JPS6172856U - - Google Patents

Info

Publication number
JPS6172856U
JPS6172856U JP15212484U JP15212484U JPS6172856U JP S6172856 U JPS6172856 U JP S6172856U JP 15212484 U JP15212484 U JP 15212484U JP 15212484 U JP15212484 U JP 15212484U JP S6172856 U JPS6172856 U JP S6172856U
Authority
JP
Japan
Prior art keywords
adhesive
thin metal
semiconductor device
leads
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15212484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15212484U priority Critical patent/JPS6172856U/ja
Publication of JPS6172856U publication Critical patent/JPS6172856U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案半導体装置の一実施例を示す断
面図、第2図、第3図、第4図及び第5図は夫々
本考案の説明に供する線図、第6図は第1図の斜
視図、第7図は第1図のリード部の断面図である
。 1は半導体ペレツト、1aはその電極、2はリ
ード、3は金属薄板、4は接着剤、5は異方性コ
ネクタである。
FIG. 1 is a cross-sectional view showing one embodiment of the semiconductor device of the present invention, FIGS. 2, 3, 4, and 5 are diagrams for explaining the present invention, and FIG. 6 is a diagram similar to that shown in FIG. FIG. 7 is a sectional view of the lead portion of FIG. 1. 1 is a semiconductor pellet, 1a is its electrode, 2 is a lead, 3 is a thin metal plate, 4 is an adhesive, and 5 is an anisotropic connector.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードの取付けられた半導体ペレツトを2枚の
接着剤が被着された金属薄板により挾持する様に
したことを特徴とする半導体装置。
A semiconductor device characterized in that a semiconductor pellet to which leads are attached is held between two thin metal plates coated with an adhesive.
JP15212484U 1984-10-08 1984-10-08 Pending JPS6172856U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15212484U JPS6172856U (en) 1984-10-08 1984-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15212484U JPS6172856U (en) 1984-10-08 1984-10-08

Publications (1)

Publication Number Publication Date
JPS6172856U true JPS6172856U (en) 1986-05-17

Family

ID=30710209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15212484U Pending JPS6172856U (en) 1984-10-08 1984-10-08

Country Status (1)

Country Link
JP (1) JPS6172856U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS641262A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Electronic device and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS641262A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Electronic device and manufacture thereof

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