JP2014033119A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure that may be assembled in a simple process and a small number of components.SOLUTION: A semiconductor device according to this invention includes: a semiconductor module 1 that is resin sealed; a case 4 which forms a shell of the semiconductor module 1; an elastic member 5 held between an inner surface of a case 4 upper surface and an upper surface of the semiconductor module 1; and a heat sink 7 which is fixed closing an opening of a case 4 lower surface. A lower surface of the semiconductor module 1 is pressed to the heat sink 7 through heat conductive grease 6 by a biasing force of the elastic member 5.

Description

  The present invention relates to a semiconductor device for power use.

  In order to improve the reliability of semiconductor devices used for power conversion, sealing resin sealing is progressing in which a semiconductor element included in the semiconductor device and a junction between the semiconductor element and a terminal are sealed with resin. . In addition, since a semiconductor device used for power conversion generates heat during operation, it is generally attached to a heat sink. Further, the semiconductor module is housed in a case in order to protect it from external dust and the like.

  For example, in the semiconductor device described in Patent Document 1, in addition to the heat sink disposed at the lower part of the semiconductor device, the cooling performance is improved by arranging a thermally conductive member at the upper part of the semiconductor module.

  Conventionally, when a semiconductor module is attached to a heat sink, the semiconductor module is first attached to the heat sink by screws or the like, and then the terminals of the semiconductor module and the case in which the bus bar is incorporated are fixed by soldering.

JP 2001-264781 A

  As described above, since the semiconductor module and the case are fixed after the semiconductor module is attached to the heat sink as described above, the conventional semiconductor device has a problem in that the number of assembly steps increases and the assemblability is poor. Further, there are problems that the number of fixing points increases and the number of components increases.

  The present invention has been made to solve the above problems, and an object thereof is to provide a semiconductor device having a structure that can be assembled by a simple process and having a small number of components.

  A semiconductor device according to the present invention includes a resin-sealed semiconductor module, a case that forms an outline of the semiconductor module, an elastic member sandwiched between an inner surface of the upper surface of the case and the upper surface of the semiconductor module, And a heat sink fixed by closing the opening, wherein the lower surface of the semiconductor module is pressed against the heat sink via heat conductive grease by an urging force of an elastic member.

  The semiconductor device according to the present invention has a structure in which when the heat sink is fixed to the case, the elastic member and the semiconductor module sandwiched between the case and the heat sink are also fixed simultaneously. Therefore, since the case, the elastic member, the semiconductor module, and the heat sink can be fixed together, the assembly process can be simplified as compared with the conventional case. Since the number of assembly steps can be reduced as compared with the conventional case, the yield of products is improved.

  In addition, since the number of components necessary for fixing can be reduced, the weight of the semiconductor device can be reduced. In addition, the reduction in the number of components makes it difficult for the durability to deteriorate due to deterioration of the components and the like.

  In addition, since the present invention does not require solder or the like for fixing the case and the semiconductor module, it is possible to reduce the environmental load in manufacturing.

1 is a diagram showing a configuration of a semiconductor device according to a first embodiment. FIG. 4 is a diagram showing a configuration of a semiconductor device according to a second embodiment. FIG. 6 is a cross-sectional view of a semiconductor device according to a third embodiment. FIG. 6 is a cross-sectional view of a semiconductor device according to a fourth embodiment. FIG. 6 is a cross-sectional view of a semiconductor device according to a fifth embodiment. FIG. 10 is a sectional view of a semiconductor device according to a seventh embodiment. FIG. 10 is a cross-sectional view of a semiconductor device according to an eighth embodiment. FIG. 10 is a cross-sectional view of a semiconductor device according to a ninth embodiment. FIG. 16 is a cross-sectional view of a semiconductor device according to a tenth embodiment. FIG. 38 is a cross-sectional view of a semiconductor device according to an eleventh embodiment. FIG. 20 is a cross-sectional view of a semiconductor device according to a twelfth embodiment. 24 is a sectional view of a semiconductor device according to a thirteenth embodiment. FIG. 4 is another example of the semiconductor device according to the first embodiment.

<Embodiment 1>
<Configuration>
1A and 1B are a cross-sectional view and a plan view of a semiconductor device according to the present embodiment, respectively. The resin-sealed semiconductor module 1 is accommodated in a case 4 that forms the outline of the semiconductor module 1. A leaf spring is sandwiched as an elastic member 5 between the inner surface of the upper surface of the case 4 and the upper surface of the semiconductor module 1.

