JP2006339588A - Wiring circuit substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring circuit substrate which can fully improve the heat dissipation of an electronic part to be mounted. <P>SOLUTION: In a region in which a cover insulating layer 4 on a base insulation layer 2 is not formed, a plurality of pierced holes 6 are formed penetrating the face of the exposed adhesive layer 5 from the face of the exposed base insulation layer 2, each of four protrusions 21 of a metal stiffening plate 20 penetrate each of the plurality of pierced holes 6, and the wiring circuit substrate 100 is manufactured by sticking the metal stiffening plate 20 on the adhesive layer 5. An electronic part 10 is mounted on the wiring circuit substrate 100 by the terminal 11 which is composed of the solder of the electronic part 10 connected to a conductive pattern 3 that is exposed to the outside. In this case, the front end of the protrusion 21 of the metal stiffening plate 20 is contact with the electronic part 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a printed circuit board on which electronic components are mounted.

  Electronic components such as semiconductor elements generate heat when driven. If the electronic component generates excessive heat, the electronic component may malfunction. Therefore, in order to prevent such malfunction of the electronic component, a printed circuit board that radiates heat from the electronic component has been developed (for example, see Patent Document 1).

  FIG. 4 is a diagram showing the structure of a conventional mounting wiring board. In the mounting wiring board 900 of FIG. 4, a plurality of insulating layers 931, 932, and 933 are formed on a metal base 920 so as to be separated from each other.

  Further, a plurality of conductors 941, 942, 943, 944 are formed on the metal base 920 and the insulating layers 931, 932, 933 so as to be separated from each other. Among the plurality of conductors, some of the conductors 942 and 943 are disposed so as to fill the gap between the insulating layers 931 and 932 and the gap between the insulating layers 932 and 933 on the metal base 920, and are connected to the metal base 920. ing.

  On the other hand, the other conductors 941 and 944 are disposed on the insulating layer 931 and the insulating layer 933. Electronic components 950 and 960 are provided on the conductors 941 and 944 formed on the insulating layers 931 and 933, respectively. Terminals of the electronic components 950 and 960 are connected to conductors 941 and 944, respectively.

  Here, the conductor 941 on which the electronic component 950 is mounted and the conductor 942 connected to the metal base 920 are connected by a thermally conductive component 901 having insulating properties and thermal conductivity.

  In addition, the conductor 944 on which the electronic component 960 is mounted and the conductor 943 connected to the metal base 920 are connected by a thermally conductive component 902 having insulating properties and thermal conductivity.

  With such a configuration, heat generated in the electronic component 950 is transmitted to the metal base 920 through the conductor 941, the heat conductive component 901, and the conductor 942.

In addition, heat generated in the electronic component 960 is transmitted to the metal base 920 through the conductor 944, the heat conductive component 902, and the conductor 943. As a result, heat generated in the electronic components 950 and 960 is quickly dissipated by the metal base 920.
JP-A-11-97818

  Conventionally, downsizing of electronic devices including electronic components has been desired. Along with this, there is an increasing demand for miniaturization of electronic parts and miniaturization of printed circuit boards. In order to realize the miniaturization of such a printed circuit board, it is necessary to increase the density of the wiring.

  In order to realize such high-density wiring, a printed circuit board having excellent heat dissipation is required, but the heat dissipation of the electronic components 950 and 960 in the conventional mounting wiring board 900 is not sufficient. .

  An object of the present invention is to provide a printed circuit board capable of sufficiently improving the heat dissipation of electronic components to be mounted.

  A wired circuit board according to a first invention is a wired circuit board on which electronic components are mounted, and includes a first insulating layer having a plurality of through holes, and a plurality of conductors formed on the first insulating layer. A plurality of through holes provided in a region excluding a region where a plurality of conductor patterns on the first insulating layer are formed, and a reinforcing plate having one surface on which a plurality of protrusions are formed In addition, the plurality of protrusions of the reinforcing plate are respectively inserted into the plurality of through holes so as to protrude outward from the surface opposite to the surface on which the conductor pattern of the first insulating layer is formed, and One surface of the plate is bonded to the opposite surface of the first insulating layer.

