JPS5228273A - Method for alignment of pellets - Google Patents

Method for alignment of pellets

Info

Publication number
JPS5228273A
JPS5228273A JP10399075A JP10399075A JPS5228273A JP S5228273 A JPS5228273 A JP S5228273A JP 10399075 A JP10399075 A JP 10399075A JP 10399075 A JP10399075 A JP 10399075A JP S5228273 A JPS5228273 A JP S5228273A
Authority
JP
Japan
Prior art keywords
pellets
alignment
pellet
pushing
securely
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10399075A
Other languages
Japanese (ja)
Inventor
Osamu Ito
Osamu Abe
Fumio Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10399075A priority Critical patent/JPS5228273A/en
Publication of JPS5228273A publication Critical patent/JPS5228273A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To paste up the pellet rapidly and securely by pushing down the back of the pellet receiver and pushing on the back of the masking tape to push out one pellet.
COPYRIGHT: (C)1977,JPO&Japio
JP10399075A 1975-08-29 1975-08-29 Method for alignment of pellets Pending JPS5228273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10399075A JPS5228273A (en) 1975-08-29 1975-08-29 Method for alignment of pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10399075A JPS5228273A (en) 1975-08-29 1975-08-29 Method for alignment of pellets

Publications (1)

Publication Number Publication Date
JPS5228273A true JPS5228273A (en) 1977-03-03

Family

ID=14368728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10399075A Pending JPS5228273A (en) 1975-08-29 1975-08-29 Method for alignment of pellets

Country Status (1)

Country Link
JP (1) JPS5228273A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637176A (en) * 1994-06-16 1997-06-10 Fry's Metals, Inc. Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637176A (en) * 1994-06-16 1997-06-10 Fry's Metals, Inc. Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials

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