  An opening is formed in the lower surface of the case 4, and a heat sink 7 is fixed to the case 4 so as to close the opening. Further, the lower surface of the semiconductor module 1 is pressed against the heat sink 7 via the heat conductive grease 6 by the urging force of the elastic member 5, that is, the leaf spring.

  The heat sink 7 is fixed to the case 4 with screws 8 from the heat sink 7 side.

  The semiconductor module 1 is configured, for example, by arranging IGBTs and free-wheeling diodes connected in parallel on a predetermined substrate. In high power applications, when these semiconductor elements are required to operate at high speed in a high temperature environment, these materials are preferably GaN or SiC. The semiconductor module 1 is resin-sealed to improve reliability.

  The semiconductor module 1 includes a main terminal 2 and a control terminal 3 connected to the above-described semiconductor element, and these terminals penetrate the case 4 and protrude from the upper surface of the case 4.

  In addition, a plurality of fins, for example, pin fins 7a, may be formed on the lower surface of the heat sink 7 in order to increase the heat dissipation efficiency (FIG. 13).

  A method for assembling the semiconductor device in this embodiment will be described with reference to FIG. The assembly is performed with the upper surface of the case 4 facing down. First, a leaf spring as the elastic member 5 is disposed on the inner surface of the upper surface of the case 4. Next, the semiconductor module 1 is disposed via a leaf spring. Thermal conductive grease 6 is applied to the lower surface of the semiconductor module 1.

  At this time, as shown in FIG. 1 (c), a play space is provided in the vertical direction between the main terminal 2 and the control terminal 3 of the semiconductor module 1 and the case 4, and the play space provides a semiconductor module. 1 can move up and down with respect to the case 4.

  Next, the heat sink 7 is fixed to the case 4 with screws 8 from the heat sink 7 side. By fixing the heat sink 7 to the case 4, the elastic member 5, that is, the leaf spring and the semiconductor module 1 disposed between the case 4 and the heat sink 7 are also fixed at the same time.

  When the heat sink 7 is fixed to the case 4, the semiconductor module 1 is pushed by the heat sink 7, and the elastic member 5 is bent by the above-described play space in the vertical direction. That is, the elastic member 5 is sandwiched between the inner surface of the upper surface of the case 4 and the upper surface of the semiconductor module 1.

  The semiconductor module 1 receives a biasing force according to the amount of deflection of the elastic member 5. With this urging force, the semiconductor module 1 is pressed against the heat sink 7 via the heat conduction grease 6. When the semiconductor module 1 is in close contact with the heat sink 7 via the heat conductive grease 6, the heat generated by the semiconductor module 1 can be efficiently transmitted to the heat sink 7.

  In the present embodiment, the amount of deflection of the elastic member 5, that is, the leaf spring, can be adjusted according to the depth from the opening of the case 4 to the inner surface of the upper surface (hereinafter referred to as the depth of the opening). It is. Therefore, since the amount of deflection of the elastic member 5 is determined according to the depth of the opening of the case 4, it is possible to suppress variation in the urging force of the elastic member 5 for each product.

<Effect>
The semiconductor device according to the present embodiment includes a resin-sealed semiconductor module 1, a case 4 that outlines the semiconductor module 1, and an elastic member that is sandwiched between the inner surface of the upper surface of the case 4 and the upper surface of the semiconductor module 1. 5, that is, a leaf spring and a heat sink 7 fixed by closing the opening on the lower surface of the case 4. It is characterized by being pressed through.

  Therefore, the semiconductor device in the present embodiment has a structure in which when the heat sink 7 is fixed to the case 4, the elastic member 5 and the semiconductor module 1 sandwiched between the case 4 and the heat sink 7 are also fixed simultaneously. Therefore, since the case 4, the elastic member 5, the semiconductor module 1, and the heat sink 7 can be fixed together, the assembly process can be simplified as compared with the conventional case. Since the number of assembly steps can be reduced as compared with the conventional case, the yield of products is improved.

  In addition, since the number of components necessary for fixing can be reduced, the weight of the semiconductor device can be reduced. In addition, the reduction in the number of components makes it difficult for the durability to deteriorate due to deterioration of the components and the like.