  In the printed circuit board according to the present invention, a plurality of through holes are provided in a region excluding a region where a plurality of conductor patterns on the first insulating layer are formed. A plurality of protrusions of the reinforcing plate are inserted into the plurality of through holes so as to protrude from the surface opposite to the surface on which the conductor pattern of the first insulating layer is formed, and one of the reinforcing plates The surface is bonded to the surface on the opposite side of the first insulating layer.

  With such a configuration, when the terminal portion of the electronic component is connected to any of the plurality of conductor patterns, the tip portions of the plurality of protrusions of the reinforcing plate can be brought into contact with the electronic component. Thereby, the heat of the electronic component is conducted to the reinforcing plate through the plurality of protrusions and is released to the outside. Thereby, the heat dissipation of an electronic component is improved.

  The lengths from the respective leading end portions of the plurality of protruding portions protruding outward to the surface on which the conductor pattern of the first insulating layer is formed may be equal.

  With such a configuration, when the terminal portion of the electronic component is connected to any of the plurality of conductor patterns, the distance between the electronic component and the first insulating layer can be made constant. This prevents unstable fluidity of the terminal material when the terminal part of the electronic component is connected to the conductor pattern. Thereby, connection reliability is improved.

  The shape of the plurality of projecting portions may be a columnar shape, and the diameter of the projecting portion having a cylindrical shape may be 0.1 mm or greater and 1 mm or less.

  In this case, when the diameter is 0.1 mm or more, the heat dissipation is improved, and when the diameter is 1 mm or less, it is possible to prevent the conductor pattern arrangement area from being reduced.

  The printed circuit board may further include a second insulating layer formed so as to cover one or more of the plurality of conductor patterns on the first insulating layer. In this case, the one or more conductor patterns are protected by the second insulating layer.

  A mounting structure for an electronic component according to a second invention includes an electronic component including a terminal portion and a printed circuit board on which the electronic component is mounted, and the printed circuit board includes a first insulating layer having a plurality of through holes. And a plurality of conductor patterns formed on the first insulating layer, and the plurality of through holes are provided in a region excluding a region where the plurality of conductor patterns on the first insulating layer are formed. And a plurality of protrusions of the reinforcing plate projecting outward from a surface opposite to the surface on which the conductor pattern of the first insulating layer is formed. As described above, each of the through holes is inserted, and one surface of the reinforcing plate is bonded to the surface on the opposite side of the first insulating layer. It is connected to crab.

  In the electronic component mounting structure according to the present invention, a plurality of through holes are provided in a region excluding a region where a plurality of conductor patterns on the first insulating layer are formed. A plurality of protrusions of the reinforcing plate are inserted into the plurality of through holes so as to protrude from the surface opposite to the surface on which the conductor pattern of the first insulating layer is formed, and one of the reinforcing plates The surface is bonded to the surface on the opposite side of the first insulating layer.

  In the configuration as described above, the terminal portion of the electronic component is connected to one of the plurality of conductor patterns. In this case, the tips of the plurality of protrusions of the reinforcing plate are in contact with the electronic component. Thereby, the heat of the electronic component is conducted to the reinforcing plate through the plurality of protrusions and is released to the outside. Thereby, the heat dissipation of an electronic component is improved.

  According to the present invention, the heat dissipation of the electronic component is improved.

  Hereinafter, a printed circuit board according to the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic diagram showing the order of manufacturing the printed circuit board according to the present embodiment.

  As shown in FIG. 1A, first, an insulating base layer 2 is prepared, and a predetermined conductor pattern 3 is formed on the insulating base layer 2.

  Next, as illustrated in FIG. 1B, the insulating cover layer 4 is formed on the insulating base layer 2 so as to cover a part of the conductor pattern 3.

  Subsequently, as shown in FIG. 1C, an adhesive layer 5 is formed on the surface of the base insulating layer 2 opposite to the surface on which the conductor pattern 3 is formed.

  Next, as shown in FIG. 1D, in the region where the insulating cover layer 4 is not formed on the insulating base layer 2, the exposed surface of the insulating base layer 2 penetrates the exposed surface of the adhesive layer 5. A plurality of (four in this embodiment) through-holes 6 are provided.

