JPS62104449U - - Google Patents
Info
- Publication number
- JPS62104449U JPS62104449U JP19671285U JP19671285U JPS62104449U JP S62104449 U JPS62104449 U JP S62104449U JP 19671285 U JP19671285 U JP 19671285U JP 19671285 U JP19671285 U JP 19671285U JP S62104449 U JPS62104449 U JP S62104449U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- rivet
- eyelet
- metal plate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図および第２図は、それぞれ本考案の一実
施例の半導体装置および他の実施例の半導体装置
を放熱金属板に実装した状態を示す断面図、第３
図は従来の半導体装置を放熱金属板に実装した状
態を示す断面図である。
１……樹脂封止体、２……取付け貫通穴、３，
４……座ぐり穴、５……リード端子、６……シリ
コングリース、７……皿ばね、８……リベツト、
１０……放熱金属板。
1 and 2 are cross-sectional views showing a state in which a semiconductor device according to one embodiment of the present invention and a semiconductor device according to another embodiment are mounted on a heat dissipation metal plate, respectively, and FIG.
The figure is a sectional view showing a state in which a conventional semiconductor device is mounted on a heat dissipating metal plate. 1...Resin sealing body, 2...Mounting through hole, 3,
4... Counterbore hole, 5... Lead terminal, 6... Silicone grease, 7... Belleville spring, 8... Rivet,
10... Heat dissipation metal plate.
Claims (1)
樹脂封止型半導体装置において、前記樹脂封止体
には金属板に取付けるためのリベツトまたは鳩目
が挿入される貫通穴を有し、さらに、前記貫通穴
の前記取付け金属板に面する反対側の開口部には
前記リベツト軸または鳩目軸と組合せる皿ばね、
またはコイルばねの外径が丁度はまり、かつ、前
記リベツトまたは鳩目の頭が引かかる座ぐり穴が
あけられていることを特徴とする樹脂封止型半導
体装置。 In a resin-sealed semiconductor device in which a semiconductor chip is packaged with resin, the resin-sealed body has a through hole into which a rivet or eyelet for attachment to a metal plate is inserted; A disc spring to be combined with the rivet shaft or eyelet shaft is provided in the opening on the opposite side of the hole facing the mounting metal plate;
Alternatively, a resin-sealed semiconductor device characterized in that a counterbore is bored into which the outer diameter of the coil spring fits, and into which the head of the rivet or eyelet is caught.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19671285U JPS62104449U (en) | 1985-12-20 | 1985-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19671285U JPS62104449U (en) | 1985-12-20 | 1985-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62104449U true JPS62104449U (en) | 1987-07-03 |
Family
ID=31155786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19671285U Pending JPS62104449U (en) | 1985-12-20 | 1985-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104449U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013219244A (en) * | 2012-04-10 | 2013-10-24 | Mitsubishi Electric Corp | Fixing method of semiconductor module of semiconductor device |
| JP2013225556A (en) * | 2012-04-20 | 2013-10-31 | Mitsubishi Electric Corp | Semiconductor device and manufacturing method therefor |
| JP2014033119A (en) * | 2012-08-06 | 2014-02-20 | Mitsubishi Electric Corp | Semiconductor device |
| JP2016162992A (en) * | 2015-03-05 | 2016-09-05 | 三菱電機株式会社 | Power semiconductor device |
-
1985
- 1985-12-20 JP JP19671285U patent/JPS62104449U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013219244A (en) * | 2012-04-10 | 2013-10-24 | Mitsubishi Electric Corp | Fixing method of semiconductor module of semiconductor device |
| JP2013225556A (en) * | 2012-04-20 | 2013-10-31 | Mitsubishi Electric Corp | Semiconductor device and manufacturing method therefor |
| JP2014033119A (en) * | 2012-08-06 | 2014-02-20 | Mitsubishi Electric Corp | Semiconductor device |
| JP2016162992A (en) * | 2015-03-05 | 2016-09-05 | 三菱電機株式会社 | Power semiconductor device |
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