JPH02118969U - - Google Patents
Info
- Publication number
- JPH02118969U JPH02118969U JP2710789U JP2710789U JPH02118969U JP H02118969 U JPH02118969 U JP H02118969U JP 2710789 U JP2710789 U JP 2710789U JP 2710789 U JP2710789 U JP 2710789U JP H02118969 U JPH02118969 U JP H02118969U
- Authority
- JP
- Japan
- Prior art keywords
- light
- circuit board
- transceiver module
- optical transceiver
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Optical Communication System (AREA)
Description
第１図はこの考案の一実施例を示す基板の概略
構造図、第２図は、基板をケースに固定したとき
の断面図、第３図は従来の代表的な光送交信モジ
ユールを示す平面図、第４図は従来のその断面図
である。
図において、１は発光モジユール、２は受光モ
ジユール、３は基板、４，５は電気部品、６はケ
ース、７はネジ、８はピン、９は銅ハクパターン
、１０，１１はランドパターン、１２はスルーホ
ール、１３はケース固定用ピン。なお、図中、同
一符号は同一または相当部分を示す。
Fig. 1 is a schematic structural diagram of a board showing an embodiment of this invention, Fig. 2 is a cross-sectional view of the board fixed to a case, and Fig. 3 is a plan view showing a typical conventional optical transmission/communication module. FIG. 4 is a sectional view of the conventional device. In the figure, 1 is a light emitting module, 2 is a light receiving module, 3 is a board, 4 and 5 are electrical components, 6 is a case, 7 is a screw, 8 is a pin, 9 is a copper strip pattern, 10 and 11 are land patterns, and 12 is a through hole, and 13 is a pin for fixing the case. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
た回路基板と、上記発光素子、受光素子および回
路基板を保持するケースとからなる光送受信モジ
ユールにおいて、上記回路基板を多層化し、その
内層に放熱を兼ねたグラウンド層を設け、そのグ
ラウンド層と、上記回路部品のグラウンドのラン
ドパターンおよび上記ケースに固定可能な固定用
ピンとを導通させるようにしたことを特徴とする
光送受信モジユール。 In an optical transceiver module consisting of a circuit board on which a light-emitting element, a light-receiving element, and circuit components are mounted, and a case holding the light-emitting element, light-receiving element, and circuit board, the circuit board is multilayered, and the inner layer also serves as a heat dissipator. An optical transceiver module characterized in that a ground layer is provided, and the ground layer is electrically connected to a ground land pattern of the circuit component and a fixing pin that can be fixed to the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2710789U JPH02118969U (en) | 1989-03-09 | 1989-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2710789U JPH02118969U (en) | 1989-03-09 | 1989-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118969U true JPH02118969U (en) | 1990-09-25 |
Family
ID=31249328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2710789U Pending JPH02118969U (en) | 1989-03-09 | 1989-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118969U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098287A (en) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | Cooler for circuit board module and portable electronic equipment having the cooler |
-
1989
- 1989-03-09 JP JP2710789U patent/JPH02118969U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098287A (en) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | Cooler for circuit board module and portable electronic equipment having the cooler |