  Here, in the present embodiment, a metal reinforcing plate made of, for example, aluminum, copper, nickel, or stainless steel is bonded onto the exposed adhesive layer 5. This metal reinforcing plate will be described below.

  FIG. 2 is a schematic view showing a metal reinforcing plate. In addition, in FIG. 2, the example of the some metal reinforcement board by the difference in the preparation methods is shown.

  As shown in FIG. 2A, a plurality of (four in the present embodiment) holes 20a are formed on one surface of the plate-shaped metal reinforcing plate 20.

  A plurality of protrusions 21 are formed by providing each of the four holes 20a with metal pins having the same length. Thereby, the metal reinforcement board 20 which has the some projection part 21 on one surface is produced.

  Moreover, as shown in FIG.2 (b), it press-processes using the predetermined metal mold | die in the several (4 in this Embodiment) predetermined location on the other surface in the plate-shaped metal reinforcement board 20. As shown in FIG. Is performed to form a plurality of protrusions 21a. Thereby, the metal reinforcement board 20 which has the some protrusion part 21a on one surface is produced.

  Further, as shown in FIG. 2 (c), a plurality of (four in the present embodiment) projections are masked at predetermined locations on one surface of the plate-shaped metal reinforcing plate 20, and this mask A plurality of protrusions 21b are formed by performing an etching process on the region excluding the formed region. Thereby, the metal reinforcement board 20 which has the some projection part 21b on one surface is produced.

  In addition to the manufacturing method shown in FIGS. 2 (a) to 2 (c), a metal reinforcing plate having a plurality of protrusions on one surface by a casting method in which molten metal is poured into a predetermined mold and molded. May be produced.

  Next, the metal reinforcing plate 20 manufactured as described above is bonded onto the exposed adhesive layer 5 as described in FIG. 3 below.

  FIG. 3 is a schematic diagram of the printed circuit board according to the present embodiment, which is manufactured by bonding the metal reinforcing plate 20 onto the adhesive layer 5. Note that FIG. 3 illustrates the metal reinforcing plate 20 shown in FIG.

  As shown in FIG. 3, the printed circuit board 100 according to the present embodiment is reinforced with metal reinforcement such that each of the four protrusions 21 of the metal reinforcement plate 20 is inserted into each of the four through holes 6. The plate 20 is produced by being bonded onto the adhesive layer 5. In FIG. 3, illustration of the adhesive layer 5 is omitted.

  Then, the electronic component 10 is mounted on the printed circuit board 100 by connecting the terminals (bumps) 11 made of solder of the electronic component 10 to the conductor pattern 3 exposed to the outside. In this way, the electronic component mounting structure 100A is completed.

  In the present embodiment, the tip of the protrusion 21 of the metal reinforcing plate 20 is in contact with the electronic component 10. Thereby, the heat of the electronic component 10 is conducted to the metal reinforcing plate 20 through the protrusions 21 and is released to the outside. Thereby, the heat dissipation of the electronic component 10 is improved.

  In addition, although the front-end | tip part of the projection part 21 of the metal reinforcement board 20 does not need to contact the electronic component 10, in order to improve thermal conductivity, the front-end | tip part of the projection part 21 is electronic as mentioned above. It is preferably in contact with the part 10. Moreover, the following effects are also produced because the tip of the protrusion 21 is in contact with the electronic component 10.

  That is, the four protrusion heights H in FIG. 3 which are the length from the surface of the insulating base layer 2 exposed to the outside to the tip of the protrusion 21 are the same, and the tip of the protrusion 21 is made to be an electron. By contacting each component 10, the distance between the electronic component 10 and the base insulating layer 2 can be made constant.

  Thereby, unstable fluidity of the solder when the terminal 11 of the electronic component 10 is connected to the conductor pattern 3 is prevented. Thereby, connection reliability is improved.

  Further, if the protrusion height H is too small, the terminals 11 may be short-circuited when the solder is melted. Therefore, the protrusion height H is preferably 0.03 mm to 0.15 mm. The thickness is more preferably 0.05 mm to 0.08 mm.