  In addition, since the amount of deflection of the elastic member 5 is determined by the depth of the opening of the case 4, it is possible to improve quality by suppressing variations in the urging force of the elastic member 5 on the semiconductor module 1 for each product. is there. Conventionally, the case 4 and the semiconductor module 1 are fixed by solder bonding. However, in the present embodiment, no solder or the like is required for fixing the case 4 and the semiconductor module 1, so that the environmental load in manufacturing is reduced. It is possible to reduce.

  The semiconductor device according to the present embodiment is characterized in that the case 4 is fixed to the heat sink 7 by screwing the case 4 from the heat sink 7 side. Therefore, it is possible to fix the heat sink 7 to the case 4 by screwing.

  In the semiconductor device according to the present embodiment, the elastic member 5 is a leaf spring. Therefore, the semiconductor module 1 can be pressed against the heat sink 7 with uniform pressure.

  In the semiconductor device according to the present embodiment, the heat sink 7 is formed with fins, for example, pin fins 7a. Therefore, it is possible to increase the heat dissipation efficiency.

  In the semiconductor device according to the present embodiment, the semiconductor module 1 includes a semiconductor element made of Si, GaN, or SiC. As described above, since a long life can be expected by reducing the number of parts, even when a semiconductor element made of GaN or SiC is used to operate in a high temperature environment, an improvement in durability can be expected compared to the conventional case. Even when a semiconductor element made of Si is used, it is possible to expect a longer life and a reduction in the number of assembly steps compared to the conventional case.

<Embodiment 2>
FIG. 2A shows a cross-sectional view of the semiconductor device according to the present embodiment. In the present embodiment, a locking claw 4 a having elasticity is formed on the bottom surface of the case 4. The heat sink 7 is fixed to the case 4 by the heat sink 7 being locked by the locking claw 4a. Since other configurations are the same as those of the first embodiment (FIG. 1A), the description thereof is omitted.

  A method for assembling the semiconductor device in this embodiment will be described with reference to FIGS. 2B and 2C. First, as in the first embodiment, the leaf spring 5 and the semiconductor module are sequentially arranged in the case 4 with the upper surface of the case 4 facing down. A heat conductive grease 6 is applied to the lower surface of the semiconductor module 1.

  Next, as shown in FIG. 2B, by pressing the heat sink 7 against the opening on the bottom surface of the case 4, the heat sink 7 spreads the locking claw 4a, and the heat sink 7 is locked to the locking claw 4a. .

  Another attachment method will be described with reference to FIG. FIG. 2C is a bottom view of the case 4 and the heat sink 7. As shown in the drawing, the heat sink 7 is attached while being slid between the case 4 and the locking claw 4a.

<Effect>
In the semiconductor device according to the present embodiment, an elastic locking claw 4 a is formed on the bottom surface of the case 4, and the heat sink 7 is locked to the locking claw 4 a and fixed to the case 4. And

  Therefore, it is possible to obtain the same effect as that of the first embodiment in which the case 4 and the heat sink 7 are fixed by screwing. Furthermore, since the number of parts can be further reduced by not using screws, the weight can be further reduced. Further, since the screwing work is not necessary, the manufacturing process is further simplified.

<Embodiment 3>
FIG. 3 is a cross-sectional view of the semiconductor device according to the present embodiment. In the present embodiment, the elastic member 5 sandwiched between the inner surface of the lower surface of the case 4 and the upper surface of the semiconductor module 1 is any one of urethane rubber, silicon resin, and chloroprene rubber. Since other configurations are the same as those of the first embodiment (FIG. 1A), the description thereof is omitted.

<Effect>
In the semiconductor device according to the present embodiment, the elastic member 5 is made of any one of urethane rubber, silicon resin, and chloroprene rubber. Therefore, even if any of urethane rubber, silicone resin, and chloroprene rubber is used, elasticity can be obtained in the same manner as the leaf spring used in the first embodiment, so that the same effects as those described in the first embodiment can be obtained. It is possible to obtain.

