JPS63167775U - - Google Patents
Info
- Publication number
- JPS63167775U JPS63167775U JP5986487U JP5986487U JPS63167775U JP S63167775 U JPS63167775 U JP S63167775U JP 5986487 U JP5986487 U JP 5986487U JP 5986487 U JP5986487 U JP 5986487U JP S63167775 U JPS63167775 U JP S63167775U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- electronic component
- wiring board
- printed wiring
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例の放熱構造を示す要
部平面図、第２図は発熱する電子部品が実装され
た印刷配線板を示す要部平面図、第３図は同じく
側断面図、第４図は本考案の一実施例の放熱構造
を示す側断面図、第５図は本考案の他の実施例の
放熱構造を示す要部平面図、第６図は同じく側断
面図である。
１……電子部品、５……リード、６……一実施
例に係る印刷配線板、７……スルーホール、８…
…電子部品の本体、９……一実施例に係る放熱マ
スク、１０……チツプ型電子部品、１１……他の
実施例に係る印刷配線板、１２……接着剤、１３
……電極、１４……半田ランド、１５……他の実
施例に係る放熱マスク、１６……穴、１７……チ
ツプ型電子部品の本体。
Fig. 1 is a plan view of the main part showing a heat dissipation structure of an embodiment of the present invention, Fig. 2 is a plan view of the main part showing a printed wiring board on which heat-generating electronic components are mounted, and Fig. 3 is a side sectional view of the same. , FIG. 4 is a side sectional view showing a heat dissipation structure according to an embodiment of the present invention, FIG. 5 is a plan view of essential parts showing a heat dissipation structure according to another embodiment of the present invention, and FIG. be. DESCRIPTION OF SYMBOLS 1...Electronic component, 5...Lead, 6...Printed wiring board according to an embodiment, 7...Through hole, 8...
... Main body of electronic component, 9 ... Heat dissipation mask according to one embodiment, 10 ... Chip type electronic component, 11 ... Printed wiring board according to another embodiment, 12 ... Adhesive, 13
... Electrode, 14 ... Solder land, 15 ... Heat dissipation mask according to another embodiment, 16 ... Hole, 17 ... Main body of chip-type electronic component.
Claims (1)
放熱構造において、 軟質の放熱膜９が前記電子部品の本体８の実装
部位に印刷により形成されていることを特徴とす
る印刷配線板の放熱構造。[Claims for Utility Model Registration] A heat dissipation structure for a printed wiring board on which a heat-generating electronic component 1 is mounted, characterized in that a soft heat dissipation film 9 is formed by printing on the mounting portion of the main body 8 of the electronic component. Heat dissipation structure of printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5986487U JPS63167775U (en) | 1987-04-22 | 1987-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5986487U JPS63167775U (en) | 1987-04-22 | 1987-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167775U true JPS63167775U (en) | 1988-11-01 |
Family
ID=30891758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5986487U Pending JPS63167775U (en) | 1987-04-22 | 1987-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167775U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5415172A (en) * | 1977-07-07 | 1979-02-03 | Fujitsu Ltd | Way of fixing electronic parts |
-
1987
- 1987-04-22 JP JP5986487U patent/JPS63167775U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5415172A (en) * | 1977-07-07 | 1979-02-03 | Fujitsu Ltd | Way of fixing electronic parts |
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