  Moreover, in this Embodiment, the shape of the projection part 21 is a column shape, for example. The diameter of the protrusion 21 is preferably larger for improving heat dissipation, but if it is too large, the region where the conductor pattern 3 is provided is limited, and therefore it is preferably 0.1 mm to 1 mm.

  In the present embodiment, it is not necessary to provide the adhesive layer 5 if there is no problem with the adhesiveness between the base insulating layer 2 and the metal reinforcing plate 20, and between the base insulating layer 2 and the conductor pattern 3. In addition, an adhesive layer may be provided between the conductor pattern 2 and the insulating cover layer 4.

  In the present embodiment, the base insulating layer 2 corresponds to the first insulating layer, the metal reinforcing plate 20 corresponds to the reinforcing plate, the cover insulating layer 4 corresponds to the second insulating layer, and the terminal 11 is the terminal. It corresponds to the part.

  In this example, the printed circuit board 100 was manufactured based on the above embodiment. In this case, the protruding portion 21a of the metal reinforcing plate 20 was formed by the method shown in FIG.

  Further, the diameter of the protrusion 21a of the metal reinforcing plate 20 was 1.0 mm, and the protrusion height H was 0.05 mm.

  The electronic component mounting structure 100A was manufactured by mounting the electronic component 10 on the printed circuit board 100 manufactured as described above.

  When the manufactured electronic component mounting structure 100A was operated, it was confirmed that the electronic component 10 was efficiently dissipated and the electronic component 10 was operating well.

  The present invention can be used for various electric devices and electronic devices.

It is a schematic diagram which shows the preparation order of the printed circuit board concerning this Embodiment. It is a schematic diagram which shows a metal reinforcement board. It is a schematic diagram of the printed circuit board which concerns on this Embodiment produced by bonding a metal reinforcement board on an adhesive bond layer. It is a figure which shows the structure of the conventional mounting wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Base insulating layer 3 Conductor pattern 4 Cover insulating layer 5 Adhesive layer 6 Through-hole 10 Electronic component 11 Terminal 20 Metal reinforcement board 21,21a, 21b Protrusion part 100 Wiring circuit board 100A Electronic component mounting structure H Protrusion part height

Claims (5)

A printed circuit board on which electronic components are mounted,
A first insulating layer having a plurality of through holes;
A plurality of conductor patterns formed on the first insulating layer,
The plurality of through holes are provided in a region excluding a region where the plurality of conductor patterns on the first insulating layer are formed,
A reinforcing plate having one surface on which a plurality of protrusions are formed;
The plurality of protrusions of the reinforcing plate are respectively inserted into the plurality of through holes so as to protrude outward from the surface of the first insulating layer opposite to the surface on which the conductor pattern is formed. The printed circuit board is characterized in that one surface of the reinforcing plate is bonded to the opposite surface of the first insulating layer. 2. The printed circuit board according to claim 1, wherein the lengths from the respective leading end portions of the plurality of projecting portions protruding to the outside to the surface of the first insulating layer on which the conductor pattern is formed are equal. . The shape of the plurality of protrusions is a cylindrical shape,
3. The printed circuit board according to claim 1, wherein a diameter of the protruding portion having the cylindrical shape is 0.1 mm or more and 1 mm or less. 4. The apparatus according to claim 1, further comprising a second insulating layer formed so as to cover one or more of the plurality of conductor patterns on the first insulating layer. 5. A printed circuit board according to 1. An electronic component comprising a terminal part;
A printed circuit board on which the electronic component is mounted,
The wired circuit board is:
A first insulating layer having a plurality of through holes;
A plurality of conductor patterns formed on the first insulating layer,
The plurality of through holes are provided in a region excluding a region where the plurality of conductor patterns on the first insulating layer are formed,
A reinforcing plate having one surface on which a plurality of protrusions are formed;
The plurality of protrusions of the reinforcing plate are respectively inserted into the plurality of through holes so as to protrude outward from the surface of the first insulating layer opposite to the surface on which the conductor pattern is formed. , One surface of the reinforcing plate is bonded to the opposite surface of the first insulating layer,
The electronic component mounting structure, wherein the terminal portion of the electronic component is connected to one of the plurality of conductor patterns.

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