<Embodiment 4>
FIG. 4A shows a cross-sectional view of the semiconductor device in this embodiment. In the first embodiment, a leaf spring is used as the elastic member 5, but in this embodiment, a coiled spring 11 a is used as the elastic member 5. As shown to Fig.4 (a), a uniform pressure can be applied to the semiconductor module 1 by arrange | positioning multiple coiled springs 11a. In addition, if the uniform pressure can be applied to the semiconductor module 1, the number of the coiled springs 11a arranged may be one. Since other configurations are the same as those of the first embodiment (FIG. 1A), the description thereof is omitted.

  As another example of the present embodiment, as shown in FIG. 4B, a disc spring 11b may be used instead of the coiled spring 11a. In FIG. 4B, the two disc springs 11b are overlapped to form an elastic member, but the number and arrangement of the disc springs 11b are not limited to this.

<Effect>
In the semiconductor device according to the present embodiment, the elastic member 5 is a coiled spring 11a or a disc spring 11b. Therefore, even if the coiled spring 11a or the disc spring 11b is used, elasticity similar to that of the leaf spring can be obtained, so that the same effect as that described in the first embodiment can be obtained.

<Embodiment 5>
FIG. 5 is a cross-sectional view of the semiconductor device in this embodiment. In the present embodiment, protrusions 1 a are formed on both sides of the elastic member 5, that is, the leaf spring, on the upper surface of the semiconductor module 1. Since other configurations are the same as those of the first embodiment (FIG. 1A), the description thereof is omitted.

  By forming the protrusions 1a on the upper surface of the semiconductor module 1 as shown in FIG. 5, the position of the elastic member 5 can be prevented from shifting during assembly. Further, the same effect can be obtained by forming similar protrusions on the inner surface of the upper surface of the case 4. Further, if the above-described protrusions 1a are formed on both the upper surface of the semiconductor module 1 and the inner surface of the upper surface of the case 4, it is possible to prevent the position of the elastic member 5 from shifting more reliably.

  When the elastic member 5 is a coiled spring 11a as shown in FIG. 4A, for example, a recess is formed in a portion of the inner surface of the case 4 where the coiled spring is in contact, thereby It is possible to prevent the end of the coiled spring 11a from fitting into the recess and shifting the position of the coiled spring 11a.

<Effect>
The semiconductor device according to the present embodiment is characterized in that irregularities corresponding to the shape of the elastic member 5 are formed on the surface of the case 4 and / or the semiconductor module 1 on which the elastic member 5 abuts.

  Therefore, it is possible to prevent the position of the elastic member from shifting by forming irregularities on the surface of the case 4 and / or the semiconductor module 1 where the elastic member 5 abuts according to the shape of the elastic member 5. . Therefore, assembly with higher accuracy is possible.

<Embodiment 6>
In the present embodiment, solder or a heat conductive adhesive is used in place of the heat conductive grease 6 in the first embodiment (FIG. 1A). Since other configurations are the same as those of the first embodiment, description thereof is omitted.

<Effect>
The semiconductor device according to the present embodiment is characterized in that solder or a heat conductive adhesive is used instead of the heat conductive grease 6 in the first embodiment. Therefore, even when solder or a heat conductive adhesive is used, the heat conduction can be efficiently performed by filling the gap between the semiconductor module 1 and the heat sink 7 as in the case of the heat conductive grease 6. 1 can be obtained.

<Embodiment 7>
FIG. 6A shows a cross-sectional view of the semiconductor device in this embodiment. In the present embodiment, the outer end side of the main terminal 2 of the semiconductor module 1 is exposed along the side surface of the case 4, and a through hole 2 a is formed in the exposed portion.

  Further, a hexagon nut 9 is arranged on the case 4 side adjacent to the through hole 2a. A female thread is formed on the inner surface of the nut 9. In addition, you may form a female screw in the through-hole 2a, without arrange | positioning the hexagon nut 9. FIG. Since other configurations are the same as those of the first embodiment (FIG. 1A), the description thereof is omitted.

  As described above, a through hole 2a is formed in the main terminal 2 of the semiconductor module 1, and a female screw is formed in communication with the through hole 2a itself or the through hole 2a, thereby connecting the main terminal 2 and the terminal of the external device. When connecting, the main terminal 2 and the terminal of the external device can be easily connected by inserting a bolt into the through hole 2a via the terminal of the external device and fastening with a female screw.

  As shown in FIG. 6B, the outer end side of the main terminal 2 is disposed so as to be exposed along the upper surface of the case 4, and the through hole 2a is formed in the exposed portion as in FIG. 6A. Even if the hexagonal nut 9 is disposed adjacent to the through hole 2a, the same effect as in FIG. 6A can be obtained.

