagram for base plate master of the present invention;
Accompanying drawing 6 is the front view of accompanying drawing 5.
In the above accompanying drawing: 1, cover plate; 2, material groove; 3, base plate; 4, baffle plate; 5, fixed head; 6, auxiliary heavy pin; 7, through hole; 8, portable plate; 9, substrate; 10, fixing pin; 11, directed pin; 12, guide slot.
The specific embodiment
The invention will be further described below in conjunction with drawings and Examples:
Embodiment: a kind of welder for welding diode,
Comprise cover plate 1 and base plate 3, described cover plate 1 comprises baffle plate 4, fixed head 5, auxiliary heavy pin 6, at least two portable plates 8, and baffle plate 4 is stacked on the fixed head 5, and fixed head 5 is stacked in portable plate 8 upper surfaces, and portable plate 8 lower surfaces are provided with material groove 2,
Be provided with through hole 7 between described portable plate 8 upper surfaces and the material groove 2, auxiliary heavy pin 6 is positioned at this through hole 7, and auxiliary heavy pin 6 can move along described through hole 7 directions also can push down material groove 2 interior materials;
Described at least two portable plates 8 are positioned at same plane, and each portable plate 8 lower surface is provided with the fixing pin 10 for the anchor leg framework,
In the guide slot 12 of directed pin 11 embedding portable plates 8 and the locating hole of fixed head 5, leave the horizontal space that moves along the lead frame bearing of trend for portable plate 8 between this orientation pin 11 and the guide slot 12;
Described base plate 3 is positioned at portable plate 8 belows.
Described auxiliary heavy pin 6 is "T"-shaped pins, and described through hole 7 is "T"-shaped through holes.
Described directed pin 11 is "T"-shaped pins, described guide slot 12 is "T"-shaped guide slots, this "T"-shaped pin embeds in this "T"-shaped guide slot, leaves the horizontal space that moves along the lead frame bearing of trend for portable plate between this "T"-shaped pin and the "T"-shaped guide slot.
Present embodiment foregoing specific works process is as follows.
Diode crystal particle, lead frame, weld tabs etc. are installed in the cover plate 1 behind the portable plate 8 interior material grooves 2, again lead frame is put on the portable plate 8, by lead frame attachment pin 10 anchor leg frameworks.Then cover base plate 3.After more than action is finished, whole welder is stood up with the angles of 180 degree, at this moment nethermost be base plate 3, be lead frame above the base plate 3, be the materials such as weld tabs, crystal grain, brace above the lead frame, more up with regard to cover plate 1.Cover plate 1 in the above after, the auxiliary heavy pin 6 that is contained in 1 li of cover plate just can freely be given prominence to and vertically down, so just can be pressed in above the materials such as brace, crystal grain, weld tabs (being the material inside the material groove).Have above the slight weight of auxiliary heavy pin 6 self is pressed in, thereby so that the material of material groove the inside is close to lead frame, can not produce rosin joint when guaranteeing welding.The pressure that auxiliary heavy pin 6 has been arranged, material can keep smooth state in welding process, guarantee that the rear material of welding can not tilt.In addition, the portable plate 8 that is used for the material filling is comprised of A, B, four portable plates of C, D, these four fixing pins 10 of leaded frame all above the portable plate, expanded by heating when lead frame welds, by the screens of fixing pin 10, A, B, four blocks of plates 8 of C, D are also followed the expansion of lead frame and are moved.The materials such as weld tabs, crystal grain, brace are material groove 2 the insides that are contained in A, B, C, D material filling plate, and the portable plate that is used for the material filling moves with lead frame, and the material that is contained in the inside is also naturally and then mobile.Therefore, the materials such as weld tabs, crystal grain, brace are constant with the position between the lead frame, so welding material and the position between the lead frame out naturally can off normal.Comprehensively above-mentioned, this soldering appliance can solve puzzlement for a long time the chip off normal and the problem of rosin joint, greatly improve product yield, reduce the waste of material, thereby reach the effect that environmental protection is produced.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with technique can understand content of the present invention and according to this enforcement, can not limit protection scope of the present invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (3)
1. welder that is used for welding diode, comprise cover plate (1) and base plate (3), it is characterized in that: described cover plate (1) comprises baffle plate (4), fixed head (5), auxiliary heavy pin (6), at least two portable plates (8), baffle plate (4) is stacked on the fixed head (5), fixed head (5) is stacked in portable plate (8) upper surface, portable plate (8) lower surface is provided with material groove (2), be provided with through hole (7) between described portable plate (8) upper surface and the material groove (2), auxiliary heavy pin (6) is positioned at this through hole (7), and auxiliary heavy pin (6) can and can be pushed down the interior material of material groove (2) along the motion of described through hole (7) direction;
Described at least two portable plates (8) are positioned at same plane, each portable plate (8) lower surface is provided with the fixing pin (10) for the anchor leg framework, portable plate (8) is connected by directed pin (11) with fixed head (5), portable plate (8) has the guide slot (12) that embeds for this orientation pin (11), and fixed head (5) has the locating hole corresponding with this orientation pin (11); In the guide slot (12) of directed pin (11) embedding portable plate (8) and the locating hole of fixed head (5), leave the horizontal space that moves along the lead frame bearing of trend for portable plate (8) between this orientation pin (11) and the guide slot (12);
Described base plate (3) is positioned at portable plate (8) below.
