JPH0415870U - - Google Patents
Info
- Publication number
- JPH0415870U JPH0415870U JP5672890U JP5672890U JPH0415870U JP H0415870 U JPH0415870 U JP H0415870U JP 5672890 U JP5672890 U JP 5672890U JP 5672890 U JP5672890 U JP 5672890U JP H0415870 U JPH0415870 U JP H0415870U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electrical component
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例のプリント配線板の
外観斜視図、第２図〜第５図は第１図に示す実施
例の製造方法を工程順に示す斜視図、第６図は第
１図に示す実施例を多層プリント配線板にした時
の斜視図、第７図は従来のプリント配線板の斜視
図である。
１……プリント基板、３ａ，３ｂ……電気部品
、３１ａ，３１ｂ……リード、４……銅スルーホ
ール、５……銅箔パターン、６……型枠、７……
発熱光源、１０……プリント配線板、１００……
基板。
FIG. 1 is an external perspective view of a printed wiring board according to an embodiment of the present invention, FIGS. 2 to 5 are perspective views showing the manufacturing method of the embodiment shown in FIG. 1 in order of steps, and FIG. A perspective view when the embodiment shown in the figure is made into a multilayer printed wiring board, and FIG. 7 is a perspective view of a conventional printed wiring board. 1... Printed circuit board, 3a, 3b... Electrical parts, 31a, 31b... Lead, 4... Copper through hole, 5... Copper foil pattern, 6... Formwork, 7...
Heat generating light source, 10...Printed wiring board, 100...
substrate.
Claims (1)
面がほぼ同一面となるように前記プリント基板に
埋設された電気部品と、この電気部品に接続され
前記プリント基板上に設けられた導体パターンと
を含むことを特徴とするプリント配線板。 It includes a printed circuit board, an electrical component embedded in the printed circuit board so that its upper surface is substantially flush with the surface of the printed circuit board, and a conductive pattern connected to the electrical component and provided on the printed circuit board. A printed wiring board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5672890U JPH0415870U (en) | 1990-05-30 | 1990-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5672890U JPH0415870U (en) | 1990-05-30 | 1990-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415870U true JPH0415870U (en) | 1992-02-07 |
Family
ID=31580811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5672890U Pending JPH0415870U (en) | 1990-05-30 | 1990-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415870U (en) |
-
1990
- 1990-05-30 JP JP5672890U patent/JPH0415870U/ja active Pending