<Effect>
In the semiconductor device according to the present embodiment, the predetermined terminal of the semiconductor module 1, that is, the main terminal 2, the outer end side thereof is exposed along the upper surface or the side surface of the case 4, and the exposed portion of the main terminal 2 is exposed. Is characterized in that a through hole 2a is formed and a female screw is formed in communication with the through hole 2a itself or the through hole 2a.

  Therefore, when connecting the main terminal 2 and the terminal of the external device, the bolt is inserted into the through hole 2a via the terminal of the external device, and the bolt is stopped with a female screw. Can be easily connected.

<Eighth embodiment>
FIG. 7 is a cross-sectional view of the semiconductor device in this embodiment. In the present embodiment, the main terminal 2 and the control terminal 3 of the semiconductor module 1 protrude from the side surface of the case 4. Since other configurations are the same as those of the first embodiment (FIG. 1A), description thereof is omitted.

  The semiconductor device according to the present embodiment is characterized in that the terminals of the semiconductor module 1, that is, the main terminal 2 and the control terminal 3 protrude from the side surface of the case 4. Therefore, as in the first embodiment (FIG. 1A), the size of the semiconductor device can be reduced as compared with the case where the terminals, that is, the main terminal 2 and the control terminal 3 protrude from the upper surface of the case 4. .

<Embodiment 9>
FIG. 8 is a cross-sectional view of the semiconductor device in this embodiment. In the present embodiment, the case 4 and the heat sink 7 are fixed by screws 8 as in the first embodiment (FIG. 1A). However, in this embodiment, the case 4 is screwed from the case 4 side. Is different. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  The semiconductor device according to the present embodiment is characterized in that the case 4 is fixed to the heat sink 7 by screwing the heat sink 7 from the case 4 side. Therefore, it is possible to obtain the same effect as that described in the first embodiment.

<Embodiment 10>
FIG. 9 is a cross-sectional view of the semiconductor device in this embodiment. In the present embodiment, a through hole is formed in the upper surface of the case 4 and the semiconductor module 1. In addition, when a leaf | plate spring is arrange | positioned as the elastic member 5 in the position of a through-hole, a through-hole is formed also in the elastic member 5, for example.

  The screw 14 passes through the through hole of the case 4 and the semiconductor module 1 from the case 4 side and is screwed to the heat sink 7. Since other configurations are the same as those of the first embodiment (FIG. 1A), the description thereof is omitted.

<Effect>
In the semiconductor device according to the present embodiment, a through hole is formed in the case 4 and the semiconductor module 1, and the heat sink 7 is screwed through the through hole. Therefore, it is possible to obtain the same effect as in the first embodiment.

<Embodiment 11>
FIG. 10 is a cross-sectional view of the semiconductor device in this embodiment. In the first embodiment (FIG. 1A), the case 4 and the heat sink 7 are fixed by screwing. However, in the present embodiment, the case 4 and the heat sink 7 are fixed by an adhesive at the bonding portion 12. Do. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

<Effect>
In this embodiment, the case 4 is fixed to the heat sink 7 with an adhesive. Therefore, it is possible to obtain the same effect as in the first embodiment. Further, by not using screws for fixing the case 4 and the heat sink 7, the number of components can be reduced as compared with the first embodiment, so that the semiconductor device can be further reduced in weight.

<Embodiment 12>
FIG. 11 is a cross-sectional view of the semiconductor device in this embodiment. In the present embodiment, a metal plate 13 is embedded in the surface of the case 4 that contacts the elastic member 5. Since other configurations are the same as those of the first embodiment (FIG. 1A), the description thereof is omitted.

  The metal plate 13 is an aluminum plate, for example. By embedding the metal plate 13, the rigidity of the portion of the case 4 that contacts the elastic member 5 is increased. Therefore, it is possible to suppress the case 4 from being distorted by the urging force of the elastic member 5.

<Effect>
The semiconductor device according to the present embodiment is characterized in that a metal plate 13 is embedded in a surface of the case 4 that contacts the elastic member 5.

  Therefore, by embedding the metal plate 13, the rigidity of the portion of the case 4 where the elastic member is in contact is increased, so that distortion of the case 4 due to the urging force of the elastic member 5 can be suppressed. Therefore, the biasing force of the elastic member 5 can be transmitted to the semiconductor module 1 with high accuracy.