2. welder according to claim 1, it is characterized in that: described auxiliary heavy pin (6) is "T"-shaped pin, described through hole (7) is "T"-shaped through hole.
3. welder according to claim 1, it is characterized in that: described directed pin (11) is "T"-shaped pin, described guide slot (12) is "T"-shaped guide slot, this "T"-shaped pin embeds in this "T"-shaped guide slot, leaves the horizontal space that moves along the lead frame bearing of trend for portable plate between this "T"-shaped pin and the "T"-shaped guide slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010178765 CN101913046B (en) | 2010-05-21 | 2010-05-21 | Welding device for welding diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010178765 CN101913046B (en) | 2010-05-21 | 2010-05-21 | Welding device for welding diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101913046A CN101913046A (en) | 2010-12-15 |
| CN101913046B true CN101913046B (en) | 2013-05-01 |
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ID=43320764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010178765 Expired - Fee Related CN101913046B (en) | 2010-05-21 | 2010-05-21 | Welding device for welding diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101913046B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647860A (en) * | 2012-05-14 | 2012-08-22 | 宜兴市东晨电子科技有限公司 | Joint welding fixture |
| CN103903992B (en) * | 2012-12-28 | 2017-04-19 | 贵州雅光电子科技股份有限公司 | A method and device for pressing and fixing diodes on a rectifier substrate |
| CN105108417B (en) * | 2015-09-17 | 2016-10-05 | 贵州雅光电子科技股份有限公司 | A kind of diode welding mould and using method thereof |
| CN106803488B (en) * | 2015-11-26 | 2019-10-29 | 株洲南车时代电气股份有限公司 | A kind of power module welder |
| CN110323166B (en) * | 2019-08-03 | 2024-04-30 | 捷捷半导体有限公司 | Sintering mold with stress release groove for automobile diode and use method |
| CN110690145A (en) * | 2019-10-10 | 2020-01-14 | 丁晟 | Wire arranging guide device before semiconductor diode welding |
| CN113478149B (en) * | 2021-07-21 | 2023-09-19 | 浙江新纳陶瓷新材有限公司 | Ceramic substrate and metal ring welding tool |
| CN115440607B (en) * | 2022-10-13 | 2023-05-30 | 德欧泰克半导体(上海)有限公司 | Semiconductor packaging process and graphite boat structure applied to same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2899825B2 (en) * | 1990-08-24 | 1999-06-02 | 株式会社新川 | Lead frame holding device |
| CN1518122A (en) * | 2003-01-17 | 2004-08-04 | 友达光电股份有限公司 | Organie LED display and its manufacturing method |
| CN1817537A (en) * | 2005-02-07 | 2006-08-16 | 林茂昌 | Diode machining welding method and special carbon graphite welding board |
| CN101016979A (en) * | 2006-10-09 | 2007-08-15 | 刘昌贵 | Lamp string, lamp strap using same and manufacture method of the lamp string |
| CN201471115U (en) * | 2009-07-20 | 2010-05-19 | 苏州固锝电子股份有限公司 | Graphite welding plate for lead frame |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574148A (en) * | 1978-11-29 | 1980-06-04 | Nec Corp | Production of semiconductor device |
-
2010
- 2010-05-21 CN CN 201010178765 patent/CN101913046B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2899825B2 (en) * | 1990-08-24 | 1999-06-02 | 株式会社新川 | Lead frame holding device |
| CN1518122A (en) * | 2003-01-17 | 2004-08-04 | 友达光电股份有限公司 | Organie LED display and its manufacturing method |
| CN1817537A (en) * | 2005-02-07 | 2006-08-16 | 林茂昌 | Diode machining welding method and special carbon graphite welding board |
| CN101016979A (en) * | 2006-10-09 | 2007-08-15 | 刘昌贵 | Lamp string, lamp strap using same and manufacture method of the lamp string |
| CN201471115U (en) * | 2009-07-20 | 2010-05-19 | 苏州固锝电子股份有限公司 | Graphite welding plate for lead frame |
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| Publication number | Publication date |
|---|---|
| CN101913046A (en) | 2010-12-15 |
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Granted publication date: 20130501 |