<Embodiment 13>
FIG. 12 is a cross-sectional view of the semiconductor device in this embodiment. In the present embodiment, a control substrate 10 provided on the upper surface of the case 4 is provided instead of the case 4 with respect to the semiconductor device of the tenth embodiment (FIG. 9). The heat sink 7 is fixed by screwing at the position of the opening in the same manner as in the tenth embodiment instead of closing the opening on the lower surface of the case 4. Since other configurations are the same as those of the tenth embodiment, the description thereof is omitted.

<Effect>
The semiconductor device in the present embodiment is provided with a control substrate 10 provided at a position on the upper surface of the case 4 instead of the case 4 with respect to the semiconductor device in the tenth embodiment, and the heat sink 7 has an opening on the lower surface of the case 4. Instead of closing, the screw is fixed at the position of the opening.

  Therefore, similarly to the tenth embodiment, the control board 10, the elastic member 5, the semiconductor module 1, and the heat sink 7 can be fixed together with the screws 14, so that even when the control board 10 is used instead of the case 4. Thus, the assembly process can be simplified as compared with the conventional case. Product yield is improved by simplifying the assembly process. In addition, since the number of parts required for fixing can be reduced, the weight and life of the semiconductor device can be reduced.

  It should be noted that the present invention can be freely combined with each other within the scope of the invention, and each embodiment can be appropriately modified or omitted.

  DESCRIPTION OF SYMBOLS 1 Semiconductor module, 2 Main terminal, 2a Through hole, 3 Control terminal, 4 Case, 4a Locking claw, 5 Elastic member, 6 Thermal conduction grease, 7 Heat sink, 7a Pin fin, 8,14 Screw, 9 Hexagon nut, 10 Control board, 11a Coiled spring, 11b Belleville spring, 12 Bonding part, 13 Metal plate.

Claims (17)

A resin-sealed semiconductor module;
A case forming an outline of the semiconductor module;
An elastic member sandwiched between the inner surface of the upper surface of the case and the upper surface of the semiconductor module;
A heat sink fixed by closing the opening on the lower surface of the case;
With
The lower surface of the semiconductor module is pressed against the heat sink via heat conductive grease by an urging force of the elastic member.
Semiconductor device. The case is fixed to the heat sink by screwing the case from the heat sink side,
The semiconductor device according to claim 1. A locking claw having elasticity is formed on the bottom surface of the case,
The heat sink is locked to the locking claw and fixed to the case.
The semiconductor device according to claim 1. The elastic member is a leaf spring,
The semiconductor device according to claim 1. The elastic member is made of any one of urethane rubber, silicone resin, and chloroprene rubber.
The semiconductor device according to claim 1. The elastic member is a coiled spring or a disc spring,
The semiconductor device according to claim 1. The surface of the case and / or the semiconductor module on which the elastic member abuts is formed with irregularities corresponding to the shape of the elastic member,
The semiconductor device according to claim 1. Instead of the heat conductive grease, using solder or heat conductive adhesive,
The semiconductor device according to claim 1. The predetermined terminal of the semiconductor module has its outer end exposed along the upper surface or side surface of the case,
A through hole is formed in the exposed portion of the terminal,
The internal thread is formed in communication with the through hole itself or the through hole,
The semiconductor device according to claim 1. The terminal of the semiconductor module protrudes from the side surface of the case,
The semiconductor device according to claim 1. The case is fixed to the heat sink by screwing the heat sink from the case side,
The semiconductor device according to claim 1. Through holes are formed in the case and the semiconductor module, and a heat sink is screwed through the through holes.
The semiconductor device according to claim 11. The case is fixed to the heat sink with an adhesive,
The semiconductor device according to claim 1. A metal plate is embedded in the surface of the case that contacts the elastic member,
The semiconductor device according to claim 1. In place of the case, provided with a control board provided at the position of the upper surface of the case,
The heat sink is fixed by screwing at the position of the opening instead of closing the opening on the lower surface of the case.
The semiconductor device according to claim 12. The heat sink is formed with fins,
The semiconductor device according to claim 1. The semiconductor module includes a semiconductor element made of Si, GaN, or SiC.
The semiconductor device according to claim 1.

Images